Schottky-barrier Thin-film Transistors Research Articles

Insight into the evolution of electrical properties for Schottky-barrier IGZO thin-film transistors with Cu-based Schottky contacts

In this work, we performed systematic electrical characterization and analysis of indium–gallium–zinc oxide (IGZO) Schottky-barrier thin-film transistors (SBTFTs) with different Cu-based Schottky contact structures. It was found that the Schottky barrier height (ΦB) between the IGZO layer and the Cu electrode could be modulated notably by changing the thickness of the AlOx tunnel layer, and the variation in ΦB significantly changed the saturation drain current (Idsat) of the IGZO SBTFTs based on the Schottky contacts but only had a minor influence on the saturation voltage (Vdsat) of the devices. Furthermore, Cu/Al stacked source/drain electrodes and silicon nitride (SiNx) passivation were employed to tailor the contact resistance and channel resistance of the IGZO SBTFTs, which led to an increase in Idsat and a variation in Vdsat. A universal resistance–capacitance network model was proposed to explain the observed evolution of Vdsat of the SBTFTs with different device structures. This work provides meaningful insight into developing low-cost metal oxide SBTFTs with tailored device performances.

Fabrication of Schottky-Barrier-Oxide- Semiconductor Thin-Film Transistors via a Simple Aluminum Reaction Method

In this work, we proposed a simple method for fabricating Schottky-barrier thin-film transistors (TFTs) with tailorable device characteristics. Through a simple post annealing process, an AlOx interlayer was formed between Cu/Al source/drain electrodes and the amorphous indium gallium zinc oxide (IGZO) layer, which induced the formation of a Schottky-barrier between Cu and the IGZO layer at the edge of the electrodes to modulate the carrier injection. Consequently, we found TFTs with different IGZO thicknesses presented notably different operation characteristics. When the thickness of the IGZO layer was 30 nm, the fabricated TFT behaved like a high mobility Ohmic-contact device, with an apparent field effect mobility as high as 82.9 cm2 V−1 s−1. After the thickness of the IGZO layer was reduced to 10 nm, the TFT worked like a Schottky-contact TFT, which exhibited a low saturation voltage of 2.3 V and a high output current of up to <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$80~\mu \text{A}$ </tex-math></inline-formula> at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{{\mathrm {GS}}} =20$ </tex-math></inline-formula> V.

Implementation of Ambipolar Polysilicon Thin-Film Transistors with Nickel Silicide Schottky Junctions by Low-Thermal-Budget Microwave Annealing.

In this study, the efficient fabrication of nickel silicide (NiSix) Schottky barrier thin-film transistors (SB-TFTs) via microwave annealing (MWA) technology is proposed, and complementary metal-oxide-semiconductor (CMOS) inverters are implemented in a simplified process using ambipolar transistor properties. To validate the efficacy of the NiSix formation process by MWA, NiSix is also prepared via the conventional rapid thermal annealing (RTA) process. The Rs of the MWA NiSix decreases with increasing microwave power, and becomes saturated at 600 W, thus showing lower resistance than the 500 °C RTA NiSix. Further, SB-diodes formed on n-type and p-type bulk silicon are found to have optimal rectification characteristics at 600 W microwave power, and exhibit superior characteristics to the RTA SB-diodes. Evaluation of the electrical properties of NiSix SB-TFTs on excimer-laser-annealed (ELA) poly-Si substrates indicates that the MWA NiSix junction exhibits better ambipolar operation and transistor performance, along with improved stability. Furthermore, CMOS inverters, constructed using the ambipolar SB-TFTs, exhibit better voltage transfer characteristics, voltage gains, and dynamic inverting behavior by incorporating the MWA NiSix source-and-drain (S/D) junctions. Therefore, MWA is an effective process for silicide formation, and ambipolar SB-TFTs using MWA NiSix junctions provide a promising future for CMOS technology.

