Standard Microelectromechanical Systems Research Articles

Development of Highly Sensitive and Thermostable Microelectromechanical System Pressure Sensor Based on Array-Type Aluminum-Silicon Hybrid Structures.

In order to meet the better performance requirements of pressure detection, a microelectromechanical system (MEMS) piezoresistive pressure sensor utilizing an array-type aluminum-silicon hybrid structure with high sensitivity and low temperature drift is designed, fabricated, and characterized. Each element of the 3 × 3 sensor array has one stress-sensitive aluminum-silicon hybrid structure on the strain membrane for measuring pressure and another temperature-dependent structure outside the strain membrane for measuring temperature and temperature drift compensation. Finite-element numerical simulation has been adopted to verify that the array-type pressure sensor has an enhanced piezoresistive effect and high sensitivity, and then this sensor is fabricated based on the standard MEMS process. In order to further reduce the temperature drift, a thermodynamic control system whose heating feedback temperature is measured by the temperature-dependent structure is adopted to keep the working temperature of the sensor constant by using the PID algorithm. The experiment test results show that the average sensitivity of the proposed sensor after temperature compensation reaches 0.25 mV/ (V kPa) in the range of 0-370 kPa, the average nonlinear error is about 1.7%, and the thermal sensitivity drift coefficient (TCS) is reduced to 0.0152%FS/°C when the ambient temperature ranges from -20 °C to 50 °C. The research results may provide a useful reference for the development of a high-performance MEMS array-type pressure sensor.

A Low-Power and Robust Micromachined Thermal Convective Accelerometer.

This paper presents a micromachined thermal convective accelerometer with low power and high reliability. This accelerometer comprises a heater and two thermistors. The central heater elevates the temperature of the chip above ambient levels while the symmetrically arranged thermistors monitor the temperature differentials induced by acceleration. The heater and thermistors are fabricated on a glass substrate using a standard micro-electromechanical systems (MEMS) process flow, and the fabricated sensor is installed on a rotation platform and a shaking table experimental setup to perform the experiment. The results indicate that the sensor has the capability to measure accelerations surpassing 80 m/s2, with an approximate linear sensitivity of 110.69 mV/g. This proposed thermal convective accelerometer offers promising potential for various applications requiring precise acceleration measurements in environments where low power consumption and high reliability are paramount.

Non-Reciprocal MEMS Periodic Structure

In recent years, active periodic structures with in-time modulated parameters have drawn ever-increasing attention due to their peculiar (and sometimes exotic) wave propagation properties. Although many experimental works have shown the efficacy of time-modulation strategies, the benchmarks proposed until now have been mostly proof-of-concept demonstrators, with little attention to the feasibility of the solution for practical purposes. In this work, we propose a micro electro-mechanical system (MEMS) periodic structure with modulated electromechanical stiffness featuring non-reciprocal band-gaps that are frequency bands where elastic waves are allowed to travel only in one direction. To this aim, we derive a simplified analytical lumped-parameter model, which is then verified through numerical simulations of both the lumped-parameter system and the high-fidelity multiphysics finite element model including electrostatic effects. We envision that this system, which can easily be manufactured through standard MEMS production processes, may be used as a directional filter in MEMS devices such as insulators and circulators.

Optimization of Structure and Control Technology of Tunnel Magnetoresistive Accelerometer

