Solder Matrix Research Articles

Influence of nickel plating on the welding metallurgical mechanism, microstructure, and shear performance of C101/80Au20Sn/C101 solder joints

Herein, electroplated and electroless plating processes were used to plate nickel (Ni) on the surface of C101 alloy, which is a low-carbon steel with a carbon content of approximately 0.1% and Fe primarily contributing to the rest of the content and which is commonly used in metal packaging, and electroplated Ni and electroless Ni C101/80Au20Sn/C101 solder joints were prepared. The welding metallurgical mechanisms, microstructures, and shear performances of the two types of solder joints were investigated through experimental observation, material characterization, shear testing, and finite-element analysis (FEA). The diffusion of Ni atoms within the two platings was evaluated using first-principles calculation. Results indicated that the atomic arrangement of the electroplated Ni layer was polycrystalline, whereas that of the electroless Ni layer was primarily amorphous. The orientation of Ni grains in the electroplated-Ni joints affected the growth of (Ni,Au)3Sn2 throughout the welding metallurgical process. The [111] orientation suppressed the growth of (Ni,Au)3Sn2, resulting in a discontinuous distribution of (Ni,Au)3Sn2 at the Ni/solder interface and considerable variations in the thickness of (Ni,Au)3Sn2. Amorphous Ni in the electroless Ni layer promoted the growth of (Ni,Au)3Sn2, resulting in a continuous (Ni,Au)3Sn2 layer having a relatively uniform thickness. The shear strength of the electroplated-Ni joints was considerably lower than that of the electroless-Ni joints. FEA results demonstrated that the locations of stress concentration in the electroplated- and electroless-Ni joints were at the (Ni,Au)3Sn2/solder interface and within the solder matrix, respectively. First-principles calculations showed that the diffusion performance of Ni atoms in the electroless Ni layer was considerably superior to that of Ni atoms in the electroplated Ni layer.

Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging

Today’s 3D electronic packaging is characterized by smaller size and higher functional density, which generally require multiple reflow cycles. However, due to the Ostwald ripening process of the interfacial intermetallic compound (IMC), the solder joint’s strength would decrease as the number of reflow cycles increases. To address this, we developed a novel composite solder by incorporating nickel-coated carbon fiber (Ni@CF) into the Sn–3.0Ag–0.5Cu (SAC305) solder connection. The study showed that Ni@CF effectively enhanced the stability and reliability of solder joints during multiple reflow processes. Compared with Ni@CF-free equivalents, Ni@CFs promoted the nucleation of interfacial IMC during the solid–liquid reaction and inhibited Ostwald ripening, leading to a refinement of the interfacial IMC grains. As a result, the interface was strengthened, and the shift of shear fracture to the brittle interface seen in the SAC305 solder joint with multiple reflows did not occur in the composite solder joint. Furthermore, carbon fiber strengthened the solder matrix through the load transfer and shear-off mechanisms, depending on its inclination angle with the shear plane. Consequently, the Ni@CFs-reinforced solder joints maintained a shear strength of over 42 MPa throughout ten reflow cycles, while the pristine SAC305 solder joint exhibited decreased shear strength to 33 MPa. This study provides new insights into composite solder joints’ stability and reinforcement characteristics when subjected to multiple reflows.

Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties

Based on the principles of micro-alloying and composite, the graphene reinforced Sn2.5Ag0.7Cu0.1Ce composite solder was designed. Ni nanoparticle-modified reduced graphene oxide (Ni-rGO) was prepared by thermal decomposition method, and the powder-melting method was proposed for the first time to prepare Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder. The microstructure, wettability, electrical resistivity, and mechanical properties of the composite solder were systematically studied. Results indicated that the Ni nanoparticles uniformly adhered to the rGO with a size of 26.3 nm. The effective incorporation of Ni-rGO into the solder matrix was achieved. The result broke the technical difficulty that graphene cannot be effectively added to low melting point metals. With the addition of Ni-rGO, the grain size gradually decreased, and the eutectic structures increased. Deep etching results revealed that columnar β-Sn was stacked from layered β-Sn, the addition of 0.05 wt% Ni-rGO led to an increase in sheet-like Ag3Sn within the eutectics. Additionally, Ni-rGO was found at the grain boundaries of composite solder, serving as nucleation sites for Ag3Sn and Cu6Sn5. At an addition of 0.05 wt%, the tensile strength reaches a maximum of 58.1 MPa, with elongation of 33.8%, surpassing the strength of commercial Sn3.0Ag0.5Cu solder. Therefore, the high-strength and tough composite solder was obtained. This study offered a new approach for the development of low-melting-point composite materials.

