Stretchable Interconnects Research Articles

Theoretical and numerical analysis on buckling instability in a thin film sandwiched between two finite-thickness substrates under in-plane compression

Capturing the buckling instability mechanics of multi-layered film/substrate structures is essential for providing theoretical guidelines for designing flexible electronics (e.g., stretchable interconnects and strain-limiting structures) and understanding the morphogenesis in biology and geology. Previous buckling models of tri-layer substrate/film/substrate structures usually assumed infinite substrate thickness and incomplete forms of interfacial shear stress, failing to distinguish between local wrinkling and global buckling. In this work, we extend our previous model (Yuan et al., 2023) by accounting for both finite substrate thickness and a complete form of interfacial shear stress, without assuming uniform membrane strain in the film, to study the buckling instability of tri-layer structures. The local wrinkling versus global buckling is distinguished through energy analysis, yielding phase diagrams for a wide range of geometric parameters and material properties. The effects of finite substrate thickness and moduli on the critical compressive strain and wavelength for the onset of local wrinkling are thoroughly investigated. The high accuracy of current model is demonstrated by the excellent agreement between analytical predictions and finite element analysis. This study provides new insights into the stability analysis of substrate/film/substrate systems, and will aid in the design of flexible electronics.

Materials, Structure, and Interface of Stretchable Interconnects for Wearable Bioelectronics.

Since wearable technologies for telemedicine have emerged to tackle global health concerns, the demand for well-attested wearable healthcare devices with high user comfort also arises. Skin-wearables for health monitoring require mechanical flexibility and stretchability for not only high compatibility with the skin's dynamic nature but also a robust collection of fine health signals from within. Stretchable electrical interconnects, which determine the device's overall integrity, are one of the fundamental units being understated in wearable bioelectronics. In this review, a broad class of materials and engineering methodologies recently researched and developed are presented, and their respective attributes, limitations, and opportunities in designing stretchable interconnects for wearable bioelectronics are offered. Specifically, the electrical and mechanical characteristics of various materials (metals, polymers, carbons, and their composites) are highlighted, along with their compatibility with diverse geometric configurations. Detailed insights into fabrication techniques that are compatible with soft substrates are also provided. Importantly, successful examples of establishing reliable interfacial connections between soft and rigid elements using novel interconnects are reviewed. Lastly, some perspectives and prospects of remaining research challenges and potential pathways for practical utilization of interconnects in wearables are laid out.

Stretchable Electrodes for Interconnects in Soft Electronics.

Soft electronics have significantly enhanced user convenience and data accuracy in wearable devices, implantable devices, and human-machine interfaces. However, a persistent challenge in their development has been the disconnection between the rigid and soft components of devices due to the substantial difference in modulus and stretchability. To address this issue, establishing a durable and flexible connection that smoothly links components of varying stiffness to signal-capturing sections with a lower stiffness is essential. In this study, we developed a novel stretchable interconnect that strongly adheres to various materials, facilitating electrical connections effortlessly by applying minimal finger pressure. Capable of stretching up to 1000% while maintaining electrical integrity, this interconnect proves its applicability across multiple domains, including electrocardiogram (ECG), electromyography (EMG), and stretchable light-emitting diode (LED) circuits. Its versatility is further demonstrated through its compatibility with various manufacturing techniques such as 3D printing, painting, and spin coating, highlighting its adaptability in soft electronics.

