Abstract
The heterogeneous nucleation on the limited (Pd,Ni)Sn4 compound observed at the solder/Pd/Ni(P) interface greatly reduces the Sn undercooling. The undercooling reduction of Sn is the key resulting a single-grain structure for the Sn-rich Sn1.5Ag0.1Cu micro-bumps. Without (Pd,Ni)Sn4 compound formed at the solder/Pd/Ni(P) interface, the Sn-rich Sn1.5Ag0.1Cu micro-bumps has a polycrystalline grain structure. Compared to the solder matrix with poly-grains structure, the single-grain solder matrix restricts electromigration atomic flux and the consumption of the Ni(P) layer, which mitigates EM effect and prolongs EM life time of the micro-bumps. Ni3P layer formed at the solder/Pd/Ni(P) interface greatly influence EM behavior and lifetime.
Published Version
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