Mechanical properties and microstructure evolution of Sn–Bi-based solder joints by microalloying regulation mechanism

Sn–Bi based solders are used in electronic packaging for interconnection processes. However, the rate of research on the comprehensive performance of solders is difficult to match the rapid development of advanced manufacturing of integrated circuits, resulting in the inability to obtain interconnect structures with excellent reliability for electronic devices. To demand a more effective modification method, we chose to dope 1.0 wt % In element in Sn58Bi–1Sb alloy. The strength, micromechanical properties and creep resistance of the solder were improved due to the combined effect of solid solution strengthening and diffusely distributed second phase strengthening. Furthermore, the addition of In element dramatically improved the thermal properties and wettability due to the generation of Bi3In5 intermetallic compounds (88.9 °C) and the activation energy of the solder wettability reaction was reduced to 247.36 J/mol. Notably, the addition of In element increased the amount of β-Sn phase deviation and decreased the Schmid factor value of β-Sn phase, resulting in a significant increase in the strength and micro-zone creep resistance. Under the action of current, a large amount of uniform Bi particle deviations and sub-crystalline structures persist in the β-Sn phase of the Sn58Bi–1Sb1In solder matrix. In the Cu/Sn58Bi–1Sb1In/Cu joints, many Bi particles are staggered in the β-Sn phase. Since the resistivity of the β-Sn phase is smaller than that of the Bi phase, the energization process leads to a possible further increase of the local currents at certain locations in the β-Sn phase, which reduces the electromigration resistance of the β-Sn phase. After energization, the biphasic twin structure with excellent electromigration resistance starts to degrade. The results show that the doping of In element comprehensively improves the performance of Sn58Bi–1Sb solder. It opens up a new idea for the design of alloying modification of tin-bismuth based solder.

Counter-intuitive mechanical performance variation in aged low-temperature interconnections in electronic packaging

Different from the conventional aging induced continuous mechanical performance deterioration in solder joints, a counter-intuitive “decrease-increase-decrease” variation in shear strength with a peak value 12 MPa higher than the initial state was captured in aged low-temperature BGA structure Cu/Sn–58Bi/Cu solder joints. The first decrease in shear strength was dominated by the coarsening of Sn and Bi phases. The following increase in shear strength was rooted in the concurrent Bi subgrain strengthening, solid solution strengthening of Bi element in Sn-rich phase and precipitation strengthening induced by the Bi-rich phase particles. The eventual decrease in shear strength was ascribed to severely deteriorated interface between the solder matrix and intermetallic compound layer being the weaker site in the long time aged solder joint. This aging induced strengthening phenomenon is inspiring in mechanical performance optimization and reliability elevation of SnBi-based solder joints for the coming chiplet and heterogeneous integration packaging.

Microstructure, hardness, electrical, and thermal conductivity of SZCN solder reinforced with TiO2 and ZrO2 nanoparticles fabricated by powder metallurgy method

The microstructure and characterization of Sn–Zn–Cu–Ni (SZCN) solder alloy reinforced with TiO2 and ZrO2 nanoparticles (NPs) synthesized by powder metallurgy were investigated. Sn, Zn, Cu and Ni metallic powders were mixed mechanical by 10:1 ball to powder ratio with 300 rpm speed for 2 h. Then 0.5 wt% from nano ZrO2 or TiO2 was mixed by the same parameters with the mixed metal powder. The morphologies and microstructures development during the fabrication process was investigated by X-ray diffractometer (XRD), optical microscope (OM), and scanning electron microscope (SEM) with energy dispersive X-ray spectrometry (EDX). The results reveal an improved distribution of TiO2 or ZrO2 NPs in the SZCN matrix solder, which resulted in an improvement in its density. The analyses of microstructural demonstrated that the addition of TiO2 or ZrO2 NPs to SZCN solder results in the grain refinement of the β-Sn phase, besides the formation of Ni3Sn IMC with small size and uniform distribution. The microhardness was enhanced as a result of the addition of TiO2 or ZrO2 NPs. The experimental results showed that the SZCN-ZrO2 composite solder had the greatest hardness and stress exponent values due to its effectiveness in suppressing the growth of β-Sn grains and the pile-up of dislocations. Both the electrical and thermal conductivities were improved by incorporating TiO2 NPs compared to other solders.