Mechanically anisotropic stretchable and transparent composite substrates for distortion-free display

Developing new-form factor devices has led to the creation of foldable and rollable displays. However, next-step stretchable devices with shape changes face a new issue different from conventional displays. When the screen is stretched, screen distortion occurs due to the nature of contraction perpendicular to the stretching direction to preserve the volume. To address this issue, we focused on the composite approach with mechanical anisotropy using continuously aligned fiber fillers. In this study, we fabricated transparent mechanically anisotropic stretchable substrates with near-zero Poisson's ratio by incorporating continuous and aligned transparent ribbon arrays within a transparent, stretchable matrix. The aligned ribbon-reinforced composite substrates have mechanical anisotropy by mainly reinforcing stiffness only in the ribbon-aligned direction. When unidirectional stretchable devices in the direction perpendicular to the alignment are developed, the stiffness of the substrate contracting in the ribbon alignment direction is relatively high compared to the vertical direction, and thus the vertical displacement is diminishing, so substrates with Poisson's ratio close to 0 can be realized. Based on this approach, we realized a light-emitting device (LED) array system with near-zero vertical distortion by attaching LED arrays and printed intrinsically stretchable interconnections on our mechanically anisotropic composite substrate.

Towards seamless conformable and comfortable wearable electronics: Polyimide-supported dry electrodes integrated in knitted fabrics

Wearable electronics contribute directly to advancing numerous biomedical devices in contract with the human body. These electronic devices have been transformed from rigid and bulky into soft and flexible. Conformable electronics is actively pursued in the literature to comply with the curvilinear surface of the skin. To increase the adoption rate, seamless comfortable operation is necessary, which requires more focus on convenient materials such as textiles, compared to elastomer-based technologies. This study demonstrates mechanically reliable stretchable interconnects embedded within textile to achieve both conformability and comfort. Electromyography (EMG) signals provide invaluable information about body motion analysis, muscle nerve and fatigue disorders. Non-invasive surface EMG is the preferred method of measurement since it can be conducted with minimal risk to the subject. In this study, polyimide-supported dry electrodes are integrated in knitted fabrics using a special knit pattern to ensure achieving higher contact surface area with the human skin. The received EMG signals are benchmarked against standard wet electrodes in time and frequency domain, revealing comparable performance. The presented technology exhibits extremely high mechanical reliability, withstanding up to 10,000 cyclic elongations at 60 % strain. The integration strategy is sufficiently strong and durable, retaining its electrical properties after 20 standard washing cycles. The findings indicate that the presented technology holds significant promise towards real-world implementation of seamless, conformable, and comfortable wearable electronics.

Stretchable electronic strips for electronic textiles enabled by 3D helical structure

The development of stretchable electronic devices is a critical area of research for wearable electronics, particularly electronic textiles (e-textiles), where electronic devices embedded in clothing need to stretch and bend with the body. While stretchable electronics technologies exist, none have been widely adopted. This work presents a novel and potentially transformative approach to stretchable electronics using a ubiquitous structure: the helix. A strip of flexible circuitry (‘e-strip’) is twisted to form a helical ribbon, transforming it from flexible to stretchable. A stretchable core—in this case rubber cord—supports the structure, preventing damage from buckling. Existing helical electronics have only extended to stretchable interconnects between circuit modules, and individual components such as printed helical transistors. Fully stretchable circuits have, until now, only been produced in planar form: flat circuits, either using curved geometry to enable them to stretch, or using inherently stretchable elastomer substrates. Helical e-strips can bend along multiple axes, and repeatedly stretch between 30 and 50%, depending on core material and diameter. LED and temperature sensing helical e-strips are demonstrated, along with design rules for helical e-strip fabrication. Widely available materials and standard fabrication processes were prioritized to maximize scalability and accessibility.

Mechanically programmable substrate enable highly stretchable solar cell arrays for self-powered electronic skin

