Abstract
Researchers now confirm that the market for electronic textiles, or ‘E-textiles,’ will rise rapidly. One method of creating e-textiles is the integration of electronics with textiles. Several techniques were used to combine electronics with conductive textile. One of the best methods for connecting electronics to conductive textile fabrics is soldering. Because of this, it is important to look into how the soldering process parameter affects the developed e-textile’s characteristics. In the research paper presented, the effects of temperature, speed of hot air, and amount of paste size of hot air gun re-flow soldering parameters on the electromechanical properties of surface mount device (SMD) embedded electronic yarn were examined. Three main soldering parameters at four different levels were selected based on the preliminary test results involving the soldering of the tiny SMD into CLEVERTEX electrically conductive hybrid yarn. The result shows that soldering of SMD into CLEVERTEX electrically conductive hybrid yarn provided a higher conductivity with 10-ohm DC resistance. Statistical analyses were also carried out to prove the significant effect of the temperature on changing electrical resistance at, α = 0.5, with an F-value of 0.27 and a p value of .036. While the effects of different amounts of solder paste size on the electrical resistance were not statistically significant at α = 0.5, with an F-value of 0.27 and a p value of .84. Moreover, the tensile strength of the developed e-yarn was affected by the hot air soldering parameters. Furthermore, the developments of e-yarn using hot air gun soldering was pronounced in more extreme process conditions, which revealed that there was a strong interaction between the solder temperature, solder paste volume and solder speed. Furthermore, this approach made it easier to generate the optimum quality of e-yarn needed to continue creating prototype electronic textiles.
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