Single Event Burnout Research Articles

The mechanism of degradation and failure in NiO/ β -Ga2O3 heterojunction diodes induced by the high-energy ion irradiation

This work investigated the single-event effects (SEE) of NiO/β-Ga2O3 heterojunction diodes (HJDs) irradiated by 1.86 GeV tantalum ions with linear energy transfer over 80 MeV cm2/mg. The HJDs exhibited radiation responses with the early single-event leakage current (SELC) degradation until the fatal single-event burnout (SEB) failure, which was far below their breakdown voltages. Meanwhile, the surface morphology revealed the SELC damage expressed as burnout of topside NiO and metal stacks, while the SEB damage was observed as a burned hole in the β-Ga2O3 epitaxial layer. According to technology computer aided design simulations, the thicker p-type region in HJDs could further alleviate the electric field crowding effect exacerbated by the heavy-ion strike because of the extension of charge distribution in the p-type region. The SEB threshold was raised to 250 V by thickening the NiO layer to 300 nm. As for the SELC degradation process along with the burnout of topside stacks in HJDs, we supposed the probable reason was the intolerance of NiO to the high electric field under the SEE. This paper analyzed the SEE mechanism in β-Ga2O3 diodes and paved the way for heavy-ion irradiation hardening.

Single-Event Burnout Effects of Complementary LDMOS Devices in High-Voltage Integrated Circuits

Single-Event Burnout Effects of Complementary LDMOS Devices in High-Voltage Integrated Circuits

Research on the simulation of single-event burnout in 1.2-kV GaN CAVET

Research on the simulation of single-event burnout in 1.2-kV GaN CAVET

Study on the Single-Event Burnout Effect Mechanism of SiC MOSFETs Induced by Heavy Ions

As a prominent focus in high-voltage power devices, SiC MOSFETs have broad application prospects in the aerospace field. Due to the unique characteristics of the space radiation environment, the reliability of SiC MOSFETs concerning single-event effects (SEEs) has garnered widespread attention. In this study, we employed accelerator-heavy ion irradiation experiments to study the degradation characteristics for SEEs of 1.2 kV SiC MOSFETs under different bias voltages and temperature conditions. The experimental results indicate that when the drain-source voltage (VDS) exceeds 300 V, the device leakage current increases sharply, and even single-event burnout (SEB) occurs. Furthermore, a negative gate bias (VGS) can make SEB more likely via gate damage and Poole–Frenkel emission (PF), reducing the VDS threshold of the device. The radiation degradation behavior of SiC MOSFETs at different temperatures was compared and analyzed, showing that although high temperatures can increase the safe operating voltage of VDS, they can also cause more severe latent gate damage. Through an in-depth analysis of the experimental data, the physical mechanism by which heavy ion irradiation causes gate leakage in SiC MOSFETs was explored. These research findings provide an essential basis for the reliable design of SiC MOSFETs in aerospace applications.

Single-event burnout in β-Ga2O3 Schottky barrier diode induced by high-energy proton

Single-Event Burnout (SEB) can cause hard damage to devices, leading to permanent failure. However, previous studies have rarely explored the effects of high-energy proton irradiation-induced SEB in β-Ga2O3 Schottky Barrier Diode (SBD), and the underlying mechanisms remain largely unexplored. Experimental results indicate that the reverse bias voltage during irradiation is a critical factor influencing the failure of β-Ga2O3 SBD. Compared to 300 MeV proton irradiation without bias, the introduction of a 300 V reverse bias voltage results in a significant reduction in forward current density (JF). When the reverse bias voltage reaches 400 V or higher, the 300 MeV proton induces SEB in the device. The SEM image of the damaged region reveals that the irradiated device has “voids” formed due to the melting of the Ga2O3 material. Geant 4 and TCAD simulation results indicate that the burnout phenomenon is caused by the elevated lattice temperature inside the device, which results from the implantation of secondary particles under a high reverse bias voltage. As the reverse bias voltage increases, the maximum lattice temperature of β-Ga2O3 SBD also rises. When the reverse bias voltage is sufficiently high, the local lattice temperature inside the device reaches the melting point of Ga2O3 material, ultimately leading to SEB.

