This work demonstrates and describes for the first time an unusual strain-relaxation mechanism by the formation and self-assembly of well-ordered tin wires during the thermal annealing of epitaxial Ge0.83Sn0.17-on-Ge(001) substrate. Fully strained germanium-tin alloys (Ge0.83Sn0.17) were epitaxially grown on Ge(001) substrate by molecular beam epitaxy. The morphological and compositional evolution of Ge0.83Sn0.17 during thermal annealing is studied by atomic force microscopy, X-ray diffraction, transmission electron microscopy. Under certain annealing conditions, the Ge0.83Sn0.17 layer decomposes into two stable phases, and well-defined Sn wires that are preferentially oriented along two orthogonal ⟨100⟩ azimuths are formed. The formation of the Sn wires is related to the annealing temperature and the Ge0.83Sn0.17 thickness, and can be explained by the nucleation of a grain with Sn islands on the outer front, followed by grain boundary migration. The Sn wire formation process is found to be thermally activated, and an activation enthalpy (Ec) of 0.41 eV is extracted. This thermally activated phase transformation, i.e., 2D epitaxial layer to 3D wires, occurs via a mechanism akin to “cellular precipitation.” This synthesis route of Sn wires opens new possibilities for creation of nanoscale patterns at high-throughput without the need for lithography.