Addition Of Sb Research Articles

Novel Understanding of the Formation and Protectiveness of Corrosion Product Film on Ca–Sb–Cr Weathering Steel

The addition of Ca and Sb in Cr‐bearing steel presents improved corrosion resistance during the field exposure test in a marine atmosphere environment. Through local hydrolysis reactions, Ca and Sb can form CaO, Sb2O3, and Sb2O5 to prevent the intrusion Cl− into the corrosion product film, which improves the protectiveness of the corrosion product film and reduces the corrosion rate. The formation of CaCl2 decreases the relative content of β‐FeOOH and makes the corrosion product film more stable. Due to the inhibition of Sb on the local acidification of corrosion product film, Ca and Cr are able to bond with more hydroxide for generating the corresponding oxides and improving the corrosion resistance of Cr‐bearing steel.

Toxicity of antimony to plants: Effects on metabolism of N and S in a rice plant

Excess antimony (Sb) has been shown to damage plant growth. Rice plants readily absorb a large amount of Sb after a long period of flooding, yet the mechanisms underlying Sb toxicity in plants have not been solved. This study was conducted to explore the effects of Sb on the uptake of N and S, and monitor the concentrations of reduced glutathione (GSH) and enzymes associated with these processes. In addition, we analyzed differentially expressed metabolites (DEMs) correlated with amino acids (AAs) and oligopeptides, specifically DEMs containing sulfur (S), GSH and indole–3–acetic acid (IAA). The results showed that antimonite [Sb(III)] inhibited shoot growth whereas antimonate [Sb(V)] stimulated shoot growth. Interestingly, Sb(III)5/10 enhanced shoot concentrations of total nitrogen (N), NH4+–N [only at Sb(III)10] and S; but reduced the shoot concentrations of NO3–N and soluble protein. Sb(III)5/10 addition significantly increased oxidized glutathione (GSSG) concentration and activities of glutathione peroxidase (GSH–Px) and glutathione S-transferase (GST) but non–significantly affected concentration of reduced glutathione (GSH) and activities of γ-glutamylcysteine synthetase (GCL) and glutathione reductase (GR), suggesting Sb(III) restricted GSH recycling. Addition of Sb (1) increased the abundance of DEMs associated with lignins, Ca uptake, toxicity/detoxification, and branched chain AAs; (2) decreased the abundance of AAs inclcuding isoleucine (Ile), leucine (Leu), tryptophan (Trp), tyrosine (Tyr) and histidine (His); (3) increased the abundance of arginine (Arg), putrescine (Put) and spermidine (Spd); and (4) affected methylation and acetylation of many AAs, especially acetylation.

Record High Thermoelectric Figure of Merit of a III-V Semiconductor InGaSb by Defects Engineering via the Addition of Excess Constituent Elements.

Materials with enhanced electron and reduced phonon transport properties are preferred for thermoelectric applications. The defect engineering process can optimize the interrelated electron and phonon transport properties to enhance thermoelectric performance. As the influence of various crystalline defects on the functional properties of materials is diverse, it is crucial to scale, optimize, and understand them experimentally. With this perspective, crystalline defects in InGaSb ternary alloys were engineered and their influence on the thermoelectric properties was studied experimentally. Crystalline defects such as point defects, dislocations, and compositional segregations were induced in In0.95Ga0.05Sb crystals by the addition of excess constituent elements, In, Ga, or Sb. The addition of excess Ga increased point defects, whereas excess Sb reduced dislocation densities. The thermoelectric figure of merit value (ZT) of In0.95Ga0.05Sb+Ga0.02 was recorded to be 0.87 at 573 K, which is the highest among other reported values of III-V semiconductors. The collective interactions of compositional segregations, point defects, and dislocations with electrons and phonons enhanced the ZT in this study.

Correlation between microhardness and microstructure of low-temperature Sn-xBi-M(Ag, Sb) solders

The correlation between Vickers microhardness and microstructure of low-temperature Sn-xBi-M(Ag, Sb) solders was investigated. The β-Sn grains were refined with increasing Bi content, as well as the additions of Ag and Sb. Fine β-Sn grains in general should strengthen the mechanical properties of solders, however, the Vickers microhardness of Sn-xBi-M(Ag, Sb) solders decreased with increasing Bi content (i.e., fine β-Sn grains). It was shown that the microhardness of Sn-xBi-M(Ag, Sb) solders depended on the amount of Bi/β-Sn interfaces rather than the fine-grain strengthening effect. The smaller the amount of Bi/β-Sn interfaces was, the higher the Vickers microhardness of Sn-xBi-M(Ag, Sb) solders.