INCREASING RADIATION RESISTANCE OF MEMORY DEVICES BASED ON AMORPHOUS SEMICONDUCTORS

A memory cell structure is proposed that uses a Schottky barrier thin film transistor based on an amorphous semiconductor as a junction element, and a chalcogenide glassy semiconductor film as a switching element. A physical storage cell model has been developed. The dependence of the transistor and memory cell parameters on the dose of neutron flux and γ - quanta was investigated. It is shown that when the dose of neutron irradiation is changed, the steepness of the drain-gate characteristic (DGC) decreases by 10% at a dose of the order of 1015 n/s, at the same time, the transfer coefficient of the bipolar n-p-n transistor decreases by 20% already at doses of 1013 n/s, indicating a significant increase in the radiation resistance of the proposed memory cell. In the case of irradiation with γ - quanta in the range up to 2.6 MRad, the steepness of the DGC of the proposed structure changes by only 10%. When used as an isolation element, a field-effect transistor with an insulated gate, the slope of the DGC is reduced by 50%. It is shown that the current of recording information of the proposed structure when changing the dose of γ - quantum flux to 2.6 MRad changes by about 10%, at the same time, in the case of using a field-effect transistor with an isolated cover, the information recording current changes by 50%. The study of the dependence of the gate current on the dose of γ – quanta is showed. When the radiation dose changes from 0 to 2.6 MRad, the gate current changes only by 10%, which indicates the high resistance of the proposed structure to the action of permeable radiation. Also, studies of the dependence of the conductivity of single-crystal semiconductors on the radiation dose ɣ by quanta and neutron flux show that a significant increase in the specific resistivity of AS occurs at doses 2-3 orders of magnitude larger than in the case of single-crystal n-type conductivity semiconductors.

Radiation-Resistant Memory Device Based on Chalcogenide Glassy Semiconductor

A memory cell structure is proposed that uses a Schottky barrier thin film transistor based on an amorphous semiconductor as a junction element, and a chalcogenide glassy semiconductor film as a switching element. A physical storage cell model has been developed. The dependence of the transistor and memory cell parameters on the dose of neutron flux and γ - quanta was investigated. It is shown that when the dose of neutron irradiation is changed, the steepness of the drain-gate characteristic (DGC) decreases by 10% at a dose of the order of 1015 n/s, at the same time, the transfer coefficient of the bipolar n-p-n transistor decreases by 20% already at doses of 1013 n/s, indicating a significant increase in the radiation resistance of the proposed memory cell. In the case of irradiation with γ - quanta in the range up to 2.6 Mrad, the steepness of the DGC of the proposed structure changes by only 10%. When used as an isolation element, a field-effect transistor with an insulated gate, the slope of the DGC is reduced by 50%, that it is bad result. It is shown that the current of recording information of the proposed structure when changing the dose of γ - quantum flux to 2.6 Mrad changes by about 10%, at the same time, in the case of using a field-effect transistor with an isolated cover, the information recording current changes by 50%. The study of the dependence of the gate current on the dose of γ – quanta is showed. When the radiation dose changes from 0 to 2.6 Mrad, the gate current changes only by 10%, which indicates the high resistance of the proposed structure to the action of permeable radiation.

Schottky-barrier thin-film transistors based on HfO2-capped InSe

Indium selenide (InSe) is an emerging two-dimensional semiconductor and a promising candidate for next generation thin film transistors (TFTs). Here, we report on Schottky barrier TFTs (SB-TFTs) in which a 0.9-nm-thick HfO2 dielectric layer encapsulates an InSe nanosheet, thus protecting the InSe-channel from the environment and reducing the Schottky-contact resistance through a dielectric dipole effect. These devices exhibit a low saturation source-drain voltage Vsat &amp;lt; 2 V and current densities of up to J = 2 mA/mm, well suited for low-power electronics. We present a detailed analysis of this type of transistor using the Y-function method from which we obtain accurate estimates of the contact resistance and field-effect mobility.

Subthreshold Schottky-barrier thin-film transistors with ultralow power and high intrinsic gain.

The quest for low power becomes highly compelling in newly emerging application areas related to wearable devices in the Internet of Things. Here, we report on a Schottky-barrier indium-gallium-zinc-oxide thin-film transistor operating in the deep subthreshold regime (i.e., near the OFF state) at low supply voltages (<1 volt) and ultralow power (<1 nanowatt). By using a Schottky-barrier at the source and drain contacts, the current-voltage characteristics of the transistor were virtually channel-length independent with an infinite output resistance. It exhibited high intrinsic gain (>400) that was both bias and geometry independent. The transistor reported here is useful for sensor interface circuits in wearable devices where high current sensitivity and ultralow power are vital for battery-less operation.

Characteristics of Schottky-barrier source/drain metal-oxide-polycrystalline thin-film transistors on glass substrates

Polycrystalline-silicon (poly-Si) Schottky-barrier thin-film transistors (SB-TFTs) with Ptsilicided source/drain junctions were fabricated on glass substrates, and the electrical characteristics were examined. The amorphous silicon films on glass substrates were converted into high-quality poly-Si by using excimer laser annealing (ELA) and solid phase crystallization (SPC) methods. The crystallinity of poly-Si was analyzed by using scanning electron microscopy, transmission electron microscopy, and X-ray diffraction analysis. The silicidation process was optimized by measuring the electrical characteristics of the Pt-silicided Schottky diodes. The performances of Pt-silicided SB-TFTs using poly-Si films on glass substrates and crystallized by using ELA and SPC were demonstrated. The SB-TFTs using the ELA poly-Si film demonstrated better electrical performances such as higher mobility (22.4 cm2/Vs) and on/off current ratio (3 × 106) and lower subthreshold swing value (120 mV/dec) than the SPC poly-Si films.