Effect of Cetyl Trimethyl ammonium bromide (CTAB) amount on the Nanoindentation creep behaviour of Sn-cu-Y2O3 nanocomposite Lead-free solder

Sn-Cu-Y2O3 nanocomposite solder is synthesized from a citrate bath by pulse electrodeposition route. Y2O3 powder is synthesized from a sol-gel assisted combustion route. Different techniques such as SEM, XRD, and TEM are used to characterize Y2O3 powder. The particle size of Y2O3 powder is found to be 27 nm. The effect of adding cetyl trimethyl ammonium bromide (CTAB) on the synthesis of Sn-Cu-Y2O3 nanocomposite lead-free solder is studied. The amount of CTAB is varied for a particular amount of Y2O3 powder. It is carried out to find the exact ratio of CTAB for better dispersion of Y2O3 powder in the electrolytic bath. Because the distribution of reinforcement in the matrix which is associated with the dispersion of Y2O3 powder in the electrolyte is as important as the amount of reinforcement in the solder matrix. For the synthesis of nanocomposite solder, the optimum ratio of CTAB to Y2O3 is found to be 1:1. After the synthesis of nanocomposite solder, the influence of Y2O3 powder on the melting temperature of the solder is also studied. Incorporating Y2O3 has little effect on the melting point of the nanocomposite solder. Nanoindentation creep test results showed that the deposit at 0.2 A/cm2 (monolithic solder) has a lower creep resistance than the nanocomposite solders. Additionally, the creep resistance of the nanocomposite with a CTAB to Y2O3 ratio of 1:1 was higher.

Effect of Si3N4 nanoparticles on IMC as well as mechanical properties of Sn58Bi/Cu solder joints during thermal aging

This paper investigated the changes in microstructure, intermetallic compounds (IMC), and mechanical properties of Sn58Bi/Cu and Sn58Bi-0.6 Si3N4/Cu solder joints in the thermal aging process at 125 °C. With the increase of the thermal aging time, the Bi-phase was gradually coarsened, but the coarsening of the Bi-phase was suppressed after adding Si3N4 NPs. The thickness of the IMC increased continuously, and some areas even detached into the solder matrix, accompanied by gradual grain growth. For the samples with Si3N4 NPs, the IMC thickness significantly decreased, and the grain size was finer. Fractures mainly occur in the Bi-rich phase of the solder matrix following a brief period of thermal aging. However, as the aging time increases, the fracture location gradually shifts from the solder matrix to the IMC, resulting in intergranular and transgranular fractures. However, the shear strength of solder joints with added Si3N4 NPs was higher during the same aging period.

An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles

To address the demand for multilevel package, a low-melting-point high entropy alloy (HEA) solder was developed. It consists of 43In28Sn14Bi9Zn6Ag micro- and nano-particles with a melting point of about 62.80 °C. We obtained 43In28Sn14Bi9Zn6Ag nanoparticles by combining ultrasonic heating interaction with a "hot shock" process. Upon reflowing at 115 °C for 5 min, a Cu/Zn/Ag ternary intermetallic compound (IMC) formed at the interface between the solder and the copper substrate, leading to a shear strength of 40 MPa. The microstructure of this joint exhibits a complex composition with at least three phases, including Bi3In5 phase, Ag5Zn8 phase, and In0.2Sn0.8 solid solution. The stable Ag5Zn8 phase not only enhances the overall strength of the alloy matrix but also impedes the diffusion of In and Bi atoms, thereby preventing the segregation of the Bi3In5 phase. The high mixing entropy and pronounced lattice distortion in this high entropy alloy hinder the diffusion of elements within the solder matrix, mitigating the issue of excessive interfacial IMC growth. Consequently, the solder joints exhibit little degradation even after a high-temperature aging test. This high-entropy alloy solder has promising potential for multi-level chip stacking in 3D packaging.

