The evolution of the crystal orientation of a Cu film grown on an amorphous carbon substrate without intentional heating under 75±6° oblique angle vapor deposition was investigated ex-situ by atomic force microscopy AFM and scanning electron microscopy SEM, and in-situ by reflection high-energy electron diffraction RHEED. At the initial stage of growth 12 nm thick the diffraction patterns showed uniform rings indicating random nucleations of crystals. With more Cu depositions 100 nm thick the diffraction pattern started to break symmetrically from the middle of the 111 and 200 rings representing the absence of 111 and 200 planes parallel to the substrate. However, after this transition stage, at the thickness of 410 nm, the intensity distribution of diffraction patterns appeared asymmetric about the middle of the rings, which is interpreted as the appearance of a tilted 111 texture. Finally the diffraction patterns developed into separated short arcs and showed only a 1111 ¯10 II-O two-orientation texture. By comparing RHEED patterns with the SEM and AFM images of the final film, we argue that the tilted columns having tilted 111 top faces dominate in the later stage of growth. Furthermore, considering the geometry of crystals and shadowing effects, we argue that the vertices of columns having the highest growth velocity normal to the substrate and therefore receiving the maximum flux will dominate the film growth and determine the tilt angle of the texture and the preference of the azimuthal angle orientation.
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