플레티늄-실리사이드를 이용한 쇼트키 장벽 다결정 박막 트랜지스터

Schottky barrier thin film transistors (SB-TFT) on polycrystalline silicon(poly-Si) are fabricated by platinum silicided source/drain for p-type SB-TFT. High quality poly-Si film were obtained by crystallizing the amorphous Si film with excimer laser annealing (ELA) or solid phase crystallization (SPC) method, The fabricated poly-Si SB-TFTs showed low leakage current level and a large on/off current ratio larger than 10), Significant improvement of electrical characteristics were obtained by the additional forming gas annealing in 2% <TEX>$H_2/N_2$</TEX> ambient, which is attributed to the termination of dangling bond at the poly-Si grain boundaries as well as the reduction of interface trap states at gate oxide/poly-Si channel.

Fabrication of n- and p-Channel Schottky Barrier Thin-Film Transistors Crystallized by Excimer Laser Annealing and Solid Phase Crystallization Methods

Schottky barrier thin-film transistors (SB-TFT) based on polycrystalline silicon (poly-Si) films crystallized by solid phase crystallization (SPC) and excimer laser annealing (ELA) methods were fabricated for system-on-glass (SOG) application. The structure of poly-Si films by ELA and SPC methods was analyzed. The formations of platinum silicide and erbium silicide were developed for p- and n-channel metallic junctions, respectively. The fabricated SB-TFTs have a large on/off current ratio with a low leakage current. The effects of forming gas annealing (FGA) in 2% H2/N2 gas ambient were evaluated. As a result of FGA, significant improvements of electrical characteristics were obtained due to reduction of trap states.

Characteristics of polycrystalline silicon Schottky barrier thin film transistors fabricated using metallic junction source/drain with erbium silicide and platinum silicide

Polycrystalline silicon (poly-Si) Schottky barrier thin film transistors (SB-TFTs) were fabricated using platinum and erbium silicided source/drain for p- and n-channel SB-TFTs, respectively. High quality poly-Si films were obtained by crystallizing the amorphous Si films with the excimer laser annealing method. Poly-Si SB-TFTs with metallic source/drain junctions showed a large on/off current ratio and a low leakage current. Significant improvements in electrical characteristics were obtained by additional forming gas annealing in 2% H2/N2 gas ambient due to the termination of dangling bonds at the grain boundaries of the poly-Si film as well as the reduction in interface trap states at gate oxide/poly-Si channel.

Schottky Barrier N-Type Thin Film Transistors With Polycrystalline Silicon Channel and Er-Silicided Metallic Junctions

N-type Schottky barrier thin film transistors (SB-TFTs) with polycrystalline silicon channel and metallic junctions were fabricated by using Er silicidation, and electrical structural properties were compared to conventional TFTs with phosphorous-doped source/drain regions. The performances of SB-TFTs are better than that of the conventional TFTs. A forming gas annealing process leads to a great improvement in the characteristics of both devices. In particular, excellent electrical characteristics were obtained from the forming gas annealed SB-TFTs: the subthreshold swing of 180 mV/dec, the drive current of 1.47 times 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-5</sup> A, and the on/off current ratio of 5 times 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sup> .

Fabrication and Characterization of Schottky Barrier Polysilicon Thin-Film Transistors with Excimer-Laser Crystallized Channel

Schottky barrier thin-film transistors (SB TFT) with field-induced drain (FID) have recently been demonstrated to exhibit ambipolar capability with low off-state leakage current. In this study, we investigate and compare the characteristics of poly-Si SB TFTs with channel layer prepared by excimer laser crystallization (ELC) and solid-phase crystallization (SPC). It is shown that the use of ELC could greatly improve the device characteristics, comparing to the SPC counterparts. Excellent device performance with steep subthreshold slope and on/off current ratio higher than 108 for both p- and n-channel operations are demonstrated on a single device with ELC channel. The effects of sub-gate bias, channel length, and channel offset length, on device characteristics are also explored.