In this work, an optimized tunnel magnetoresistive (TMR) accelerometer with a closed-loop control system was developed and evaluated. The device first introduces a silicon spring–mass sensing structure lower than 50 Hz into TMR-based accelerometry for enhancing the mechanical sensitivity and subsequent readout sensitivity. Simultaneously, in order to realize the in-plane electrostatic feedback control, the comb structure is designed along with the sensing mechanism, owning combined benefits of integrated processing and large feedback force. The whole sensing structure is a silicon-glass chip, fabricated by the standard micro-electromechanical system (MEMS) process—deep dry silicon on glass (DDSOG) process. A permanent rubber magnet is assembled on the proof mass for conversion from the displacement to variation of the magnetic field intensity, which is further detected by a pair of symmetrically arranged TMR sensors. The voltage signals output from TMR sensors are then sent into an analog circuit via an interface module for force-feedback control. The simulation analysis indicates that the proposed MEMS sensing structure has a low natural frequency of 44.55 Hz, corresponding to a compliant mechanical sensitivity of 125.5 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> /g. Meanwhile, a maximum magnetic sensitivity of about 0.1 mT/mm is available in a height of 6 mm above the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$3\times 3\times0.3$ </tex-math></inline-formula> mm magnet. Finally, the experiments on the assembled prototype demonstrated that a scale factor of 1.79 V/g and a bias stability of 228 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu \text{g}$ </tex-math></inline-formula> have been achieved in the closed-loop modality, which verifies the effectiveness of the proposed TMR MEMS accelerometer.

Hybrid Microfluxgate and Current Transformer Sensor

In this work, we develop the hybrid current sensor comprising a microfluxgate and a current transformer (CT) for wide-bandwidth current measurement. The microfluxgate consists of two microcoil chips 3.5 mm <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\times1.75$ </tex-math></inline-formula> mm in dimension made by using the standard Complementary Metal-Oxide Semiconductor MicroElectroMechanical Systems (CMOS-MEMS) <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$0.35 ~\mu \text{m}$ </tex-math></inline-formula> process. The aluminum wire-bonding technique is used to construct the top excitation coil surrounding the amorphous soft magnetic core patterned by photolithography and wet etching techniques. Under the optimal excitation condition, the response of the microfluxgate current sensor becomes linear with a maximized sensitivity. The in-house made CT is combined with the microfluxgate driving system to form the hybrid current sensor by using a summing amplifier. The hybrid current sensor has a spectral current noise of 0.4 mA/ <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\surd $ </tex-math></inline-formula> Hz at 1 Hz. The maximum sensing range is ±10 A, and the non-linearity is less than 2% within the ±4.6 A range, corresponding to a linear dynamic range of 60 dB in a 10 Hz bandwidth. The hybrid microfluxgate-and-CT sensor has a flat bandwidth from dc to 100 kHz. It has the potential to become a practical miniature device featuring a high-dynamic range, wide bandwidth, and low-temperature drift.

High-Performance Piezoelectric-Type MEMS Vibration Sensor Based on LiNbO3 Single-Crystal Cantilever Beams.

It is a great challenge to detect in-situ high-frequency vibration signals for extreme environment applications. A highly sensitive and robust vibration sensor is desired. Among the many piezoelectric materials, single-crystal lithium niobate (LiNbO3) could be a good candidate to meet the demand. In this work, a novel type of micro-electro-mechanical system (MEMS) vibration sensor based on a single crystalline LiNbO3 thin film is demonstrated. Firstly, the four-cantilever-beam MEMS vibration sensor was designed and optimized with the parametric method. The structural dependence on the intrinsic frequency and maximum stress was obtained. Then, the vibration sensor was fabricated using standard MEMS processes. The practical intrinsic frequency of the as-presented vibration sensor was 5.175 kHz, which was close to the calculated and simulated frequency. The dynamic performance of the vibration sensor was tested on a vibration platform after the packaging of the printed circuit board. The effect of acceleration was investigated, and it was observed that the output charge was proportional to the amplitude of the acceleration. As the loading acceleration amplitude is 10 g and the frequency is in the range of 20 to 2400 Hz, the output charge amplitude basically remains stable for the frequency range from 100 Hz to 1400 Hz, but there is a dramatic decrease around 1400 to 2200 Hz, and then it increases significantly. This should be attributed to the significant variation of the damping coefficient near 1800 Hz. Meanwhile, the effect of the temperature on the output was studied. The results show the nearly linear dependence of the output charge on the temperature. The presented MEMS vibration sensors were endowed with a high output performance, linear dependence and stable sensitivity, and could find potential applications for the detection of wide-band high-frequency vibration.

Microfluidic chip connected to porous microneedle array for continuous ISF sampling.