Research on single event effects and hardening design of LDMOS transistors

In this paper, an N-type Lateral Diffused Metal Oxide Semiconductor (LDMOS) device was designed using a heavily doped P+ well and drain N-type buffer layer structure in the BCD process. The hardened mechanism of heavily doped P+ well and drain N-type buffer layer structures was simulated and analyzed using a TCAD device simulator. To verify the anti-SEE performance of the LDMOS, the irradiation test was conducted using Ta ion (LET = 79.2 MeV·cm−2 mg−1). The results show that increasing P+ well doping concentration and using buffer layer structure can increase the single event burnout (SEB) voltage of high-voltage LDMOS devices. SEB did not occur within the full operation voltage range.

Atmospheric neutron-induced single event burnout characterization of 4.5 kV Si IGBTs with spallation neutron irradiation

The atmospheric neutron-induced single event burnout (SEB) is observed for 4.5 kV Si IGBTs with trench gate structure by conducting spallation neutron source irradiation. The SEB is manifested as a random failure and is strongly related to the bias voltage. The SEB failure rates of two different Si IGBTs at different bias voltages are calculated based on the experimental results. It shows that the failure rates increase exponentially with bias voltages. For two different kinds of IGBTs, the atmospheric neutron-induced failure rate at an altitude of 4000 m is 0.855 FIT and 4.39 FIT, respectively, when biased at 60% of the rated voltage. When the bias voltage is increased to 64% of the rated voltage, the corresponding failure rates are increased to 24.7 FIT and 47.6 FIT. Furthermore, the SEB mechanisms for Si IGBTs are investigated by TCAD simulations.

Unveiling microstructural damage for leakage current degradation in SiC Schottky diode after heavy ions irradiation under 200 V

Single-event burnout and single-event leakage current (SELC) in silicon carbide (SiC) power devices induced by heavy ions severely limit their space application, and the underlying mechanism is still unclear. One fundamental problem is lack of high-resolution characterization of radiation damage in the irradiated SiC power devices, which is a crucial indicator of the related mechanism. In this Letter, high-resolution transmission electron microscopy (TEM) was used to characterize the radiation damage in the 1437.6 MeV 181Ta-irradiated SiC junction barrier Schottky diode under 200 V. The amorphous radiation damage with about 52 nm in diameter and 121 nm in length at the Schottky metal (Ti)–semiconductor (SiC) interface was observed. More importantly, in the damage site the atomic mixing of Ti, Si, and C was identified by electron energy loss spectroscopy and high-angle annular dark-field scanning TEM. It indicates that the melting of the Ti–SiC interface induced by localized Joule's heating is responsible for the amorphization and the possible formation of titanium silicide, titanium carbide, or ternary phases. The mushroom-like hillock in the Ti layer can be attributed to Rayleigh–Taylor instability, as another evidence for ever-happened localized melting near the Schottky interface. These modifications at nanoscale in turn cause localized degradation of the Schottky contact, resulting in permanent increase in leakage current. This experimental study provides very valuable clues for a thorough understanding of the SELC mechanism in SiC diodes.

Research of single-event burnout in vertical Ga2O3 FinFET by low carrier lifetime control

This paper presents the 2D simulations of single-event burnout (SEB) in vertical enhancement-mode gallium oxide (Ga2O3) fin-shaped channels field-effect transistor (FinFET) by low carrier lifetime control (LCLC) method. The correctness of the structure parameters and simulated physical models are verified by the basic electrical characteristics in experiments. The SEB simulations show that the most sensitive region to heavy ion is the narrow channel region. The SEB failure is due to the diffusion of a large number of electron–hole pairs induced by heavy ion into a strong electric field region, resulting in a large transient current density to cause the thermal failure. Afterwards, the influences of the narrow channel region width on basic characteristics and SEB performance are discussed. Then, the SEB hardening mechanism of LCLC is studied that the electric field peak in the top of the structure can be effectively reduced, and the transient current caused by second avalanche is restrained. In addition, the basic characteristics with LCLC are proved to be hardly influenced in Ga2O3 FinFET. Finally, the carrier lifetime value and local control region are studied that the SEB hardening performance can be significantly improved by a large enough control area with a low carrier lifetime.