Effect of antimony additions on the microstructure and performance of Zn–Mg–Al alloy coatings

Microscopy, electrochemical techniques and mechanical testing are used to investigate the effect of varying antimony additions (0.45–1.8 wt%) on the microstructure and corrosion properties of zinc-magnesium-aluminium coating alloys. Samples were produced by splat casting to produce high cooling rates similar to those seen in a continuous galvanising line. X-Ray Microscopy reveals that the Sb additions produce disk-shaped Mg3Sb2 intermetallics, subsequently reducing or eliminating the MgZn2 eutectic. Electrochemical testing in 1 wt% NaCl shows that the Mg3Sb2 phase is cathodic with respect to the bulk alloy with slower oxygen reduction kinetics. The decrease in eutectic content leads to less intense anodic activity. The combined effect is anodic and cathodic deactivation, which leads to a 43% reduction in corrosion rate as measured through LPR compared to the base alloy. This work shows that quaternary additions to ZMA coating alloys can be a potential route to improved corrosion resistance for galvanic protection.

Effect of Sb Addition on Hot Tearing Susceptibility and Mechanical Properties of Mg–7Al–1Ca–xSb (x = 0, 0.5, 1, 1.5, and 2 wt.%) Alloys

Effect of Sb Addition on Hot Tearing Susceptibility and Mechanical Properties of Mg–7Al–1Ca–xSb (x = 0, 0.5, 1, 1.5, and 2 wt.%) Alloys

Effect of minor Sb addition on microstructure, interfacial behavior, and mechanical properties of Sn–15Bi solder joints

Effect of minor Sb addition on microstructure, interfacial behavior, and mechanical properties of Sn–15Bi solder joints

Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder.

SnPb solder was widely used in electronic packaging for aerospace devices due to its high reliability. However, its creep resistance is poor and can be improved by adding alloying elements. The effects of Sb content on the microstructure, tensile, and creep properties of eutectic SnPb solder were investigated. Sb addition effectively improved the mechanical properties of the SnPb solder. When Sb content exceeds 1.7 wt.%, SbSn intermetallic compounds (IMCs) occurred. And increasing the Sb content increased the tensile strength. Furthermore, Sb addition decreased the steady-state creep rate and increased the stress exponent n, suggesting that the creep resistance had been enhanced, which may be attributed to the hindrance of dislocation movement by SbSn IMCs, as well as the reduction in phase boundaries, which consequently reduced grain boundary sliding.

Effects of Sb on the properties and interfacial evolution of SAC305-2Bi-xSb/Cu solder joints

This study investigated the influence of Sb addition on the microstructure, thermal behavior, mechanical properties, and interfacial evolution of SAC305-2Bi-xSb/Cu solder joints. Compared with the SAC305-2Bi alloy, the melting temperature and pasty range slightly increased with the increasing of Sb content from 0.2 to 2.0 wt.%, while the undercooling temperature decreased. The research revealed that with the addition of Sb element, the grain size of β-Sn is refined. When the content of Sb is 0.5 wt.%, the grain size of β-Sn reached minimum (19.91 μm). Compared to the SAC305-2Bi alloy, the ultimate tensile strength of SAC305-2Bi–2Sb alloy is increased by 30.10%, contributed to the Sb solid solution strengthening effect and the refinement of β-Sn. With the addition of Sb, the thickness and growth rate of the interface is reduced gradually. The uniform solution of Sb and Sn can significantly inhibit the diffusion rate of Cu atoms and Sn atoms at the interface. The SAC305-2Bi-xSb alloy system has low melting temperature, superior mechanical properties, and reliable solder joints for service. Therefore, it is a potentially reliable lead-free solder for high-stability connections in automotive electronics, communications electronics, and medical devices.

Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder

PurposeThe purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure, thermal properties and mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder were investigated.Design/methodology/approachAccording to the mass ratio, the solder alloys were prepared from tin ingot, antimony ingot, silver ingot and copper ingot with purity of 99.99% at 400°C. X-ray diffractometer was adopted for phase analysis of the alloys. Optical microscopy, scanning electron microscopy and energy dispersive spectrometer were used to study the effect of the Sb and Ce doping on the microstructure of the solder. Then, the thermal characteristics of alloys were characterized by a differential scanning calorimeter (DSC). Finally, the ultimate tensile strength (UTS), elongation (EL.%) and yield strength (YS) of solder alloys were measured by tensile testing machine.FindingsWith the addition of Sb and Ce, the ß-Sn and intermetallic compounds of solders were refined and distributed more evenly. With the addition of Sb, the UTS, EL.% and YS of Sn-1.0Ag-0.5Cu increased by 15.3%, 46.8% and 16.5%, respectively. The EL.% of Sn-1.0Ag-0.5Cu increased by 56.5% due to Ce doping. When both Sb and Ce elements are added, the EL.% of Sn-1.0Ag-0.5Cu increased by 93.3%.Originality/valueThe addition of 0.5% Sb and 0.07% Ce can obtain better comprehensive performance, which provides a helpful reference for the development of Sn-Ag-Cu lead-free solder.

The effect of B and Sb on the corrosion behavior of T6-treated Al–Si–Mg alloys

The influence of B and Sb on the microstructure and corrosion behavior of T6-treated Al–Si–Mg alloys has been specifically studied. It is found that the addition of 0.03 wt% B to Al–Si–Mg alloys results in the lowest corrosion rate (0.02451 mm/y) when immersed in 3.5 wt% NaCl solution for 3 days. This improvement can be attributed to the transformation of coarse dendritic α-Al grains into refined equiaxed grains, which is beneficial for the formation of uniform and compact passive film. In contrast, the Al–Si–Mg alloy with addition of 0.2 wt% Sb shows the highest corrosion rate (0.05795 mm/y), which can be attributed to two reasons. First, the addition of Sb contributes to the transformation of rod-like eutectic Si particles into a spherical morphology, increasing the number of micro-galvanic corrosion sites and thus accelerating the corrosion process. Second, the generated Mg3Sb2 phase, being more noble than the eutectic Si phase, strengthens the micro-galvanic corrosion.

High performance Al anode for Al-air battery enabled by coordinating In and Sb additions with discharge parameters

High performance of Al anode for Al-air battery was achieved via coordinating minor In and Sb additions with discharge parameters. The electrochemical behaviors, discharge performance and surface structures of aluminum electrodes are systematically investigated to understand the alloying chemistry coordination of indium and antimony. The results show that coordinating indium and antimony can significantly activate the Al electrode without aggravating the hydrogen evolution. The assembled Al-air cell with Al-0.05In-0.05Sb electrode exhibits a desirable specific capacity and energy density of 2638 Ah·kg−1 and 3166 Wh·kg−1, respectively. Furthermore, antimony has better activating effect than indium, especially at discharge current density over 40 mA·cm−2. The activating mechanisms are discussed in detail.

Influence of Sb doping on thermal properties and electrical conductivity mechanism of SbxSe50–xSn20Te30 chalcogenide glassy systems

Tunability of thermal, and electrical characteristics of SbxSe50-xSn20Te30 (x = 2, 4, 6, and 8 at. %) bulk glass systems with varying doping concentrations are the major objective of this study. The melt quenching technique has been employed to synthesize the samples. Various thermal parameters have been inspected by using DSC measurements. The effect of Sb addition on the glass transition temperature (Tg), crystallization temperature (Tc), peak crystallization temperature (Tp), and melting temperature (Tm) have been observed from DSC thermograms. The dependence of Tg, Tc, Tp, and Tm on the heating rate has been measured. The thermal analysis is performed under non-isothermal conditions at heating rates of 5, 10, 15, and 20 K/min. The activation energies for the glass transition temperature are estimated by using the Kissinger method and are found to decrease from (211.21-168.85) KJ.mol−1. Thermal stability and glass forming ability for all glassy compositions have been examined in terms of Hruby's parameter. In addition, electrical conductivity mechanisms over vast temperature and frequency ranges are analyzed. The DC conductivity mechanism has been analyzed by deploying Mott and Greaves's variable range hopping model, while the AC conductivity mechanism has been analyzed by deploying the modified correlated barrier hopping model. AC conductivity scaling property has been examined by using the Pan and Ghosh model. The influence of Sb addition has been observed as the DC and AC conductivity increases with the increase of doping concentration.

