Stencil Membrane Research Articles

Nanobridge Stencil Enabling High Resolution Arbitrarily Shaped Metallic Thin Films on Various Substrates

AbstractStencil lithography (SL), which uses a perforated membrane as a reusable shadow mask to locally add material patterns on substrates provides a simple but versatile approach for the fabrication of functional devices on a large variety of substrate materials by physical vapor deposition (PVD). Mechanical stress induced by the accumulation of condensed material on the thin stencil membrane during the PVD step leads to stencil bending and breaking, therefore, suspended stencil membranes with arbitrary openings are, in practice, not possible. Here, a new approach to remedy this limitation is reported by introducing auxiliary bridges in stencils. These bridges prevent the suspended membrane from bending out of plane, thereby enabling aperture openings to have almost arbitrary geometry. These bridges are sufficiently narrow so that they do not entirely block the material deposition by PVD and thus create a continuous material pattern by taking advantage of the blurring effect. The successful metal deposition through the designed nanobridge stencil on a wide range of substrate materials underlines the usability and the versatility of the proposed stencil design. The work presented here provides a versatile fabrication method to produce arbitrarily shaped metal patterns that were previously impossible due to the topological constraints of nanostencils.

PDMS 마이크로 스텐실이 내재된 세포공동배양 미세유체 장치 제작

In this paper, a microfluidic co-culture system comprising an embedded polydimethylsiloxane (PDMS) microstencil was fabricated. The fabricated co-culture system has two micro-channels separated with a PDMS microstencil membrane. Master molds for microchannels and stencil membranes were fabricated by photolithography, then used for casting of PDMS devices. The stencil membrane was 10 thick, with holes 10-μm large in diameter. The fabricated system co-cultured two types of cells (HepG2, NIH-3T3 Cells) successfully for seven days. The viability and stability of the cells were verified through LIVE/DEAD® staining and analysis. Additionally, albumin secretion of HepG2 cells was measured for seven days, using an HSA ELISA kit. The measured data were analyzed, to compare the activity of HepG2 cells. Results confirmed that cells can be co-cultured in the fabricated microfluidic system.

Fabrication of polymeric dual-scale nanoimprint molds using a polymer stencil membrane

We report on a simple and effective process that allows fabricating polymeric dual-scale nanoimprinting molds. The key for the process is the use of a thin flexible SU-8 stencil membrane, which was fabricated by either photolithography or thermal nanoimprint lithography (NIL). The stencil membrane with microscale pores was assembled into a nanopatterned substrate, producing a dual-scale structure. The assembled structure was used as a template to produce polymeric imprinting molds via UV-NIL. With this method, we demonstrated dual-scale nanoimprint molds having nano-pillars of 251 nm diameter and 146 nm high on top of microscale square protrusions of 5 μm wide and 3.6 μm high. The resin mold with the dual-scale structure was successfully used to produce a freestanding membrane with dual-scale perforated pores via UV-NIL. After metal coating and integrated into microfluidic devices, this freestanding membrane can potentially be used as a substrate for surface plasmon resonance sensors.

Assessing the manufacturing tolerances and uniformity of CMOS compatible metamaterial fabrication

The manufacturing tolerances of a stencil-lithography variant, membrane projection lithography, were investigated. In the first part of this work, electron beam lithography was used to create stencils with a range of linewidths. These patterns were transferred into the stencil membrane and used to pattern metallic lines on vertical silicon faces. Only the largest lines, with a nominal width of 84 nm, were resolved, resulting in 45 ± 10 nm (average ± standard deviation) as deposited with 135-nm spacing. Although written in the e-beam write software file as 84-nm in width, the lines exhibited linewidth bias. This can largely be attributed to nonvertical sidewalls inherent to dry etching techniques that cause proportionally larger impact with decreasing feature size. The line edge roughness can be significantly attributed to the grain structure of the aluminum nitride stencil membrane. In the second part of this work, the spatial uniformity of optically defined (as opposed to e-beam written) metamaterial structures over large areas was assessed. A Fourier transform infrared spectrometer microscope was used to collect the reflection spectra of samples with optically defined vertical split ring from 25 spatially resolved 300 × 300 μm regions in a 1-cm2 area. The technique is shown to provide a qualitative measure of the uniformity of the inclusions.