Minimally invasive biosensing using microneedles (MNs) is a desirable technology for continuous healthcare monitoring. Among a wide range of MNs, porous MNs are expected to be applied for sampling of interstitial fluids (ISF) by connecting the internal tissue to external measurement devices. In order to realize a continuous measurement of biomarkers in ISF through porous MNs, their integration with a microfluidic chip is a promising approach due to its applicability to micro-total analysis system (μTAS) technology. In this study, we developed a fluidic system to directly interface porous MNs to a microfluidic chip consisting of a capillary pump for the continuous sampling of ISF. The porous and flexible MNs made of PDMS are connected to the microfluidic chip fabricated by standard microelectro-mechanical system (MEMS) processes, showing a continuous flow of phosphate buffered saline (PBS). The developed device will lead to the minimally invasive and continuous biosampling for long-term healthcare monitoring.

Microchip Transfer Process for Implantable Flexible Bioelectronic Devices

Abstract The demands on flexible implants for recording of neural signals and electrical stimulating have increased in recent years with regard to their functionality, miniaturization, and spatial resolution. These requirements can be met best by embedding powerful complementary metal oxide semiconductor (CMOS) microchips into thin biocompatible polymer substrates. So-called chip-in-foil systems thus combine mechanical properties of a polymer substrate and performance of CMOS technology. The development of a process for direct transfer of multiple CMOS microchips (edge length &lt;400 μm) simultaneously into thin polyimide (PI) substrates is subject of this study. It allows the use of standard microelectromechanical systems (MEMS) processes for further levelled superficial layer build-up. This is achieved with the help of a silicon carrier wafer equipped with cavities for precise chip placement and a sacrificial layer to facilitate release of the chip-in-foil systems. In a post-processing step all silicon chips are thinned down to 100 μm. With this process a transfer yield of 100 % (n = 34) was achieved for the silicon chips on a die level. Chip rotational error on substrates was determined to be as low as 0.21° ± 0.10°. Die adhesion was examined by shear tests, resulting in shear strength of 58.1 MPa ± 13.7 MPa, which dropped to 15.2 MPa ± 10.5 MPa after accelerated ageing in 60 °C phosphate buffered saline solution (PBS) for 16 days (equivalent to 78 days at 37 °C). This study demonstrated a reliable microchip transfer process with low positioning error into flexible PI substrates with post-processing thinning of the dies. The use of a carrier silicon wafer allowed precise electrical interconnect fabrication with standard MEMS processing techniques and without handling of thin and fragile chips. These results are a prerequisite to meet needs of reliability and structural biocompatibility in implantable flexible bioelectronic devices.

Contact-Free MEMS Devices for Reliable and Low-Power Logic Operations

We report the first experimental proof of concept of a new electromechanical adiabatic logic family operating without any kind of electrical and mechanical contacts. Based on comb-drive actuators and standard microelectromechanical system (MEMS) microfabrication, we demonstrate the cascadability of logic gates up to 170 °C, and operation in the kilohertz-range under a power supply of 4.5 V. Assuming that state-of-the-art microfabrication can downscale our MEMS gates by a factor of 100, we expect a dissipation of 0.1 aJ/op (24 k <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">B</sub> T) at 250 kHz at 45 mV. This study paves the way toward new reliable low-power electromechanical digital circuits.

Transitioning from Si to SiGe Nanowires as Thermoelectric Material in Silicon-Based Microgenerators.

The thermoelectric performance of nanostructured low dimensional silicon and silicon-germanium has been functionally compared device-wise. The arrays of nanowires of both materials, grown by a VLS-CVD (Vapor-Liquid-Solid Chemical Vapor Deposition) method, have been monolithically integrated in a silicon micromachined structure in order to exploit the improved thermoelectric properties of nanostructured silicon-based materials. The device architecture helps to translate a vertically occurring temperature gradient into a lateral temperature difference across the nanowires. Such thermocouple is completed with a thin film metal leg in a unileg configuration. The device is operative on its own and can be largely replicated (and interconnected) using standard IC (Integrated Circuits) and MEMS (Micro-ElectroMechanical Systems) technologies. Despite SiGe nanowires devices show a lower Seebeck coefficient and a higher electrical resistance, they exhibit a much better performance leading to larger open circuit voltages and a larger overall power supply. This is possible due to the lower thermal conductance of the nanostructured SiGe ensemble that enables a much larger internal temperature difference for the same external thermal gradient. Indeed, power densities in the μW/cm2 could be obtained for such devices when resting on hot surfaces in the 50–200 °C range under natural convection even without the presence of a heat exchanger.

