The system of providing thermal conditions of radio-electronic equipment, which is a necessary subsystem of such modern information systems as on-board mobile objects with high requirements to reliability, dynamics and controllability, is analyzed. A solid-state method of cooling energy generation based on the Peltier effect is highlighted, which has such advantages as the possibility of creating a temperature below ambient, small dimensions, mass and increased reliability compared to similar coolers of other physical principles. It is shown that in distributed systems with heat-loaded elements the function of transporting heat flows is necessary, and the most promising for the solved problems is realized on flexible heat pipes, which agree with thermoelectric coolers in terms of reliability, mass and dimensional characteristics. The method of reducing the mass and dimensional characteristics of systems for providing thermal modes with impulse heat generation, typical for tracking systems or on-board systems, is considered. It is noted that the heat of phase transition of melting substances allows to form thermal accumulators, which, when coordinated with the dynamic characteristics of thermal processes of the system, allows to significantly reduce the mass and dimensional characteristics of the system for providing thermal modes. The use of thermal accumulators in systems with pulse-periodic influence allows to increase also reliability indicators due to filtration of high-frequency thermal emissions in heat-loaded elements. The expediency of the system approach to the design of the thermoelectric system for ensuring thermal modes of electronic equipment with heat pipes and thermal accumulators by synthesizing a multidimensional regulator type “Multiple Input - Multiple Output” (MIMO) is substantiated. It is substantiated that to satisfy the basic principles of multidimensional systems of fragility and robustness it is necessary to satisfy the condition of creation of a qualitative model of the thermoelectric system of provision of thermal modes of heat-loaded electronic equipment.