Lateral 1200V SiC schottky barrier diode with single event burnout tolerance

For a power device to be used in space, it must be able to recover from a single event effect caused by heavy ion radiation. Conventional vertical silicon carbide (SiC) power devices such as automotive diodes and MOSFETs, can only meet this requirement if they are heavily derated, a 1200 V device typically unusable above 200 V. In this paper, a lateral RESURF Schottky diode has been designed in TCAD simulation using a radiation-hard (rad-hard) by design methodology. By preventing anode-to-cathode shorting that occurs in a vertical drift region, the lateral design is shown to recover after a heavy ion traverses the device with a linear energy transfer (LET) of 60 MeV·cm2/mg, while the device is blocking 1200 V. The design splits the drift region into a higher doping zone closer to the cathode (Zone 2) of 1.5×1017 cm−3 and a lower doping zone closer to the anode (Zone 1) of 1×1016 cm−3. The electric field spikes were reduced while the device was recovering. This design keeps the local temperature in the device to under 1000 K if the heavy ion penetrates the device in a direction perpendicular to the surface. Other entry positions and directions are also simulated and a maximum temperature of 1733 K occurs when the ion path is horizontal, entering at 1 μm below the surface. However, this temperature peak occurs at the cathode, which is not expected to lead to lasting leakage damage. A deep P+ pillar embedded into the anode acts as a collector for holes generated during the single event. Simulations show that a deeper P+ pillar, to a depth of up to 5 μm, reduces the hole density in the N-drift region and P-epi layer during recovery. This also allows the Zone 1 doping to be increased to as much as 5×1016 cm−3, thereby reducing on-state losses.

Research on Single-Event Burnout Reinforcement Structure of SiC MOSFET.

In this paper, the single-event burnout (SEB) and reinforcement structure of 1200 V SiC MOSFET (SG-SBD-MOSFET) with split gate and Schottky barrier diode (SBD) embedded were studied. The device structure was established using Sentaurus TCAD, and the transient current changes of single-event effect (SEE), SEB threshold voltage, as well as the regularity of electric field peak distribution transfer were studied when heavy ions were incident from different regions of the device. Based on SEE analysis of the new structural device, two reinforcement structure designs for SEB resistance were studied, namely the expansion of the P+ body contact area and the design of a multi-layer N-type interval buffer layer. Firstly, two reinforcement schemes for SEB were analyzed separately, and then comprehensive design and analysis were carried out. The results showed that the SEB threshold voltage of heavy ions incident from the N+ source region was increased by 16% when using the P+ body contact area extension alone; when the device is reinforced with a multi-layer N-type interval buffer layer alone, the SEB threshold voltage increases by 29%; the comprehensive use of the P+ body contact area expansion and a multi-layer N-type interval buffer layer reinforcement increased the SEB threshold voltage by 33%. Overall, the breakdown voltage of the reinforced device decreased from 1632.935 V to 1403.135 V, which can be seen as reducing the remaining redundant voltage to 17%. The device's performance was not significantly affected.

Response of commercial Si-IGBT to neutrons and direction dependency

Silicon-insulated gate bipolar transistors (Si-IGBTs) are widely used for power control. In this study, we measured the energy deposited inside a commercial device with neutrons irradiation from 252Cf. We irradiated the device from the sealing and heat sink sides to evaluate the directional characteristics. A radiation simulation analysis was performed to understand the measurement results. The experiment and simulation showed that energy deposition in the device occurs through elastic scattering of neutrons and nuclear reactions. In particular, protons were generated by elastic scattering in the sealing material when the device was irradiated from the sealing side. Thus, the effect of neutrons on commercial Si-IGBTs is due to not only reactions inside the device but also secondary particles from the sealing material. When irradiated with high-energy neutrons, the knocked-out protons from sealing possibly cause single-event burnout (SEB). Therefore, the probability of SEB may depend on the direction of neutron incidence.