Reduction of Off-State Leakage Current in Schottky Barrier Thin-Film Transistors (SBTFT) by a Field-Induced Drain

Detailed conduction mechanisms in a conventional Schottky barrier thin-film transistor (SBTFT) and a recently proposed novel SBTFT with field-induced drain (FID) extension have been studied. The new SBTFT device with FID extension shows excellent ambipolar performance with effective suppression of gate-induced drain leakage (GIDL)-like off-state leakage that plagues conventional SBTFT devices. By characterizing the activation energy of the conduction process in the off-state for conventional SBTFT devices, it is suggested that field emission of carriers from the drain junction is the major conduction mechanism. While for the FID SBTFT devices, owing to the effect of Fermi level pinning in the FID region, thermionic emission rather than field emission becomes the dominant conduction mechanism, resulting in the effective suppression of the undesirable GIDL-like leakage current.

Conduction mechanisms for off-state leakage current of Schottky barrier thin-film transistors

Conduction mechanisms for the off-state leakage in Schottky barrier thin-film transistor were explored. It was found that the field-emission process dominates the leakage conduction of the device with the conventional structure as the field strength in the drain junction becomes high, and results in the strong gate-induced drain leakage (GIDL) like phenomenon. In contrast, for the device with a field-induced-drain structure, the high-field region is pulled away from the silicided drain. As a result, the field-emission conduction is eliminated, so the GIDL-like leakage current is effectively suppressed.

Schottky barrier thin-film transistor (SBTFT) with silicided source/drain and field-induced drain extension

A novel Schottky barrier thin-film transistor (SBTFT) with silicided source/drain and field-induced drain (FID) extension is proposed and demonstrated. In the new device configuration, a metal field-plate (or sub-gate) lying on the passivation oxide is employed to induce a sheet of carriers in a channel offset region located between the silicided drain and the active channel region underneath the main gate. The new device thus allows ambipolar device operation by simply switching the polarity of the bias applied to the field plate. In contrast to the conventional SBTFT that suffers from high GIDL (gate-induced drain leakage)-like off-state leakage current, the new SBTFT with FID is essentially free from the GIDL-like leakage current. In addition, unlike the conventional SBTFT that suffers from low on-off current ratio, the new device exhibits high on/off current ratio up to 10/sup 6/ for both n- and p-channel modes of operation. Moreover, the implantless feature and the ambipolar capability of the new device also result in extra low mask count for CMOS process integration. These excellent device characteristics, coupled with its simple processing, make the new device very promising for future large-area electronic applications.

Fabrication and Characterization of Poly-Si Schottky-Barrier Thin-Film Transistors

AbstractPoly-Si Schottky-barrier thin-film transistors (SB-TFTs) were fabricated and characterized. In this study, SB-TFTs were first fabricated by using a conventional sidewall spacer to isolate the gate and S/D regions during salicidation. However, it was found that these SB-TFTs depict very poor on/off current ratio (&lt;103) as well as severe GIDL (gate-induced drain leakage)-like leakage current. To overcome these shortcomings, a novel SB-TFT structure is also fabricated in this study to improve the device performance. The new device consists of a field-induced-drain region (FID), which is an offset drain region controlled by a metal field-plate lying on top of the passivation oxide. The FID region is sandwiched between the silicided drain and the active channel region. Carrier types and the conductivity of the transistor are controlled by the metal field-plate. Since the metal field plate is formed simultaneously with the regular metal patterning, no additional processing steps are required. Our results show that the new device can significantly improve the on/off current ratio to over 106 for both p- and n-channel operations, while effectively eliminating the GIDL-like leakage.

Increasing the Carrier Mobility in P3HT by Doping for use in Schottky Barrier TFTs

ABSTRACTMeasurements and theory are presented examining the relationship between mobility and doping in regioregular poly(3-hexylthiophene) (P3HT). Mobility is found to increase super-linearly with doping and is comparable to models reported for other conjugated polymers. Schottky measurements have been used to calculate the doping density and bulk mobility of regioregular P3HT. Aluminium Schottky contacts showed signs of native oxide disrupting current flow through the device. This effect was observed to degrade further with the introduction of dopant into the polymer. Titanium devices show a general shift of the Schottky characteristic to higher current levels with increased dopant. Field effect mobility of P3HT films was also calculated using thin-film transistor (TFT) structures. The field effect mobility values were observed to be more than two orders of magnitude higher than the bulk mobility value. The addition of dopant also increased gate leakage currents in TFT devices. The increased conductivity in doped polymer can increase off currents in the device; this is avoided by using Schottky contacts as the source and drain. Preliminary results on Schottky contact TFTs are also presented as well as a description of the operation of such a device.