Investigating the impact of cobalt incorporation on the transformation of Cu6Sn5 layer to (Cu, Co)6Sn5: Microstructural and mechanical insights

In this study, cobalt (Co) particles were incorporated as reinforcing agents into the Sn58Bi solder. The solderability of the solder and the strength of the solder joints were investigated. The results indicated that adding Co particles did not alter the low melting point characteristics of the Sn58Bi solder, yet its undercooling was reduced, and the wettability was enhanced. In the Sn58Bi/Cu solder joint, adding Co led to forming free (Cu, Co)6Sn5 intermetallic compound (IMC) and generating the CoSn2 phase through microalloying. The interfacial IMC was gradually transformed from a fan-shaped Cu6Sn5 to a flatter layer-like (Cu, Co)6Sn5 IMC, eventually exhibiting a coral-like structure with increased Co content. Adding Co particles increased the thickness of the IMC layer, but at low levels, the Co could refine the IMC grains. Simultaneously, implementing grain refinement and Orowan strengthening resulted in heightened microhardness and shear strength. In the shear test, the fracture of solder joints predominantly transpired within the solder matrix. Excessive Co particles were prone to aggregating within the solder, forming irregular block-shaped (Cu, Co)6Sn5. Concurrently, the coral-like IMC at the interface led to a decline in the mechanical performance of the solder joints, with some interfacial IMC being exposed in the fracture region.

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

PurposeThis study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.Design/methodology/approachThe BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.FindingsThe study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.Practical implicationsInspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.Originality/valueLimited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate

The aim of this study was to characterize a Zn-Mg type soldering alloy and direct soldering of SiC ceramics with a copper substrate. The Zn1.5Mg solder exerts a wider melting interval. The temperature of the eutectic reaction was 365 °C, and the liquidus temperature was 405 °C. The microstructure of the soldering alloy is comprised of a zinc matrix. Segregation of binary eutectics in the form of (Zn) + Mg2Zn11 lamellas occurred on the boundaries of Zn grains. Additionally, the presence of a MgZn2 magnesium phase was observed in the solder matrix. The SiC/solder bond was formed due to magnesium distribution from solder to the boundary with SiC ceramics, where magnesium reacts with silicon, which is infiltered in SiC ceramics. By a mutual interaction, a new Mg2Si phase is formed. An interaction between the molten zinc solder and Cu substrate occurred on the boundary of the Cu/substrate joint at the formation of a transition zone composed of two new phases, namely the γCu (Cu5Zn8) non-wettable phase type, approximately 30 µm wide, and a wettable (CuZn4) phase type ε, approximately 12 µm wide. The average shear strength of a combined SiC/Cu joint fabricated using Zn1.5Mg solder was 44 MPa.

Significant inhibition of interfacial Cu6Sn5 IMC and improvement of solder joint strength and reliability by applying (111) nanotwinned Cu substrate and vacuum soldering

In this research, (111) oriented nanotwinned Cu (nt-Cu) substrates, combined with vacuum soldering, were utilized to enhance the strength and reliability of the solder joints. The wettability of the composite solder Sn1.0Ag0.5Cu-Si3N4 (SAC105-Si3N4) was improved on the (111) nt-Cu substrates and the oxidization of the molten solder was avoided by the vacuum environment, ensuring the formation of regular and uniform solder joints. The (111) nt-Cu substrates, characterized by their low surface energy, are demonstrated to be highly efficient in restricting the growth of interfacial IMCs, and this effects becomes particularly pronounced in three-dimensional (3D) solder joints following extended high-temperature aging. In addition, with vacuum soldering, a continuous and uniform interfacial structure was obtained, which is essential for upgrading the reliability of 3D solder joints. Furthermore, the electron back scatter diffraction (EBSD) testing of the solder matrix and interface formed on the nt-Cu substrates revealed that the c-axis of the β-Sn grains was parallel to the (111) nt-Cu substrates, and that the c-axis of the Cu6Sn5 grains was approximated to be perpendicular to the (111) nt-Cu substrates in an air environment. Finally, the shear strength and fracture morphology of the solder joints were evaluated. The macroscopic voids inside the solder joints were suppressed under vacuum, and the solder joints formed on the (111) nt-Cu substrates provided the highest shear strength.

