As a representative of third-generation semiconductors, silicon carbide serves as a new platform for quantum nano-optics with readable paramagnetic color centers such as silicon vacancies. The potential applications include biomedical imaging, quantum sensing and micro/nano environment detection. Color centers are usually prepared based on ion-irradiated substrates, then annealed at high temperature to increase the yield. Currently, annealing furnaces have been the main method to heat the substrate and achieve annealing of the whole sample. However, further exploration is still necessary for fine processing requirements such as specialized annealing regions with certain shapes. In this work, we applied femtosecond laser to achieve controllable annealing at micron scale, based on silicon carbide substrate after ion injection. The whole process of point, line and pattern annealing was realized. The annealing area demonstrates enhanced photoluminescence, attributed to silicon vacancy color centers. Raman and photoluminescence spectra reveal that the annealing effect is primarily influenced by the number of pulses per unit area. The mechanism of femtosecond laser annealing was introduced. Finally, the controllable annealing areas with various shapes were prepared based on the comprehensive optimal parameters (100 kHz pulse repetition frequency, 105 point annealing pulses, 10 μm/s line scanning speed). This annealing strategy demonstrates excellent stability and uniformity, as well as micron scale accuracy. Additionally, the excited state lifetime of silicon vacancy was extracted and quantified. The result means that femtosecond laser annealing enhances the optical properties and quantum application potential of color centers. This work can be further extended to other semiconductors as well as patterned modification of local surface/planes at some depth, and helpful to explore the mechanism and applications of femtosecond laser annealing.
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