Study on the single-event burnout mechanism of p-GaN gate AlGaN/GaN HEMTs

In this work, the single-event burnout (SEB) mechanism of p-GaN gate AlGaN/GaN HEMTs has been studied systematically. The irradiation experiment was carried out based on Ta ions with high linear energy transfer of 75.4 MeV/(mg/cm2), a standard criterion for commercial space applications. It is clearly observed that both the drain current and gate current increase during the irradiation. With the increasing drain bias, the device burns out eventually. Technology computer-aided design simulation was used to explore the possible burnout mechanism. The local high electric field peak induced by the electron and hole redistribution was proposed to explain the permanent damage. When heavy ions impact the device, electron–hole pairs are formed. With the aid of a horizontal electric field across the channel, electrons and holes move toward the drain and gate, respectively. The accumulation of electrons and holes around the drain edge and gate edge induces the local high electric field, which is even higher than the intrinsic breakdown electric field of GaN and AlGaN. The scanning electron microscope results verified the proposed SEB mechanism. This research offers significant theoretical and experimental insights for evaluating the reliability of GaN power devices against high-energy single-event burnout in aerospace applications.

Failure analysis of heavy ion-irradiated silicon carbide junction barrier Schottky diodes

An analysis of damage, including single event burnout (SEB) and single event leakage current (SELC) caused by heavy ion irradiation in silicon carbide (SiC) junction barrier Schottky diodes (JBSDs), was performed using Auger electron spectroscopy (AES), emission microscope (EMMI), focused ion beam (FIB), transmission electron microscopy (TEM) and other methods. The damage of SEB extending from the Schottky contact through the epitaxial layer to the SiC substrate was observed. The damage causing SELC was related to the micro-burnout of the Schottky contact. It was concluded that the damage of Schottky contact was induced by incident high-energy particles under a large electric field, forming a leakage current path, resulting in SEB and SELC in the SiC device.

A Brief Review of Single-Event Burnout Failure Mechanisms and Design Tolerances of Silicon Carbide Power MOSFETs

Radiation hardening of power MOSFETs (metal oxide semiconductor field effect transistors) is of the highest priority for sustaining high-power systems in the space radiation environment. Silicon carbide (SiC)-based power electronics are being investigated as a strong alternative for high power spaceborne power electronic systems. SiC MOSFETs have been shown to be most prone to single-event burnout (SEB) from space radiation. The current knowledge of SiC MOSFET device degradation and failure mechanisms are reviewed in this paper. Additionally, the viability of radiation tolerant SiC MOSFET designs and the modeling methods of SEB phenomena are evaluated. A merit system is proposed to consider the performance of radiation tolerance and nominal electrical performance. Criteria needed for high-fidelity SEB simulations are also reviewed. This paper stands as a necessary analytical review to intercede the development of radiation-hardened power devices for space and extreme environment applications.

Study of the mechanism of single event burnout in lateral depletion-mode Ga2O3 MOSFET devices via TCAD simulation

This study investigates the sensitive region and safe operation voltage of single-event burnout (SEB) in lateral depletion-mode Ga2O3 MOSFET devices via technology computer aided design simulation. Based on the distribution of the electric field, carrier concentration, and electron current density when SEB occurs, the radiation damage mechanism of SEB is proposed. The mechanism of SEB in Ga2O3 MOSFET was revealed to be the result of a unique structure without a PN junction within it, which possesses gate control ability and exerts a significant influence on the conduction of the depletion region.

