Abstract Particle-packed epoxy materials are widely used to improve the thermal conductivity of insulation materials. However, the addition of fillers increases the viscosity of the composite which reduces its operability, and is not conducive to the packaging of power electronic equipment such as electric transformers and reactors. Multi-scale particle compounding is one of the effective methods to enhance the co-processing performance of materials by reducing the friction between particles and epoxy matrix while forming an effective thermal conductivity network. Three types of spherical alumina sized around 4 μm, 38 μm, and 125 μm were used as fillers to study the fluidity, thermal conductivity, and dielectric properties of single-filled and ternary compounds. The results showed that the ternary particle composite reduced the viscosity of the precursor by up to 68.8%, achieving a synergistic improvement in operability, thermal conductivity, and electrical performance.