Solder Paste Research Articles

Detection of stencil printing direction in printed circuit boards assembly using solder paste inspection data

Detection of stencil printing direction in printed circuit boards assembly using solder paste inspection data

Microstructural Evolution of Intermetallic Compound Between SN100C Solder and ENIMAG Substrate During Isothermal Ageing

SN100C alloy emerges as a promising candidate when introducing lead-free solder alternativesdue to its mechanical properties and solderability. The study aims to explore interfacial reactions between SN100C solder and ENIMAG surface finish. Methods involve preparingENIMAG substrates, solder paste application, and reflow processes following JEDEC standards. Isothermal ageing treatments were conducted, and interfacial reactions were characterized using top surface and cross-section analyses via Optical Microscope (OM), Scanning Electron Microscope (SEM), and Energy Dispersive X-ray (EDX). Post-reflow, distinct IMC layers formed at the SN100C/ENIMAG solder joint's interface, evolving with ageing. Further analysis via cross-section confirms the initial formation of (Ni, Cu)3Sn4 layer followed by (Cu, Ni)6Sn5, each exhibiting varying appearance and thicknesses. Isothermal ageing increases IMC thickness, which is particularly influenced by Cu diffusion and exposure to high temperatures, and itfacilitates the growth rate of IMCs.

SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux

An intermetallic layer (IML) between the solder alloy and the soldered surface affects the mechanical and electrical performance of the resulting joints. Numerous studies have explored the possibilities of influencing the IML to achieve more reliable interconnections. However, the type and composition of the used flux, crucial for the proper creation of solder joints, is rarely included as a possible influencing factor. In this article, a comprehensive study on the interfacial microstructure evolution of lead‐free SnAgCu solder joints, accounting for the flux type and the temperature of the preheating phase of reflow soldering, where the flux contained in the solder paste becomes active, is presented. In the results, it is shown that the IML of as‐reflowed and thermally aged solder joints depends significantly on the flux. The IML activation energy is 57% higher for rosin‐based low‐activity (ROL)0 flux compared to ROL1 flux. The ROL0 flux, containing fewer active components, also outperforms the ROL1 flux in both the mechanical and electrical properties of the joints. Furthermore, the temperature profiles also show slight differences in measured properties, with the fluxes responding differently to changes in preheating temperature. In the presented results, importance of the used flux on solder joint microstructure is demonstrated.

Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint.

In this work, epoxy was added into commercial Sn-3.0Ag-0.5Cu (SAC305) solder paste to enhance the thermal cycling reliability of the joint. The microstructure and fracture surface were observed using a scanning electron microscope/energy dispersive spectrometer (SEM/EDS), and a shear test was performed on the thermally cycled joint samples. The results indicated that during the thermal cycling test, the epoxy protective layer on the surface of the epoxy-enhanced SAC305 solder joint could significantly alleviate the thermal stress caused by coefficients of thermal expansion (CTE) mismatch, resulting in fewer structural defects. The interfacial compound of the original SAC305 solder joints gradually coarsened due to the accelerated atomic diffusion, but epoxy-enhanced SAC305 solder joints demonstrated a thinner interfacial layer and a smaller IMC grain size. Due to the reduced stress concentration and the additional mechanical support provided by the cured epoxy layer, epoxy-enhanced SAC305 solder joints displayed superior shear performance compared to the original joint during the thermal cycling test. After 1000 thermal cycles, Cu-Sn IMC regions were observed on the fracture surfaces of the original SAC305 solder joint, exhibiting brittle fracture characteristics. However, the fracture of the SAC305 solder joint with 8 wt.% epoxy remained within the solder bulk and exhibited a ductile fracture mode. This work indicates that epoxy-enhanced SAC305 solder pastes display high thermal cycling reliability and could meet the design needs of advanced packaging technology for high-performance electronic packaging materials.