Development of stretchable solar cells to accommodate large strain without sacrificing the power conversion efficiency is challenging. This study presents a novel approach to manufacture highly stretchable solar cell arrays, which can be integrated into wearable medical devices to operate under challenging environments. Overcoming the limitations of rigid metal wires, liquid metal wires are employed to connect single crystal silicon solar cells, ensuring both high conversion efficiency and exceptional stretchability (up to 100%). The manufacturing process introduces embedding electrospinning films into elastic silicone substrates to create a tight bond between rigid solar cells and stretchable substrates with programmable strain capabilities. Notably, a stretchable interconnect wire is efficiently fabricated using the semi-liquid metal template printing technique and demonstrates remarkable conductivity (up to 6 × 106 S/m). Individual structural unit of solar cell presents an impressive tensile rate of 200%, and endures up to 5000 cycles of tensile testing. The overall solar cell array exhibits outstanding adaptability to extensive bending and twisting, with a mere 0.1% short-circuit current reduction in its maximum stretched state. The stretchable photovoltaic device is successfully employed in creating self-powered electronic skin for continuous real-time monitoring of parameters, showcasing its valuable potential in wearable medical electronic devices and comprehensive sports health monitoring.

Reversibly stable and highly stretchable transparent polymer nanocomposite adhesives using hierarchical spring-like molecular nanobridges

For the development of stretchable optoelectronic devices, optically transparent composite adhesives should afford reversible stretchability and high optical transmittance as well as strong interfacial adhesion. However, simultaneous achievement of these essential prerequisites for advanced stretchable optical composite adhesives remains challenging. Herein, we offer an unprecedented approach for the fabrication of reversibly stretchable and optically transparent polymer nanocomposite adhesives based on the construction of hierarchical elastic molecular nanobridges between rigid-flexible hybrid nanoparticles and matrix resin. Photoreactive flexible poly(propylene glycol) (meth)acrylate chains were chemically combined with a rigid nano-silica core to form rigid and flexible hybrid nanoparticles. Subsequently, multiple elastic molecular nanobridges between the embedded hybrid nanoparticles and acrylate resin matrix were constructed inside the polymer composite through UV curing, which results in a stretchable interconnection that allows efficient repeated stretching and recovery of stretchable polymer nanocomposite adhesives. The newly fabricated nanocomposite adhesive film with a low content of rigid-flexible hybrid nanoparticles afforded an excellent reversible stretchability and outstanding cyclic elastic durability, and simultaneously maintained high optical transparency (95.1%) and interfacial adhesion strength (21.5 N/25 mm) of the film compared to those of conventional optical adhesive film.

Development of a Stretchable and Removable Electrical Interconnection Solution for Ultra-Thin Electronic Components

Currently, the solutions for interconnecting electronic components with their active face facing on substrates are based on metallic soldering. The mechanical contacts are therefore rigid. In order to enhance the reliability of the bonding, underfill is usually used to redistribute the thermo-mechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and substrate. Underfill is done with epoxy resins containing silica fillers (SiO2). As a result, the removal of components is no longer possible. Moreover, this solution is not suitable for devices integrating ultra-thin silicon components (<100 μm) hybridized on flexible substrates that may be subject to deformation. This is the case, for example, of medical “patches” worn on the person and continuously solicited. Indeed, the rigid contact points are likely to break. To address this issue, we are developing a thin anisotropic conductive and stretchable adhesive film inspired by the adhesion of the gecko. Thanks to the microstructuration of its toes involving about 1 million setae, the gecko can develop a large contact surface and thus a large force of attraction by the multiplication of van der Waals interactions. In this work, this “dry adhesion” based on the principle of “contact splitting”, was implemented in order to improve the adhesion of a flexible interconnection. For this purpose, the surface of a polydimethylsiloxane (PDMS) film was structured with micrometric mushroom-shaped patterns known to be the most efficient form of contact. To this end, silicon molds with varying mushroom geometries were used to shape the PDMS (with different cap and pillar diameters) and the adhesion force microstructured films were assessed (shear and pull-off experiments). To make these films locally conductive through the thickness, a conductive composite was prepared and locally deposited in the mold. One approach we investigated, was using a screen-printing mask. This approach has been implemented and characterized using electrical tests (I-V measurements) in order to select the most suitable films to make a flexible interconnection.

Flexible Multimodal Sensing System Based on a Vertical Stacking Strategy for Efficiently Decoupling Multiple Signals.

