Using a hybrid thermal plasma reactor for a new CVD process, thick SiC layers were successfully deposited at a rate of {approx}500 {mu}m/h on a graphite substrate from SiCl{sub 4} and CH{sub 4} under soft vacuum ({approx}2.7 {times} 10{sup 4} Pa). The process is performed typically under flow rates of SiCl{sub 4} = 1.5 g/min and CH{sub 4} = 300 cm{sup 3}/min and deposition temperatures of 1,000{degree} to 1,100{degree}C. The effects of deposition conditions on certain characteristics of the deposited layers were investigated. SEM revealed that the appearance of the deposited layers strongly depended on the substrate position. The prepared layers were dense and nearly stoichiometric {beta}-SiC with (100) preferred orientation. A new method for measuring substrate temperature is also reported, and grown characteristics are discussed.
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