Tantalum silicide (TaSi 2) thin films were deposited on n-type silicon single crystal substrates using a dual electron-gun system and with Ta and Si targets. The thicknesses of TaSi 2 thin films considered in this study are in the range 200–500 nm, respectively. The TaSi 2/Si samples were annealed at temperature 1173 K for 2 h in a vacuum of 10 −8 mbar. The structure of the tantalum silicide thin films was investigated by X-ray diffraction (XRD). X-ray diffraction results show changes in the structure of TaSi 2 thin films from amorphous to crystalline after annealing. According to XRD analysis, a complete conversion to single-phase disilicide TaSi 2 was achieved from a sample composition of Ta:Si = 1:2. DC conductivity was measured for the TaSi 2 thin films in the temperature range 300–900 K before and after annealing. It has been observed that the DC conductivity and activation energy was affected by changing the TaSi 2 film thickness and by annealing. The experimental results indicate that, the conduction phenomena of the investigated sample proceeded via two distinct mechanisms. The first one in the low-temperature range T < 500 K can be described by thermally-assisted tunneling of the carriers in the localized states near the band edge. The value of the pre-exponential factor before and after annealing is less than 10 4 Ω −1 cm −1. The other process appears in the high temperature region T > 500 K, where thermally activated conduction occurs through the extended states. Here the value of the pre-exponential factor before and after annealing is larger than 10 4 Ω −1 cm −1. The conductivity is greater in the crystalline phase than in the amorphous phase. The activation energy Δ E for our films before and after annealing is increased with increasing film thickness.