Multisensory integration enables the simultaneous perception of multiple environmental stimuli while minimizing size and energy consumption. However, conventional multifunctional integration in flexible electronics typically requires large-scale horizontal sensing arrays (such as flexible printed circuit boards), posing decoupling complexities, tensile strain limitation, and spatial constraints. Herein, a fully flexible multimodal sensing system (FMSS) is developed by coupling biomimetic stretchable conductive films (BSCFs) and strain-insensitive communication interfaces using a vertical stacking integration strategy. The FMSS achieves vertical integration without additional adhesives, and it can incorporate individual sensing layers and stretchable interconnects without any essential constraint on their deformations. Accordingly, the temperature and pressure are precisely decoupled simultaneously, and tensile stress can be accurately discerned in different directions. This vertical stacking integration strategy is expected to offer a new approach to significantly streamline the design and fabrication of multimodal sensing systems and enhance their decoupling capabilities.

A Gradient Stiffness-Programmed Circuit Board by Spatially Controlled Phase-Transition of Supercooled Hydrogel for Stretchable Electronics Integration.

Due to emerging demands in soft electronics, there is an increasing need for material architectures that support robust interfacing between soft substrates, stretchable electrical interconnects, and embedded rigid microelectronics chips. Though researchers have adopted rigid-island structures to solve the issue, this approach merely shifts stress concentrations from chip-conductor interfaces to rigid-island-soft region interfaces in the substrate. Here, a gradient stiffness-programmed circuit board (GS-PCB) that possesses high stretchability and stability with surface mounted chips is introduced. The board comprises a stiffness-programmed hydrogel substrate and a laser-patterned liquid metal conductor. The hydrogel simultaneously obtains a large stiffness disparity and robust interfaces between rigid-islands and soft regions. These seemingly contradictory conditions are accomplished by adopting a gradient stiffness structure at the interfaces, enabled by combining polymers with different interaction energies and a supercooled sodium acetate solution. By integrating the gel with laser-patterned liquid metal with exceptional properties, GS-PCB exhibits higher electromechanical stability than other rigid-island research. To highlight the practicality of this approach, a finger-sensor device that successfully distinguishes objects by direct physical contact is fabricated, demonstrating its stability under various mechanical disturbances.

Design and Fabrication of Stretchable Microwave Transmission Lines Based on a Quasi-Microstrip Structure.

Radio frequency (RF) electronics are vital components of stretchable electronics that require wireless capabilities, ranging from skin-interfaced wearable systems to implantable devices to soft robotics. One of the key challenges in stretchable electronics is achieving near-lossless transmission line technology that can carry high-frequency electrical signals between various RF components. Almost all existing stretchable interconnection strategies only demonstrate direct current or low-frequency electrical properties, limiting their use in high frequencies, especially in the MHz to GHz range. Here, we describe the design and fabrication of a simple stretchable RF transmission line strategy that integrates a quasi-microstrip structure into a stretchable serpentine microscale interconnection. We show the effects of quasi-microstrip structural dimensions on the RF performance based on detailed quantitative analysis and experimentally demonstrate the optimized device capable of carrying RF signals with frequencies of up to 40 GHz with near-lossless characteristics. To show the potential application of our transmission line in stretchable microwave electronics, we designed a single-stage power amplifier system with a gain of 9.8 dB at 9 GHz that fully utilizes our quasi-microstrip transmission line technology.

Stretchable and Lithography-Compatible Interconnects Enabled by Self-Assembled Nanofilms with Interlocking Interfaces.

