Recently, the semiconductor industry has seen significant technology and product development in application areas such as automotive, datacom, telecom and automation. System demands such as higher power density, higher switching efficiency and smaller form factors are becoming more important to reduce effective carbon footprint. Consequently, a new 48V system design has gained lot of attention. For example, the applicability of the 48V design/architecture was seen primarily in automotive mild hybrid cars and data center power delivery. In the world of automotive, degree of electrification, comfort features and advanced driver assistance systems (ADAS) in a car, result in need for higher total power budget. However, existing vehicle power tree is powered directly from a 12V lead acid battery to the mechanical auxiliary loads (typically <5-7 kW) such as water and oil pumps, climate compressor, active roll control, headlights and taillights. This, along with stricter emission norms from Corporate Average Fuel Economy (CAFE) standards and power hungry ADAS systems make it challenging to improve efficiency. Data centers offer services such as data storage, processing, networking and distribution. To manage these services, operators need power in the order of several 100’s of MW. As much as 40% of the operating costs of the data center comes from the energy needed to power and cool racks of servers. Amid the growing service demand, increasing efficiency and power density has become a priority for data center operators. On average, approximately 30-35% of power is wasted in the conversion from the AC grid to the microprocessors of an individual server. However, to realize system benefits, packaging technologies must not limit achievable electrical and thermal benefits. Historically, power device packaging has evolved from through hole packages such as TO247 and TO220 with long leads to surface mount components with shorter leads such as D2PAK, DPAK and SO8. Further, leaded packages have been replaced with lead-less surface mount options such as TOLL and PQFN, offering higher levels of integration. Package innovation has always been driven to improve parasitic resistances, inductances, thermal resistances and reliability. This presentation will explore some of the recent trends and new ideas in packaging technologies and their potential for addressing system performance requirements.
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