Tin Multilayer‐Aided SAC305‐Based Lead‐Free Solder Joint Interface with Cu: An Investigation of the Stress Distribution by Finite Element Analysis and Nanoindentation Studies

Two different types of lead‐free solder joints Cu/(Sn3.0Ag0.5Cu)/Cu and Cu/Sn/(Sn3.0Ag0.5Cu)/Sn/Cu have been investigated. Joints are produced following the transient liquid phase like soldering process. The microstructure of different intermetallic compounds (IMCs) present at the joint interfaces, as well as their indentation hardness and elastic modulus, have been investigated and analyzed using scanning electron microscopy (SEM), X‐ray diffraction (XRD) spectroscopy, and nanoindentation. The exact position of different microcracks inside the interfaces has been identified by analyzing the elastic–plastic properties and interfacial toughness of these solder joints. The modulus and hardness of the Sn multilayer‐assisted solder joint interface are found to be 60.08%, and 90.18% higher than those of its non‐layered counterpart, respectively. The finite element analysis (FEA) has been done to estimate and compute stress distributions over the interfacial region. The dislocation mechanics involved in strengthening the joint strength are related to the nature of stress flow; as observed in FEA. It is reconfirmed that the high susceptibility to brittle failure of the non‐layered Cu‐SAC305 solder joints could be avoided by using a Sn interlayer in between the Cu substrates and the SAC305 solder paste.

Bonding Properties of Package-on-Package Stack Interconnection Using by 150 ㎛ Height Copper Posts

In this study, we used copper (Cu) posts, plated to a height of 150 μm, as interconnections to form electrodes between different package layers. The upper layer consisted of a chip-scale package (CSP), while the lower layer was made up of a flip chip-chip scale package (FCCSP). We plated a Cu post on the side of FCCSP substrate, and produced the FCCSP package by thermo-compression (TC) bonding with copper pillar solder bumps on the center of substrate. The surface of the bottom electrode for the upper CSP received a surface finish of electroless nickel, electroless palladium, and immersion gold (ENEPIG). The bonding surface of the lower FCCSP was the bare Cu surface of the epoxy-molded Cu post. The PoP joining process used a vacuum reflow process with solder paste and solder balls. To understand the package joint's characteristics, we measured voids and shear strength, and analyzed the cross-sectional microstructure. The temperature profile used in the PoP joining process demonstrated optimal joint characteristics with a joint void content of 2.3% and a joint strength of approximately 44 MPa when formic acid was utilized and the activation preheating time was extended. Cross-sectional warpage analysis of the PoP package revealed a minimal difference of approximately 31 μm between the center and the ends. This study successfully developed a stacked package with a PoP structure using Cu Post, and the bonding process was optimized to minimize warpage in the PoP package.

High-reliability Sn37Pb/Sn58Bi composite solder joints by solid-liquid low-temperature soldering

As the feature sizes of integrated circuits approach their physical limits, 3D packaging has emerged as a crucial technology for enhancing integration and extending Moore's Law. To meet the future requirements for low-temperature solder and interconnect processes in aerospace 3D packaging, this study combined Sn37Pb solder balls with Sn58Bi solder paste to prepare uniform composite solder joints under reflow conditions of 180°C for 10 minutes (CS-180–10) and 190°C for 1 minute (CS-190–1). The Bi atoms dissolved in the Pb phase strengthened the composite solder and made the crystal structure more ordered and predictable. The composite solder joints formed under both process conditions exhibited shear strengths higher than those of Sn37Pb solder joints prepared at 220°C for 1 minute, both before and after aging at 100°C. The fracture mode of the composite solder joints transitioned from ductile to mixed ductile-brittle with aging. Additionally, the composite solder demonstrated better creep resistance than SnPb solder at all tested strain rates in nanoindentation tests. Compared to CS-180–10, the lower heat input CS-190–1 featured finer Pb phases and Pb grains, better wettability, and better thermal stability. CS-190–1 showed only a 5.9 % decrease in shear strength after 42 days of aging at 100°C. This study offers a new solution for low-temperature, high-reliability interconnections in future aerospace integrated circuit 3D packaging.