Design and synthesis of pyrene-based probes and their fluorescent detection of Sb(III)

A series of pyrene-based fluorescent (FL) probes for Sb(III) were designed and synthesized. All of them exhibited luminescence by pyrene excimers in the mixture of DMSO and water and showed enhanced emission with the addition of Sb(III). By comparing their FL response to Sb(III), the effects of intramolecular hydrogen bond, inductive effect, and steric effect were investigated. Meanwhile, the FL enhancement factor of the best performing probe reached 10.28 and the detection limit was calculated to be 0.0535 mg/L, indicating that it might be used as a potential candidate for the treatment of Sb(III) in printing and dyeing wastewater.

Magnetic properties, phase diagram and low-temperature specific heat of Ni50Mn50-xSbx alloys

This study examines the magnetic properties and temperature-composition phase diagram of the Ni50Mn50-xSbx alloys. The addition of Sb into the antiferromagnetic Ni50Mn50 alloy introduces ferromagnetic interaction, resulting in a sudden decrease in the Néel temperature. The characteristic regions of ferromagnetic (FM) and antiferromagnetic (AFM) interactions were determined on temperature-composition phase diagram, as well as compositional dependence of Néel temperature was computed. Increase of Sb content gives rise to an interplay between AFM and FM interactions, leading to the emergence of a spin glass-like state. We identified six distinct magnetic phases in the Ni50Mn50-xSbx system, encompassing AFM, paramagnetic, and FM martensite, as well as spin glass, and paramagnetic and FM austenite. Importantly, this behavior may extend to other Ni50Mn50-xZx (Z = In, Sn) alloys, where addition of Z elements leads to the introduction of FM interaction. Moreover, a significant impact of magnetic ordering on low-temperature specific heat is demonstrated. Neglecting the magnetic contribution in ferromagnetic phase leads to the overestimation of electronic specific heat coefficient by factor of 2.

Effect of SB Addition on Mechanical Electronic and Thermodynamic Properties of Intermetallic B2-NIAL: First Principles Study

Abstract This study investigates the mechanical, electronic, and thermodynamic properties of B2 NiAl alloyed with Sb, ranging from 0% to 100%. The calculations were conducted using the WIEN2k code based on the full potential linearized augmented plane wave (FP-LAPW) method within the density functional theory (DFT) framework. Generalized Gradient Approximation (GGA) was employed to approximate the exchange-correlation energy. Our analysis of formation enthalpy indicates a preference for Sb to substitute Al sites. Furthermore, we have observed that the mechanical properties of NiAl can be enhanced by adjusting the chemical composition of Sb. Specifically, an increase in antimony content from 0% to 75% results in a notable improvement in ductility tensile, elevating it from 1.92 to 10.72. Conversely, this alteration diminishes the material’s strength. Moreover, both the band structures and density of states (DOS) indicate the metallic behavior exhibited by all NiAl1-xSbx compounds. In addition, we employ the Gibbs2 code to calculate thermodynamic properties, shedding light on the influence of temperature and pressure on the volume, heat capacity, Debye temperature and entropy S of NiAl1-xSbx.

Tailoring of physical, optical, and thermal properties of Se50-xTe30Ge20Sbx chalcogenide glasses: Influence of metalloids

The compositional dependence on physical and spectroscopic characteristics of chalcogenide Se50-xTe30Ge20Sbx (x = 5, 10, 15, and 20 at. wt%) bulk glassy systems has been explored in this communication. Numerous physical and optical features are rigorously examined by using the best glass sample among all the prepared samples. The XRD pattern reveals the amorphous character of the synthesized materials. Some of the physical parameters like density, and compactness are gradually increasing with the Sb addition, while the free volume percentage and excess volume follow the decreasing trend. The optical properties have been precisely inspected by UV-Vis spectroscopy in the (200–800) nm spectral range. The optical bandgap (Eopt) values are found to decline from (1.09–0.85) eV with Sb content. The observed refractive index, n values experience a subsequent decline with incident energy. By using the Wemple and DiDomenico (WDD) single oscillator model, the refractive index dispersion curve has been studied, and the dispersion parameters are discussed. The valence band (VB) and conduction band (CB) locations are estimated, and the obtained result reveals the VB potential increases from −15,089 eV to −1.3899 eV, while that of CB decreases from −0.4113 eV to −0.5303 eV with the rise of Sb-concentration. The cohesive energy (CE) values have been estimated by using the chemical bond approach (CBA). Investigation reveals the CE of the system decreases from 45.237 kcal/mole to 44.229 kcal/mole justifying the decrement in obtained band gap energy values of the studied glassy systems. Furthermore, the compositional dependency of various thermal parameters is investigated by using the DSC approach. The glass transition (Tg), and peak crystallization (Tp) were significantly affected by Sb addition. The obtained values of Tg are found to decrease from (337–305 K), while the thermal stability is found to increase with the Sb incorporation.