Stretchable interconnects with miniature widths are vital for the high-density integration of deformable electronic components on a single substrate for targeted data logic or storage functions. However, it is still challenging to attain high-resolution patternability of stretchable conductors with robust circuit fabrication capability. Here, we report a self-assembled silver nanofilm firmly interlocked by an elastomeric nanodielectric that can be photolithographically patterned into microscale features while preserving high stretchability and conductivity. Both silver and dielectric nanofilms are fabricated by layer-by-layer assembly, ensuring wafer-scale uniformity and meticulous control of thicknesses. Without any thermal annealing, the as-fabricated nanofilms from silver nanoparticles (AgNPs) exhibit conductivity of 1.54 × 106 S m-1 and stretchability of ∼200%, which is due to the impeded crack propagation by the underlying PU nanodielectrics. Furthermore, it is revealed that AgNP microstrips defined by photolithography show higher stretchability when their widths are downscaled to 100 μm owing to confined cracks. However, further scaling restricts the stretchability, following the early development of cracks cutting across the strip. In addition, the resistance change of these silver interconnects can be decreased using serpentine architectures. As a demonstration, these self-assembled interconnects are used as stretchable circuit boards to power LEDs.

Lightweight Soft Conductive Composites Embedded with Liquid Metal Fiber Networks

AbstractLiquid metal composites are promising soft conductors for applications in soft electronics, sensors, and soft robotics. Existing liquid metal composites usually have a high‐volume fraction of liquid metal, which not only increases the density but also the material cost. Future applications in soft electronics and robotics highly demand liquid metal composites with low density and high conductivity for large‐scale, low‐cost, lightweight, and more sustainable applications. In this work, lightweight and highly conductive composites embedded with liquid metal fiber networks are synthesized. This new paradigm of liquid metal composites consists of an interconnected liquid metal fiber network embedded in a compliant rubber matrix. The liquid metal fiber network serves as an ultra‐lightweight conductive pathway for electrons. Experiments indicate that this soft conductive composite also possesses nearly strain‐insensitive conductance and superior cyclic stability. Potential applications of the composite films as stretchable interconnects, electrodes, and sensors are demonstrated.

Highly Stretchable and Patternable Conductive Elastomer Composites Based on Direct Cut‐Patterning Technique for Stretchable Circuit Board Applications

Stretchable interconnects, essential to the versatility of stretchable circuit boards (SCBs) in the emerging field of wearable electronic systems, are commonly made from conductive elastomer composites. However, the simultaneous realization of exceptional performance and a simple and reproducible fabrication has proven to be a challenge. In this study, high‐performance stretchable interconnects are introduced. These interconnects, constructed from highly patternable conductive composites, are produced using a straightforward, reproducible, and potentially scalable method termed as direct cut‐patterning (DCP). The DCP process enables the creation of distinctive conductive composite patterns and SCBs in a customizable manner, achieving a minimum feature size of 200 µm. The unique architecture of the proposed stretchable interconnects, featuring a fully embedded meander‐patterned composite conductor with periodic secondary cuts, enables the device to endure stretches exceeding 300%, while displaying a minimal gauge factor of ≈0.19 at 100% strain. Importantly, it fully reverts to its original form upon release. The proposed DCP‐based SCB approach is successfully applied in designing a highly stretchable and stable single‐layer light‐emitting diode array circuit, showcasing its potential for use in stretchable display panels.

Ultra-stable, waterproof and self-healing serpentine stretchable conductors based on WPU sheath-wrapped conductive yarn for stretchable interconnects and wearable heaters

Stretchable conductors (SCs) have shown promising potential in the field of stretchable electronic devices for their lightweight, high flexibility, stable performance, and easy integration. However, the conductivity of most reported stretchable conductive composites is sensitive to deformation, and it is still unsatisfactory due to their poor recoverability and low reliability under large strain. In this paper, we have fabricated a serpentine stretchable conductor (SSC) with high conductivity, stretchability, and ultra-stability by spontaneously wrapping elastic waterborne polyurethane (WPU) sheath on the surface of the multi-walled carbon nanotube (MWCNT)/WPU nanocomposite conductive yarn, which was prepared by a simple wet-spinning method. The WPU elastic sheath endows SSC with long-term tensile durability and recoverability. Remarkably, benefiting from the sharing effect of the serpentine structure on the tensile strain energy, SSC shows distinctive strain-insensitive behavior (ΔR/R0 less than 1.6%) up to 100% strain and ultra-high quality factor (Q = 105) at 80% strain. Furthermore, SSC also has temperature resistance, waterproof ability, and self-healing capability, making it capable of being used in harsh circumstances. The combination of high conductivity, stretchability, and super reliability renders many potential applications for SSC, such as stretchable interconnects and wearable heaters. Such serpentine stretchable device with distinctive strain-insensitive behavior provides a novel design idea for stretchy electronics.