Recent Advences in Laser and Laser-Assisted Bonding (LAB) Technologies for Micro-Soldering and Applications to Mini-LED

Advancements in laser soldering and laser-assisted bonding (LAB) have revolutionized electronic manufacturing by enhancing solder joint formation with precise control, reduced thermal impact, and improved reliability. These technologies are crucial for high-density assemblies in advanced electronics, supporting miniaturization and increasing functionality. This paper introduces recent advancements in laser and LAB technologies for micro-soldering. The paper describes Nd:YAG and diode lasers, their micro-soldering results, the microstructure of the solder joint, and the author's LAB application to mini-LEDs using type-8 SAC305 solder paste. Future advancements in laser technology will further improve soldering and bonding techniques to ensure the reliability and performance of smaller, more complex electronic devices.

Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging.

Chip bonding, an essential process in power semiconductor device packaging, commonly includes welding and nano-silver sintering. Currently, most of the research on chip bonding technology focuses on the thermal stress analysis of tin-lead solder and nano-silver pressure-assisted sintering, whereas research on the thermal stress analysis of the nano-silver pressureless sintering process is more limited. In this study, the pressureless sintering process of nano-silver was studied using finite element software, with nano-silver as an interconnect material. Using the control variable method, we analyzed the influences of sintering temperature, cooling rate, solder paste thickness, and solder paste area on the residual stress and warping deformation of power devices. In addition, orthogonal experiments were designed to optimize the parameters and determine the optimal combination of the process parameters. The results showed that the maximum residual stress of the module appeared on the connection surface between the power chip and the nano-silver solder paste layer. The module warping deformation was convex warping. The residual stress of the solder layer increased with the increase in sintering temperature and cooling rate. It decreased with the increase in coating thickness. With the increase in the coating area, it showed a wave change. Each parameter influenced the stress of the solder layer in this descending order: sintering temperature, cooling rate, solder paste area, and solder paste thickness. The residual stress of the nano-silver layer was 24.83 MPa under the optimal combination of the process parameters and was reduced by 29.38% compared with the original value of 35.162 MPa.

Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards.

Electrochemical migration (ECM) on the surface of printed circuit boards (PCBs) continues to pose a significant reliability risk in electronics. Nevertheless, the existing literature lacks studies that address the solder mask and solder pad design aspects in the context of ECM. Therefore, the objective of this study was to assess the impact of solder mask type with varying roughness and solder pad design on the susceptibility to ECM using a water drop test and thermal humidity bias test. Hot air solder leveling-coated PCBs were tested. Furthermore, the ECM tests were conducted on PCBs with applied no-clean solder paste to evaluate the influence of flux residues on the resulting ECM behavior. The results indicated that the higher roughness of the solder mask significantly contributes to ECM inhibition through the creation of a mechanical barrier for the dendrites. Furthermore, lower ECM susceptibility was also observed for copper-defined pads, where a similar effect is presumed. However, the influence of the no-clean flux residues can prevail over the effects of the solder mask. Therefore, the use of a rough solder mask and a copper-defined pad design is recommended if the PCB is to be washed from flux residues after the soldering process.

Effects of CuO nanoparticles on SAC composite solder joints: Microstructural and DFT study

In this paper, novel application possibilities of CuO nanoparticles were investigated in SAC0307 solder alloy for composite soldering purposes. CuO nanoparticles in 0.25 and 0.5 wt% were mixed into the solder paste to produce composite solder joints. Solder joints were manufactured using standard surface mounting technology from different solder pastes. The solder joints were loaded in an 85 °C/85RH% temperature and humidity test for 4000 h. It was found that the CuO composite solder joints showed improved mechanical quality due to the microstructural refinement, which was studied using scanning electron microscopy (SEM) and focused ion beam (FIB) analysis. On the other hand, the corrosion resistance of CuO joints decreased, as they suffered localized corrosion extensively, which produced longer and more Sn whiskers on their surface than on the reference SAC0307. Density functional theory (DFT) calculations proved that CuO can bond to Sn, but CuO is not chemically inert in the solder bulk. CuO can start a cyclic reaction with the dispersed Cu6Sn5 intermetallics, which produces SnO2 in the solder bulk, ultimately enhancing corrosion. Therefore, CuO nanoparticles are suggested to be applied only in non-corrosive environments, such as space applications.

Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints

PurposeThis paper aims to systematically study the effects of reflow temperature and SAC0307 (SAC) content on the micromorphology and mechanical properties of Sn58Bi-xSAC0307 composite solder joints to meet the requirements of high integration and low-temperature packaging of devices and provide references for the application of composite solder joints.Design/methodology/approachSn58Bi and SAC0307 solder paste was mechanically mixed in different proportions to prepare Sn58Bi-xSAC0307/ENIG solder joints. The thermal properties, microstructure and mechanical properties of the composite solder joints were studied.FindingsAs SAC content in the solder increases, the balling temperature of SnBi-SAC solder gradually increases. The addition of SAC alloy reduces the grain size of large Bi-rich phase, and there are small-sized dispersed Bi and Ag3Sn particles in the bulk solder. The intermetallic compounds composition of the SnBi-xSAC/ENIG solder joint changes from Ni3Sn4 to (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 with SAC increasing. As the soldering temperature increases, the strength of all solder joints shows a rising trend. Among them, the shear strength of SnBi-20SAC solder joints at a reflow temperature of 150°C is approximately 37 MPa. As the reflow temperature increases to 250°C, the shear strength of solder joints increases to approximately 67 MPa.Originality/valueThis study provides a reference for the optimization of low-temperature solder composition and soldering process under different package designs.

A method for minimizing voids in solder joints on a printed circuit board

Formulation of the problem. When mounting electronic components on a board during the soldering process, voids inevitably form inside the connection. There are especially many of them in solder joints that have a large area. These voids impair thermal conductivity and generally reduce both the mechanical and electrical reliability of the contact. Therefore, finding ways to reduce the impact of this defect is a fairly urgent task. Target. Consider the effect of solder mask roughness on the distribution of flux around the contact pad, and also identify the dependence of the formation of voids on the configuration and thickness of solder paste application. Results. More active fluxes have been shown to produce fewer voids in terms of average total area covering the pad. Analysis of samples prepared using modified stencils showed a significantly lower proportion of voids than when using a standard stencil. In addition, it has been shown that the choice of solder mask type has a significant impact on the formation of voids in solder joints. The best results were achieved using a thin stencil with a larger aperture when the printed circuit boards were without a solder mask, and the surface has the greatest roughness. However, when modified, thicker, smaller aperture stencils were used, the solder mask had no effect on void formation. Thus, it was found that stencil modification can be recognized as a more preferable and effective way to minimize voids in solder joints. Practical significance. The results obtained can be used to improve the reliability of radio-electronic equipment by selecting optimal soldering technology parameters that affect the reduction of the number of voids in solder joints of components on the board.

Analisis Pengurangan Waste Proses Produksi Pada PT SP Manufacturing

PT SP Manufacturing is a manufacturing company that operates in the field of wire harness production. When making wire harnesses at PT SP Manufacturing, waste still occurs. Waste in the production process is one of the biggest problems this company wants to solve. A defective product is a product that does not meet wire harness production standards so it cannot meet customer demand, and requires more space before rework is carried out, which causes inventory waste (Unnecessary Inventory). Reduced productivity and higher production costs are the result of this waste. The aim of this research is to use value stream mapping to identify waste in the production process and apply lean manufacturing techniques to reduce it. The results obtained are based on identification and analysis of existing problems as well as alternatives and improvements based on the formulation and objectives in the research. The largest waste in the wire harness production process of PT.SP Manufacturing is waste with a weight score of 60.89%, unknown inventory waste with a weight score of 39, 12%. The causal factors are workers who lack concentration, apply excess solder paste to the wire terminals, workers who pursue targets without paying attention to quality, resulting in defective products that require rework. The recommendations given to the company according to the fishbone diagram are proposed improvements to the wire harness production process to reduce defects and unnecessary inventory which refers to people, machines, methods and materials.

