The electrodeposition of nanostructured materials onto silicon substrates offers a pathway to blend the advantageous traits of metals with silicon's exceptional electronic properties. This amalgamation facilitates the creation of integrated circuits, electrodes for batteries, supercapacitors, fuel cells, sensors, and photovoltaic cells [1]. This deposition method was selected for its cost-effectiveness, scalability, and rapid synthesis capability. It operates at room temperature and atmospheric pressure, utilizing aqueous solutions with adjustable properties.In this study, we examined the feasibility of electrodeposited nanoparticles, ultra-thin films, and Under Potential Deposition (UPD) on n-doped silicon [2]. The initial metal selection for electroplating was based on Density Functional Theory (DFT) calculations, considering factors such as the Schottky barrier, metal-silicon interactions, and metal-metal formation energy. Voltammetric analyses were conducted using solutions containing Ni, Ru, Pd, Rh, Pt, Ag, Mn, Co, and Au. Charge-controlled depositions were executed, supplemented by tests on electroless deposition. Optimal deposition conditions were sought for the most promising metals. The resulting deposits were morphologically and compositionally characterized using Scanning Electron Microscope (SEM) techniques, complemented by analytical spectroscopy including Energy Dispersive X-ray Spectroscopy Analysis (EDS) and X-ray Photoelectron Spectroscopy (XPS).Multiple charge-controlled deposition cycles were carried out to modulate the surface coverage, the average thickness, and the particle size distribution. The metal deposits thus obtained are under study to be used as promising templates to partially wet etching the underneath silicon and produce silicon nanowires (NWs). This procedure could create new opportunities for small-size and better-performing sensors [3].Project funded under the National Recovery and Resilience Plan (NRRP), Mission 4 Component 2 Investment 1.3 - Call for tender No. 341 of 15 March 2023 of Italian Ministry of University and Research (MUR) funded by the European Union - NextGenerationEU - Project code PE_00000004, CUP B83C22004890007, Project title "3A-ITALY - Made-in-Italy circolare e sostenibile".
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