Compliant membranes improve resolution in full-wafer micro/nanostencil lithography

This work reports on a considerable resolution improvement of micro/nanostencil lithography when applied on full-wafer scale by using compliant membranes to reduce gap-induced pattern blurring. Silicon nitride (SiN) membranes are mechanically decoupled from a rigid silicon (Si) frame by means of four compliant, protruding cantilevers. When pressing the stencil into contact with a surface to be patterned, the membranes thus adapt to the surface independently and reduce the gap between the membrane and the substrate even over large, uneven surfaces. Finite element modeling (FEM) simulations show that compliant membranes can deflect vertically 40 μm which is a typical maximal non-planarity observed in standard Si wafers, due to polishing. Microapertures in the stencil membrane are defined by UV lithography and nanoapertures, down to 200 nm in diameter, using focused ion beam (FIB). A thin aluminium (Al) layer is deposited through both compliant and non-compliant membranes on a Si wafer, for comparison. The blurring in the case of compliant membranes is up to 95% reduced on full-wafer scale compared to standard (non-compliant) membranes.

Micropatterning of neural stem cells and Purkinje neurons using a polydimethylsiloxane (PDMS) stencil

A new fabrication method of a polydimethylsiloxane (PDMS) stencil embedded microwell plate is proposed and applied to a localized culture of Purkinje neurons (PNs) and neural stem cells (NSCs). A microwell plate combines a PDMS stencil and well plate. The PDMS stencil was fabricated by spin casting from an SU-8 master mold. Gas blowing using nitrogen was adopted to perforate the stencil membrane. An acrylic well plate compartment mold was fabricated using computer numerical control (CNC) machining. By PDMS casting using a stencil placed on an acrylic mold, microwell plates were fabricated without punching or the use of a plasma bonding process. By using the stencil as a physical mask for the cell culture, PNs and NSCs were successfully cultured into micropatterns. The microwell plate could be applied to the localizing and culturing of a cell. The micropatterned NSCs were differentiated into neurons, astrocytes, and oligodendrocytes. The results showed that cells could be cultured and differentiated into micropatterns in a precisely controlled manner in any shape and in specific sizes for bioscience study and bioengineering applications.

Micro-patterning on non-planar surface using flexible microstencil

A method for fabrication of flexible stencil was studied. Flexibility of the stencil allows micropatterning on a curved surface by material deposition or material removal (etching) through patterned hole of the stencil. In this study, low mechanical stability of the thin stencil membrane was improved by bonding the membrane with rim supporter which is thick and strong enough for easy handling of the stencil. Both of the membrane and rim structure were made of elastomer, PDMS using molding process from SU-8 master mold. The application test of shadow deposition and etching on underlying nonplanar surface using the fabricated flexible stencil mask showed the feasibility of the suggested technique into micro- patterning on a curved surface.

Micropatterning of single myotubes on a thermoresponsive culture surface using elastic stencil membranes for single-cell analysis

We have developed a micropatterning procedure for single myotubes and demonstrated recovery of patterned myotubes without the use of methods that might cause damage to the cells. Since skeletal muscle is a highly ordered tissue mainly composed of myotubes, analysis of single myotubes is one of the promising approaches for studying the various diseases related to skeletal muscle tissues. However, the analysis of single myotubes is quite complicated because of the difficulty in distinguishing individual myotubes differentiated on a normal cell culture surface. In the present study, thin polydimethylsiloxane (PDMS) membranes, which have rectangular holes (30, 50, 100, and 200 microm in width; 500, 750, and 1000 microm in length) through them, were fabricated by using a photolithography technique and used for single myotube micropatterning. A bovine serum albumin-coated (BSA-coated) stencil membrane was placed on a cell culture surface and C2C12 myoblasts were seeded on it. Since the cells could not attach to the surface of the stencil membrane, the cell proliferated and differentiated into myotubes in the hole areas specifically. By peeling off the membrane, a micropattern of myotubes was obtained. It was revealed that the optimum width of rectangular holes for a micropattern of single myotubes was between 30 to 50 microm. Furthermore, by placing a membrane on a thermoresponsive culture surface, recovery of the micropatterned myotubes was possible by lowering the temperature. This method involving the stencil membranes and a thermoresponsive culture surface is useful for analyzing subcellular or single myotubes.