Single-event burnout in homojunction GaN vertical PiN diodes with hybrid edge termination design

GaN devices play a major role in modern electronics, providing high-power handling, efficient high-frequency operation, and resilience in harsh environments. However, electric field crowding at the edge of the anode often limits its full potential, leading to single-event effects (SEEs) at lower bias voltages under heavy ion radiation. Here, we report on the performance of homojunction GaN vertical PiN diodes with a hybrid edge termination design under heavy ion irradiation, specifically, oxygen ions, chlorine ions, Cf-252 fission fragments, and alpha particles from an Am-241 source. The unique hybrid edge termination (HET) design provides better electric field management, preventing breakdown from occurring at the edge of the anode at lower voltages. The results of this study reveal that these devices exhibit excellent tolerance to 12-MeV oxygen and 16-MeV chlorine ions, owing to their low linear energy transfer (LET) and range in GaN. However, single-event burnout (SEB) is observed during the Cf-252 exposure at about 50% of the diodes' electrical breakdown voltage due to the presence of higher LET and longer-range ions. Optical and scanning electron microscopy (SEM) reveal that the damage that caused by SEB lies close to the center of these devices rather than the anode edge. Devices with junction termination extension (JTE) instead of HET edge termination also show similar SEB when irradiated with Cf-252 fission fragments. Physical damage due to SEB occurs at the edge of the anode for these devices. These comparative results show the benefits of HET for enhancing the resistance of GaN-based PiN diodes to heavy ion irradiation.

A Source Segmented LDMOS Structure for Improving Single Event Burnout Tolerance Based on High-Voltage BCD Process

A Source Segmented LDMOS Structure for Improving Single Event Burnout Tolerance Based on High-Voltage BCD Process

Cosmic Radiation Reliability Analysis for Aircraft Power Electronics

Cosmic Ray induced failures are a major concern for the electronic system reliability of airborne and space systems. Power system voltages on aerospace platforms are on a steady upward trend. High voltage power converters suffer from Single Event Burnout failures caused by cosmic rays. The established standards propose a scaling factor based on measured background galactic cosmic rays intensity at operating altitude to apply de-rating factors. The radiation environment in the atmosphere can be increased due to the cascading of primary solar energetic particles during solar eruptions. In this work, the altitude profile of the radiation environment is simulated using a GEANT4 Monte-Carlo code. The failure rates due to both background Galactic Cosmic Rays and Solar Energetic Particles are quantitatively evaluated. Further to the known influence of geomagnetic shielding of cosmic rays, the geographical distribution of cosmic rays at flight altitudes of 10 km are also presented. The estimated cosmic ray intensity can then be combined with experimentally measured failure rate data to predict the impact on the reliability of power converters, giving a new level of accuracy in the modeling of such failure mode in more electric aircraft applications. It is shown for the first time in the scientific literature by using experimental data and state-of-the-art models, that the solar energetic particles storms fluxes vastly exceed the recommended standard and constitute a risk for the power electronics reliability.

Single-event burnout resilient design of 4H-SiC MOSFETs through staircase-like buffer layer

With the rapid development of SiC materials, high-power devices such as SiC MOSFETs have been widely used in aerospace, new energy, nuclear applications, and other fields. This places higher demands on their reliability, especially about radiation effects. This paper proposes a 4H-SiC staircase-like buffer layer MOSFET (SBL-MOSFET) with a hardened structure against single-event burnout (SEB). A comparison is made with conventional VD-MOSFET, gauss buffer layer MOSFET (GBL-MOSFET), and double buffer layer MOSFET (DBL-MOSFET) through TCAD simulations. The performance of the SBL-MOSFET against single-event burnout is studied by investigating the electric field distribution, impact ionization rate, hole concentration, and lattice temperature. The simulation results demonstrate that the staircase-like buffer layer structure effectively improves the distribution of high electric field, reduces the impact ionization rate, and thus increases the SEB threshold voltage compared to other structures. The proposed SBL-MOSFET exhibits a 67.5 % improvement in single-event burnout threshold voltage compared to the conventional VD-MOSFET, with slight degradation of breakdown voltage and leakage current. Meanwhile, there is no significant change in other electrical parameters.