Impact of hot air gun soldering process parameters on the electromechanical properties of electronic yarn

Researchers now confirm that the market for electronic textiles, or ‘E-textiles,’ will rise rapidly. One method of creating e-textiles is the integration of electronics with textiles. Several techniques were used to combine electronics with conductive textile. One of the best methods for connecting electronics to conductive textile fabrics is soldering. Because of this, it is important to look into how the soldering process parameter affects the developed e-textile’s characteristics. In the research paper presented, the effects of temperature, speed of hot air, and amount of paste size of hot air gun re-flow soldering parameters on the electromechanical properties of surface mount device (SMD) embedded electronic yarn were examined. Three main soldering parameters at four different levels were selected based on the preliminary test results involving the soldering of the tiny SMD into CLEVERTEX electrically conductive hybrid yarn. The result shows that soldering of SMD into CLEVERTEX electrically conductive hybrid yarn provided a higher conductivity with 10-ohm DC resistance. Statistical analyses were also carried out to prove the significant effect of the temperature on changing electrical resistance at, α = 0.5, with an F-value of 0.27 and a p value of .036. While the effects of different amounts of solder paste size on the electrical resistance were not statistically significant at α = 0.5, with an F-value of 0.27 and a p value of .84. Moreover, the tensile strength of the developed e-yarn was affected by the hot air soldering parameters. Furthermore, the developments of e-yarn using hot air gun soldering was pronounced in more extreme process conditions, which revealed that there was a strong interaction between the solder temperature, solder paste volume and solder speed. Furthermore, this approach made it easier to generate the optimum quality of e-yarn needed to continue creating prototype electronic textiles.

Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation

In this study, intense pulsed light (IPL) soldering was employed on Sn-58Bi solder pastes with two distinct particle sizes (T3: 25–45 μm and T9: 1–8 μm) to investigate the correlation between the solder microstructure and mechanical properties as a function of IPL irradiation times. During IPL soldering, a gradual transition from an immature to a refined to a coarsened microstructure was observed in the solder, impacting its mechanical strength (hardness), which initially exhibited a slight increase followed by a subsequent decrease. It is noted that hardness measurements taken during the immature stage may exhibit slight deviations from the Hall–Petch relationship. Experimental findings revealed that as the number of IPL irradiation sessions increased, solder particles progressively coalesced, forming a unified mass after 30 sessions. Subsequently, after 30–40 IPL sessions, notable voids were observed within the T3 solder, while fewer voids were detected at the T9-ENIG interface. Following IPL soldering, a thin layered structure of Ni3Sn4 intermetallic compound (IMC) was observed at the Sn-58Bi/ENIG interface. In contrast, reflow soldering resulted in the abundant formation of rod-shaped Ni3Sn4 IMCs not only at the reaction interface but also within the solder bulk, accompanied by the notable presence of a P-rich layer beneath the IMC.

The influences of Ag nanoparticles on voids growth and solderability about Sn3.0Ag0.5Cu/Cu solder joint

Although Sn3.0Ag0.5Cu solder (SAC305) has higher reliability, there are a large number of harmful voids in solder joints. Larger voids can reduce thermal conductivity of solder joints. However, as a microstructure growth inhibitor, the influences of Ag nanoparticles on voids growth are not clear at present. Herein, we prove that Ag nanoparticles can increase SAC305 solderability, but promote voids growth. Ag nanoparticles and SAC305 solder paste were mixed by mechanical stirring for 0.5 h. Next, SAC305-xAgP (x = 0, 0.1, 0.2, 0.3, 0.4 and 0.5 wt%) was obtained. The results indicated that solder solderability was improved increasingly with Ag nanoparticles addition. The lower the amount of nanoparticles added, the greater the final loss. After being aged at 100 °C for 150 h, the voids stopped growing. Due to the violent reaction between Ag nanoparticles and flux, the final voids growth rate became faster, and the average voids size changed from 14.34% to 24.91%.

Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package

Sn-3.0Ag-0.5Cu (SAC305) is one of the most commonly used Pb-free solder composition nowadays. A minor alloying element addition can improve mechanical properties and thermal reliability of the solder joint. Minor amount of Bithmuth (Bi) or Nickel (Ni) addition can improve mechanical properties of solder by solid solution strengthening, or ensure the structural stability of the intermetalllic compounds. Also, low melting temperature solder with Bithmuth can reduce the cost of soldering process and keep components from deterioration. In this study, reliability of heterogeneous and homogeneous solder joint in the ball-grid-array (BGA) package solder joint were investigated. Using Sn-3.0Ag-0.5Cu (SAC305) solder paste and two kinds of solder balls, we have investigated which combination of solder joint improves the thermo-mechanical reliability. SAC305 and SCN (Sn-0.75Cu-Ni,Bi) balls were used for homogeneous and hetrogeneous joints. Solder balls were attached in BGA package. To examine the solder joint reliability, thermal cycling test was conducted after reflow soldering. Shear strength measurement and cross-sectional analysis of the BGA package solder joints were carried out before and after 2000 cycles of the test. The shear strength of homogeneous solder joint decreased to 68.2% and heterogeneous decreased to 43.5%. The cross-sectional analysis using scanning electorn microscopy (SEM) and electorn back-scattered diffraction (EBSD) showed the (Ni,Cu)<sub>6</sub>Sn<sub>5</sub> and Cu<sub>6</sub>Sn<sub>5</sub> IMCs which were generated in the solder joint, and the crack propagated longer in the homogeneous solder joint of SAC305 after the thermal cycling test. IPFM showed the grain refinement effect of the SCN solder joint after thermal cycling. The minor addition of Bi had played a role as dislocation pinning site and became to equiaxied grain, so that the lifetime of heterogeneous SCN solder joint was superior than that of the SAC305.

The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance

Purpose This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder. Design/methodology/approach This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry. Findings Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength. Originality/value This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

An Investigation of the Effect of Wide Range Gamma Radiation from Nanoindentation of the SAC305 Solder Alloy

This study utilises nanoindentation testing to investigate the impact of varying gamma radiation doses on the micromechanical properties of Sn-Ag-Cu (SAC) alloy. Specifically, the focus is on evaluating changes in hardness, reduced modulus, and creep behaviour. The stencil-printed method and reflow soldering process were employed to apply the SAC solder paste and create solder joints on the surface of the printed circuit board. The soldered samples underwent exposure to gamma radiation at different doses, specifically 5, 50, 500, 5000, and 50000 Gy. The solder received in its original state was used as the control sample. Subsequently, the samples were subjected to a nanoindentation test in order to ascertain the correlation between load and depth, depth and dwell time, when exposed to radiation. The load-depth curve results indicate that there is a transition in the behaviour of solder joint materials from elastic to plastic deformation as the radiation dose increases. A finding has been made indicating that exposure to gamma radiation has the potential to induce a transition in the behaviour of SAC from an elastic state to a plastic state. The exposure to radiation doses has been found to induce changes in the atomic arrangement and structural properties of materials, leading to an increase in their hardness values. Nevertheless, it was observed that with increasing radiation doses up to 500 Gy, there was a noticeable decrease in the hardness value, which can be attributed to the occurrence of softening behaviour. Exposure to a high dose exceeding 5000 Gy leads to atomic displacement and transmutation products, subsequently resulting in plastic deformation. The stress exponent value signifies the occurrence of the deformation mechanism in solder material when exposed to gamma radiation. The study revealed that there was a shift in the deformation mechanism from grain boundary sliding to dislocation climb as the radiation dose increased from low to high levels.