Fabrication of Nanostencil by Size Reduction of Microaperture by Additional Deposition

A low-cost method for the fabrication of nanostencils is presented. Microstencils with 1–2-µm-wide patterns were fabricated by standard microelectromechanical systems (MEMS) processes. In order to avoid the use of highly expensive nanolithography tools, the size of microapertures in a stencil was reduced by the subsequent deposition method. The size of microapertures was reduced to the sub-micrometer scale by the additional deposition of SiO2. In this study, 500-nm-thick SiO2 layers were deposited by plasma enhanced chemical vapor deposition (PECVD) on the top surface and bottom surface of a stencil. Deposition on the bottom surface showed a greater size reduction than that on the top surface owing to the taper shape in the cross section of a stencil membrane. The size-reduction rates were 420 nm on the bottom surface, and 290 nm on the top surface when a 500-nm-thick SiO2 layer was deposited on a plane. Nanopattering test results using the fabricated nanostencil showed the feasibility of the proposed low-cost nanolithography. An aluminum layer (100 nm thick) was deposited through the nanostencil by e-beam evaporation. Nanoscale lines as small as 100 nm wide were successfully patterned.

Fabrication of metallic patterns by microstencil lithography on polymer surfaces suitable as microelectrodes in integrated microfluidic systems

Microstencil lithography, i.e. local deposition of micrometer scale patterns through small shadow masks, is a promising method for metal micropattern definition on polymer substrates that cannot be structured using organic-solvent-based photoresist technology. We propose to apply microstencil lithography to fabricate microelectrodes on flat and 3D polymer substrates, such as PMMA or SU-8, which form parts of microfluidic systems with integrated microelectrodes. Microstencil lithography is accompanied by two main issues when considered for application as a low-cost, reproducible alternative to standard photolithography on polymer substrates. In this paper we assess in detail (i) the reduction of aperture size (clogging) after several metal evaporation steps and corresponding change of deposited pattern size and (ii) loss in the resolution (blurring) of the deposited microstructures when there is a several micrometers large gap between the stencil membrane and the substrate. The clogging of stencil apertures induced by titanium and copper evaporation was checked after each evaporation step, and it was determined that approximately 50% of the thickness of the evaporated metals was deposited on the side walls of the stencil apertures. The influence of a gap on the deposited structures was analyzed by using 18 µm thick SU-8 spacers placed between the microstencil and the substrate. The presence of an 18 µm gap made the deposited structures notably blurred. The blurring mechanism of deposited structures is discussed based on a simplified geometrical model. The results obtained in this paper allow assessing the feasibility of using stencil-based lithography for unconventional surface patterning, which shows the limits of the proposed method, but also provides a guideline on a possible implementation for combined polymer-electrode microsystems, where standard photoresist technology fails.

Complex oxide nanostructures by pulsed laser deposition through nanostencils

We achieved parallel nanoscale patterning of ferroelectric complex oxides by pulsed laser deposition through a nanostencil (i.e., through a pattern of apertures in a thin free-standing membrane). Ordered arrays of nanostructured barium titanate (BaTiO3) were obtained onto different substrates in a single deposition step, at room temperature, replicating accurately the aperture patterns in the stencil membrane. After a postdeposition annealing treatment, x-ray diffraction pattern showed a nanocrystalline BaTiO3 structure close to the perovskite cubic phase with grains 30–35nm in size. Their local ferroelectric properties were detected using piezoresponse force microscopy.

Dry etch improvements in the SOI wafer flow process for IPL stencil mask fabrication

The 4x Ion Projection Lithography (IPL), which is designed to reach sub 100nm resolution on the wafer plane, uses stencil membrane masks out of 150mm SOI (Silicon On Insulator) wafers [1]. The structured circular membranes have a diameter of 126mm and a thickness of 3μm. Results of a new sub-quarter micron trench etch and membrane dry etch process are presented and discussed.