Improvement of mechanical properties of Al-Si-Mg composites by in-situ formation of small-sized (Al, Si)3(Ti, Zr) particles

In this study, Al-Si-Mg composites were prepared by adding different combinations of titanium (Ti), zirconium (Zr), boron (B), and antimony (Sb)，and its micro-structure and mechanical properties were investigated. The results revealed that the average diameter of α-Al grains in the novel alloy, prepared through the combined addition of Ti, Zr, B, and Sb, was 110 µm, with a secondary dendritic arm spacing (SDAS) of 22.4 µm. This grain refinement is attributed to the in-situ formation of heterogeneous nucleation sites L12-(Al, Si)3(Ti, Zr). The alloy heat-treated at T6 exhibited notable mechanical characteristics, including a tensile strength of 354.5 MPa, a yield strength of 317.9 MPa, and an elongation at break of 5.6%. Significantly, the enhancement in mechanical properties is found to be independent of the modifications of eutectic silicon. This improved strength and elongation are attributed to both grain refinement and the in-situ formation of I4-(Al, Si)3(Ti, Zr). Overall, these findings provide an effective and direct method for obtaining high-performance Al-Si-Mg composites.

NANOSCALE HETEROSTRUCTURE CONCEPT AND III-SB ELEMENT BASED HETEROSTRUCTURES FOR INFRARED APPLICATIONS: A REVIEW

Heterostructures have a high potential for infrared radiation applications in the present scenario. The infrared (IR) region, particularly ranging from 760 nm to 1 million nm, is significant in a list of applications including communications, sensing, monitoring, and imaging. According to different applications, designs of nanoscale heterostructures vary. For this purpose, III-Sb element-based heterostructures are studied. We found a dramatic change toward longer luminous wavelengths while preserving high crystal quality with the addition of Sb to ternary and quaternary. The current study shows the compositional changes in the material caused by adding Sb. In order to boost the device's performance, several heterostructures have been designed. The optical characteristics of these heterostructures are also analyzed under various parameters such as pressure, temperature, and external electric field. For the computation of characteristics like optical gain, band structure, wave function, etc., the k·p method and Luttinger-Kohn model are employed. This review article reveals research on different heterostructure designs for IR applications. This work is the result of numerous types of research in the subject of optoelectronics.

Sb induced effect on glass transition, crystallization kinetics and optical properties of Se96Sn4 alloy

Se96-xSn4Sbx (x = 0, 2, 4, 6, and 8) glassy alloys were prepared using the melt quench technique. Thermal measurements were carried out using differential scanning calorimetry (DSC) in non-isothermal mode. Kissinger and Moynihan methods are used for glass transition kinetics, while Kissinger, Takhor, and Augis-Bennet methods are used to study crystallization kinetics. The inclusion of Sb in the alloy increased the glass transition temperature (Tg), activation energy of the glass transition (Et), and activation energy of crystallisation (Ec). The chemical bond approach has been used to explain the results. The rising trend of Ec is explained by the production of SnSe4/2 structural units with energies greater than those of Se–Se and Se–Sb bonds, increasing the degree of cross-linking. The dimensionality of crystal growth changes from one to two with the addition of Sb to the Se-Sn alloy. The criterion for thermal stability was addressed by using the enthalpy emitted during the crystallization process. In addition, Kubelka-Munk transformation and Tauc plots were used to calculate the band gaps. The energy gap (Eg) decreases from 3.72 to 1.60 eV as the Sb concentration increases from 0 to 8 atm%.