Performance Improvement of MEMS Electromagnetic Vibration Energy Harvester Using Optimized Patterns of Micromagnet Arrays

Scavenging mechanical energy from ubiquitous vibrations through miniaturized electromagnetic (EM) transducers is a potential solution to the problem of powering wireless sensor networks for the Internet of Things (IoT). This letter presents the design and performance analysis of fully integrated EM vibration energy harvesters on the scale of microelectromechanical systems (MEMS). Through analytical formulation and finite element analysis, we present a systematic design study to optimize the magnet-coil interaction in a precise location within a small surface area (“footprint”). The compact device topology yielded an EM coupling as high as 62.9 mWb/m with optimized stripe-shaped micromagnets and rectangular microcoils. The nonlinear spring topology demonstrated six times improvement in the half-power bandwidth compared to its linear counterpart, at a cost of reduced power density. The designs can be implemented using standard MEMS fabrication methods leveraging CMOS-compatible integration at the system level for potential applications in the IoT.

AZ4620 Photoresist as an Alternative Sacrificial Layer for Surface Micromachining

The mechanical actuation of suspended structures in microelectromechanical system (MEMS) switches plays an important role in obtaining an open or short circuit in radio-frequency (RF) transmission lines. These micromachined switches have moving parts which are realized by a sacrificial layer. Several sacrificial materials have been utilized in the fabrication of MEMS structures. The traditional method of using metal such as copper or nickel as a sacrificial layer is difficult due to metal etchant compatibility issues. A photoresist is the best choice for this process. Generally, the HiPR photoresist has been found to be suitable␣for the role of sacrificial layer. However, the HiPR is no longer available in the commercial market. As an alternative to the HiPR, the AZ4620 photoresist can be used. In this paper, a unit process optimization technique is described featuring an AZ4620 photoresist as a sacrificial layer for the microfabrication of a suspended structure. The AZ4620 meets all the requirements for the development of RF MEMS switches. Hence, the recipe and fabrication technique are optimized according to the required thickness. Preliminary measurements of the fabricated switch beam indicate that the required gap has been achieved. This optimized process is compatible with standard MEMS technology.

Modeling and fabrication of electrostatically actuated diaphragms for on-chip valving of MEMS-compatible microfluidic systems

This paper presents an analytical model to estimate the actuation potential of an electrostatic parylene-C diaphragm, processed on a glass wafer using standard microelectromechanical systems (MEMS) process technology, and integrable to polydimethylsiloxane (PDMS) based lab-on-a-chip systems to construct a normally-closed microvalve for flow manipulation. The accurate estimation of the pull-in voltage of the diaphragm is critical to preserve the feasibility of integration. Thus, we introduced an analytical model, in a good agreement with the finite element method (FEM), to extend the solution of the pull-in instability by including the effect of nonlinear stretching for multilayered circular diaphragms. We characterized the operation of fabricated diaphragms with a 300 µm radius for the parameters, including pull-in voltage (221 V on average), opening and closing response times (in microseconds), repeatability (more than 50 times), and touch area (25.3% ± 2.6% at pull-in potential). The experimental pull-in voltage shows close accuracy with the predicted results. Moreover, the diaphragm, sealed with a PDMS microchannel, was tested under fluid flow to prove the applicability of microfluidic integration. The hybrid fabrication method enables the realization of optically transparent and durable electrostatic microvalves for complex functioning of polymer-based microfluidic systems, as the extended analytical formulation permits accurate modeling of operation.