A Sewing Approach to the Fabrication of Eco/bioresorbable Electronics.

Eco/bioresorbable electronics represent an emerging class of technology defined by an ability to dissolve or otherwise harmlessly disappear in environmental or biological surroundings after a period of stable operation. The resulting devices provide unique capabilities as temporary biomedical implants, environmental sensors, and related systems. Recent publications report schemes to overcome challenges in fabrication that follow from the low thermostability and/or high chemical reactivity of the eco/bioresorbable constituent materials. Here, this work reports the use of high-speed sewing machines, as the basis for a high-throughput manufacturing technique that addresses many requirements for these applications, without the need for high temperatures or reactive solvents. Results demonstrate that a range of eco/bioresorbable metal wires and polymer threads can be embroidered into complex, user-defined conductive patterns on eco/bioresorbable substrates. Functional electronic components, such as stretchable interconnects and antennas are possible, along with fully integrated systems. Examples of the latter include wirelessly powered light-emitting diodes, radiofrequency identification tags, and temporary cardiac pacemakers. These advances add to a growing range of options in high-throughput, automated fabrication of eco/bioresorbable electronics.

Design and Fabrication of Metallic-Conductive Polymer-Based Hybrid Film Interconnections for Stretchable Electronic Devices

Stretchable circuit is a technological innovation that has transformed the microelectronic landscape due to its enormous applications in the field of medicine. The consistency or durability of health monitoring devices can increase the dependability with which non-invasive clinical measures are collected. Metal–conductive polymer (CP) hybrid interconnects and metal–polyimide dual-layered interconnects were all produced as stretchable interconnections. Stretchable substrate for all of the interconnects was selected as soft elastomer polydimethylsiloxane (PDMS). However, the PDMS substrate presents challenges because it is temperature sensitive, limiting the process temperature. The extreme hydrophobic nature of the PDMS surface makes it difficult to deposit components that contain water and results in poor adhesion with different metals. Following the development of processes for fabricating materials on the PDMS substrate, methods for resolving these issues were investigated.

3‐1: Distinguished Paper: High‐Resolution Active‐Matrix Micro‐LED Stretchable Displays

We have developed 12‐inch 100 PPI active‐matrix micro‐LED stretchable displays that can be stretched up to 20%. Our work has involved the development of key technologies such as stretchable interconnect, stretchable film, micro‐LED, and the integration process for these components. The stretchable displays exhibited various types of deformations, suggesting the potential for new applications in information display.

Nanowires-Based Stretchable Strain Sensor for Wearable Applications

Flexible, stretchable strain sensors are needed to measure physiological parameters or joint angles in wearable systems and robotics, respectively. This letter presents the stretchable strain sensor that is directly fabricated on environment-friendly Ecoflux substrate. The sensor uses stretchable serpentine-shaped Au interconnects and Ag nanowires (NWs) as the strain-sensitive active channel. The sensor structure has been evaluated under stretching conditions that provided insights about the material integrity during device operation. The device characteristics show good linearity under low strain range (<40%), average gauge factor of 5.8, cyclic stability for more than 5000 cycles, and response time of 200 ms. Finally, the sensor was placed on human finger, as a proof of concept, and measurements were taken to understand the bending strain during finger movements and potential application in smart glove and robotics.