Research of joining the SiC and Cu combination by use of SnTi solder filled with SiC nanoparticles and with active ultrasound assistance

<p>The aim of this study was to characterize a Sn-Ti solder alloy containing 6 wt.% SiC nanoparticles and evaluate its use for direct soldering of SiC ceramics to a copper (Cu) substrate. Soldering was performed with direct ultrasound activation. The average tensile strength of the solder alloy was 17.1 MPa. Differential Thermal Analysis (DTA) analysis revealed an apparent transition at 234 ℃, corresponding to a eutectic reaction within the Sn-Ti binary system, indicating structural changes in the solder. The solder matrix consisted primarily of pure tin, while titanium combined with SiC nanoparticles to form a TiC phase. The existence of this phase was confirmed by energy dispersive X-ray spectroscopy (EDX) and X-ray diffraction (XRD) analysis of the solder. The bond at the interface between the SiC ceramic substrate and the solder was formed through diffusion and chemical reactions. The XRD analysis of the fractured surface from the SiC side confirmed the formation of phases such as TiC, Ti<sub>2</sub>Sn, CTi<sub>2</sub>, CuSn, SiC, and Cu<sub>6</sub>Sn<sub>5</sub>; the TiC and CTi<sub>2</sub> phases resulted from the interaction of active Ti in the solder with the SiC ceramic surface. The bond at the Cu substrate interface formed due to the high solubility of tin in the solder and the formation of probable CuSnTi and CuSnTi3<sub>5</sub> phases, along with a mixture of Sn + η Cu<sub>6</sub>Sn<sub>5</sub> solid solution. The average shear strength of the SiC/Cu joint, fabricated using SnTi3 solder with 6 wt.% SiC nanoparticles, was 21.5 MPa.</p>

Intermetallic compound growth behavior and mechanical performance in Sn58Bi/Cu solder joint bearing Mg particles incorporation during thermal aging

The microstructure and intermetallic compound (IMC) growth in Sn58Bi/Cu and Sn58Bi-0.4 Mg/Cu solder joints were examined in this study under varied thermal aging time (6, 12, 18, 24, and 30 h) at 120 °C. The Shear test was conducted to assess the solder joint mechanical performance. The results indicated that the precipitation of the Bi phase in Sn58Bi/Cu and Sn58Bi-0.4 Mg/Cu solder joints was not significantly inhibited by adding Mg as aging time increased. The IMC layer thickness of both solder joints increased as the aging time increased, but the Cu3Sn IMC thickness in Sn58Bi-0.4 Mg/Cu solder joint was consistently thinner than that in Sn58Bi/Cu joint. The temporal evolution of the Cu3Sn IMC layer was investigated, and it was found that the inclusion of Mg particles reduced the diffusion coefficient of Cu3Sn IMC. Furthermore, the shear test revealed that throughout the initial phases of thermal aging, fractures occurred within the solder matrix for both joints. As thermal aging time increased, fractures extended into the IMC layer, accompanied by transgranular and intergranular fractures. Simultaneously, adding Mg particles delayed brittle fracture in the solder joints, enhancing their mechanical properties.

Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing

Cu-cored solder interconnects have been demonstrated to increase the performance of interconnect structures, while the quantitative understanding of the effect of the Cu-cored structure on microstructure evolution and atomic migration in solder interconnects is still limited. In this work, the effect of the Cu-cored structure on phase migration and segregation behavior of Sn-58Bi solder interconnects under electric current stressing is quantitatively studied using a developed phase field model. Severe phase segregation and redistribution of Bi-rich phase are observed in the Cu-cored Sn-58Bi interconnects due to the more pronounced current crowding effect near the Cu core periphery. The average current density and temperature gradient in Sn-rich phase and Bi-rich phase decrease with an increase in the diameter of the Cu core. The temperature gradient caused by Joule heating is significantly reduced owing to the presence of the Cu core. Embedding of the Cu core in the solder matrix could weaken the directional diffusion flux of Bi atoms, so that the enrichment and segregation of the Bi phase towards the anode side are significantly reduced. Furthermore, the voltage across the solder interconnects is correspondingly changed due to the phase migration and redistribution.

Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation

The heterogeneous nucleation on the limited (Pd,Ni)Sn4 compound observed at the solder/Pd/Ni(P) interface greatly reduces the Sn undercooling. The undercooling reduction of Sn is the key resulting a single-grain structure for the Sn-rich Sn1.5Ag0.1Cu micro-bumps. Without (Pd,Ni)Sn4 compound formed at the solder/Pd/Ni(P) interface, the Sn-rich Sn1.5Ag0.1Cu micro-bumps has a polycrystalline grain structure. Compared to the solder matrix with poly-grains structure, the single-grain solder matrix restricts electromigration atomic flux and the consumption of the Ni(P) layer, which mitigates EM effect and prolongs EM life time of the micro-bumps. Ni3P layer formed at the solder/Pd/Ni(P) interface greatly influence EM behavior and lifetime.

Enhancement of SAC105 solder for vacuum soldering with Cu substrates through incorporation of activated Ti nanoparticles

This study incorporated activated Ti nanoparticles (Ti NPs) into Sn1·0Ag0·5Cu (SAC105) solder for vacuum soldering with Cu substrates. The wettability, microstructure, interfacial, and mechanical properties of SAC105-xTi (x = 0.1, 0.2, 0.3, 0.4, 0.5 wt%) composite solder were systematically investigated. The results showed that adding Ti NPs improved the wettability of SAC105 solder, in which the wetting angle of SAC105-0.3Ti solder was 19.51°. Additionally, Ti NPs helped to refine the microstructure and inhibited the growth of interfacial intermetallic compounds (IMC). The shear strength of SAC105/Cu joints increased and then decreased with increasing Ti NPs content, and the optimum shear strength was obtained for SAC105-0.3Ti/Cu joints at 27.98 MPa. The strength of the solder matrix and the IMC layer was altered by adding Ti NPs, resulting in a modification of the fracture path of the joint, bringing it closer to the IMC layer. Excessive addition of Ti NPs could lead to their agglomeration within the joints and result in damage to the mechanical properties of the joints. Furthermore, adding Ti NPs increased the microhardness of SAC105 solder.

The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

In recent years, in order to adapt to the trend of low-temperature assembly and integration, low-temperature hybrid solders with multiple elements added to the tin solder matrix have been investigated. In this regard, the morphology and size of intermetallic compounds (IMCs) are altered by adding some alloying elements, and the strength of solder joints is improved to some extent. Different pad surface treatments affect the growth of IMC, which leads to various failure modes in interconnect solder joints. Therefore, it is necessary to study the interfacial reaction, microstructure and mechanical properties of hybrid solder and different metal pads to explore the growth mechanism of IMC and the failure modes of solder joints. In this paper, mixed Sn–3Ag-0.5Cu/Sn–58Bi low-temperature solder joints on Au/Ni/Cu (ENIG) and Au/Pd/Ni/Cu (ENEPIG) substrates are investigated. The results show that the addition of palladium element can change the IMC morphology, refine the grain size of the hybrid solder joints, and affect the fracture failure mode of the solder joints under shear force. The average shear strength is significantly higher than that of solder joints with ENIG surfaces under different process parameters. Thermodynamic calculations of enthalpy change and the effect of Jackson's parameter α value on IMC morphology are also investigated in this paper. The addition of palladium elements increases the α value and is more favorable to the formation of columnar grains. This provides guidance for the grain growth of IMC in hybrid solder joints with added alloying elements.

Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package

Alloying effects of Nickel and Bismuth in SAC solder to achieve mechanical and microstructural evolution were investigated by comparing three different chemical composition of solders. Sn-3.0Ag-0.5Cu (SAC305) is the most commonly used for Pb-free solder and solder balls are based on Sn-Ag-Cu alloy composition. Compositions of solder balls were Sn-3.0Ag-0.5Cu (SAC305), Sn-1.2Ag-0.5Cu-0.05Ni (SAC1205N) and Sn-Ag-Cu-Ni-Bi based solder (SACNB). Organic solderability preservative (OSP) surface finished substrate, ball grid array (BGA) package arranged by 300 ㎛ diameter solder ball and Type 4 solder paste were used. Solder ball shear test of the BGA package was conducted before the reflow soldering. Board level package bonding process was carried out by hot air reflow soldering. Void content of the BGA solder joint was investigated after soldering. The microstructure evolution before and after thermal cycle test (TCT) was observed using scanning eletron microscopy (SEM) and energy dispersive spectroscopy (EDS). After TCT, intermetallic compound (IMC) refinement and solid solution strengthening effects of Bi element addition were observed in the solder matrix, and also any segregation of Bi element was not founded. Based on these result, it was found that the solder joint reliability of the middle and low temperature solder joints was improved.