A High Dynamic Range Closed-Loop Stiffness-Adjustable MEMS Force Sensor

We present a microelectromechanical system (MEMS)-based closed-loop force sensor, capable of measuring bidirectional forces along one axis of motion. The device comprises an on-chip electrothermal displacement sensor and electrostatic actuators. It features a voltage-controlled stiffness-adjustment mechanism, providing the user with an additional means of tuning the sensor’s characteristics. This silicon-on-insulator device is an improvement on our previous design, offering a better dynamic range and a less complex calibration process. The sensor is fabricated based on a standard SOI MEMS process. It is then fully characterized and instrumented with a feedback controller. The closed-loop characterization reveals a ${1 {\sigma }}$ -resolution of 4.74 nN and a force sensing range of $- {211.7\, {\mu }\text {N}}$ to $\mathrm {211.5\, {\mu }N}$ , leading to a dynamic range of 92.9 dB. [2019-0248]

Fabrication and testing of PMOS current mirror-integrated MEMS pressure transducer

PurposeThis paper aims to describe the fabrication, packaging and testing of a resistive loadedp-channel metal-oxide-semiconductor field-effect transistor-based (MOSFET-based) current mirror-integrated pressure transducer.Design/methodology/approachUsing the concept of piezoresistive effect in a MOSFET, three identicalp-channel MOSFETs connected in current mirror configuration have been designed and fabricated using the standard polysilicon gate process and microelectromechanical system (MEMS) techniques for pressure sensing application. The channel length and width of thep-channel MOSFETs are 100 µm and 500 µm, respectively. The MOSFET M1 of the current mirror is the reference transistor that acts as the constant current source. MOSFETs M2 and M3 are the pressure-sensing transistors embedded on the diaphragm near the mid of fixed edge and at the center of the square diaphragm, respectively, to experience both the tensile and compressive stress developed due to externally applied input pressure. A flexible square diaphragm having a length of approximately 1,000 µm and thickness of 50 µm has been realized using deep-reactive ion etching of silicon on the backside of the wafer. Then, the fabricated sensor chip has been diced and mounted on a TO8 header for the testing with pressure.FindingsThe experimental result of the pressure sensor chip shows a sensitivity of approximately 0.2162 mV/psi (31.35 mV/MPa) for an input pressure of 0-100 psi. The output response shows a good linearity and very low-pressure hysteresis. In addition, the pressure-sensing structure has been simulated using the parameters of the fabricated pressure sensor and from the simulation result a pressure sensitivity of approximately 0.2283 mV/psi (33.11 mV/MPa) has been observed for input pressure ranging from 0 to 100 psi with a step size of 10 psi. The simulated and experimentally tested pressure sensitivities of the pressure sensor are in close agreement with each other.Originality/valueThis current mirror readout circuit-based MEMS pressure sensor is new and fully compatible to standard CMOS processes and has a promising application in the development CMOS-MEMS-integrated smart sensors.

Array MEMS Vector Hydrophone Oriented at Different Direction Angles

A new type of array MEMS (Microelectro Mechanical Systems) vector hydrophone has been proposed to solve the left-right ambiguity problem that is commonly found in current ones. Meanwhile, the advantages of good sensitivity and low fabrication cost are maintained. The array MEMS vector hydrophone is integrated by four units oriented at different direction angles. By the aid of this kind of vector hydrophone, not only the exact direction of the sound source can be measured, but also the position obtained. The working principle of the array microstructure has been analyzed and simulated. The result shows that the position of the sound source can be well determined. The prototype of the hydrophone is fabricated based on standard MEMS technology, and its performance is tested in a standing wave tube and an anechoic tank. The testing results show that the array hydrophone exhibits a good consistency of all the four units and satisfactory performance. More importantly, this array hydrophone exhibits excellent ability of positioning with the relatively small angle error. Thus, a MEMS hydrophone with multiple functions and relatively high performance is realized, which has important theoretical and practical significance in relevant applications such as the small-size underwater vehicles.

A VCO-Based CMOS Readout Circuit for Capacitive MEMS Microphones.

Microelectromechanical systems (MEMS) microphone sensors have significantly improved in the past years, while the readout electronic is mainly implemented using switched-capacitor technology. The development of new battery powered “always-on” applications increasingly requires a low power consumption. In this paper, we show a new readout circuit approach which is based on a mostly digital Sigma Delta () analog-to-digital converter (ADC). The operating principle of the readout circuit consists of coupling the MEMS sensor to an impedance converter that modulates the frequency of a stacked-ring oscillator—a new voltage-controlled oscillator (VCO) circuit featuring a good trade-off between phase noise and power consumption. The frequency coded signal is then sampled and converted into a noise-shaped digital sequence by a time-to-digital converter (TDC). A time-efficient design methodology has been used to optimize the sensitivity of the oscillator combined with the phase noise induced by and thermal noise. The circuit has been prototyped in a 130 nm CMOS process and directly bonded to a standard MEMS microphone. The proposed VCO-based analog-to-digital converter (VCO-ADC) has been characterized electrically and acoustically. The peak signal-to-noise and distortion ratio (SNDR) obtained from measurements is 77.9 dB-A and the dynamic range (DR) is 100 dB-A. The current consumption is 750 A at 1.8 V and the effective area is 0.12 mm. This new readout circuit may represent an enabling advance for low-cost digital MEMS microphones.

On the feasibility of a liquid crystal polymer pressure sensor for intracranial pressure measurement.

Intracranial pressure (ICP) monitoring is crucial in determining the appropriate treatment in traumatic brain injury. Minimally invasive approaches to monitor ICP are subject to ongoing research because they are expected to reduce infections and complications associated with conventional devices. This study aims to develop a wireless ICP monitoring device that is biocompatible, miniature and implantable. Liquid crystal polymer (LCP) was selected to be the main material for the device fabrication. This study considers the design, fabrication and testing of the sensing unit of the proposed wireless ICP monitoring device. A piezoresistive pressure sensor was designed to respond to 0-50 mm Hg applied pressure and fabricated on LCP by standard microelectromechanical systems (MEMS) procedures. The fabricated LCP pressure sensor was studied in a moist environment by means of a hydrostatic pressure test. The results showed a relative change in voltage and pressure from which the sensor's sensitivity was deduced. This was a proof-of-concept study and based on the results of this study, a number of recommendations for improving the considered sensor performance were made. The limitations are discussed, and future design modifications are proposed that should lead to a complete LCP package with an improved performance for wireless, minimally invasive ICP monitoring.

Insect-inspired acoustic micro-sensors.

Micro-Electro Mechanical System (MEMS) microphones inspired by the remarkable phonotactic capability of Ormia ochracea offer the promise of microscale directional microphones with a greatly reduced need for post-processing of signals. Gravid O. ochracea females can locate their host cricket's 5 kHz mating calls to an accuracy of less than 2° despite having a distance of approximately 500 μm between the ears. MEMS devices base on the principles of operation of O. ochracea's hearing system have been well studied, however commercial implementation has proven challenging due to the system's reliance on carefully tailored ratios of stiffness and damping, which are difficult to realize in standard MEMS fabrication processes, necessitating a trade-off between wide-band operation and sensitivity. A survey of the variety of strategies that have been followed to address these inherent challenges is presented.

MEMS Capacitive Sensor for Wound Monitoring Applications

This paper presents development of a capacitive microsensor to be used in monitoring of wound healing process. Wounds will heal more quickly if they are kept under a bandage and presently bandages must be removed to track the healing process. This could potentially delay the healing process. A sensor can be used to detect the presence of blood in the wound by measuring the capacitance. Blood has a higher permittivity than air or any other substance that may be in the wound and will significantly increase the total measured capacitance in the device. The presence of blood in the wound under the bandage and so in the device would signify that the wound is not fully healed. The sensor was fabricated using standard MEMS (Microelectromechanical Systems) techniques in cleanroom. The sensor was tested in present of no solution, DI water and saline solution, and capacitance was measured to be 1 pF, 35 pF and 53.3 pF, respectively.