To ensure semiconductor technology scaling to continue for the decades to come, the industry focuses on identifying alternative metals (elemental or alloys), that can replace copper in the back end of line (BEOL) integration scheme, for which the metal is used as main conductor for most of the metallization levels. Recently, the semi-damascene process is being developed, in which the interconnect metal is first deposited and then patterned using a dry etching process (‘direct metal etch’), in a fashion closely resembling the traditional Al metallization. One of the advantages is that any metal that can be deposited as a blanket thin film (either by physical vapor deposition (PVD), electrochemical deposition (ECD), electroless deposition (ELD), chemical vapour deposition (CVD), or atomic layer deposition (ALD)) can subsequently be patterned, provided that the critical requirement for dry etching of ‘volatilization’ of the metal is fulfilled. Furthermore, it allows the integration of materials for which no ECD, ELD, CVD or ALD process is available to fill damascene trenches.In this contribution, intrinsic material properties (bulk resistivity, electromigration, ...) and composition (surface versus bulk composition as well as surface oxide) of a wide range of metals and alloys of interest to the BEOL will be compared. An overview of wet-chemical deposition approaches of a few selected metals (Cu and Rh) will be given. For ELD, the focus will be on discussing the mechanistic understanding of the intrinsically complex process, for which the stability and reactivity of the reducing agent is affected by solution pH and composition as well as the presence of oxygen. For ECD, results will be discussed for Rh and Ni, for which an electrochemical quartz crystal microbalance (EQCM) was used to quantify the amount of material deposited and interpret the various features detected in cyclic voltammograms. Metal ion solution speciation as well as stability, of importance for both deposition methods, has been studied using UV-vis spectroscopy and electrochemical characterization (linear sweep and cyclic voltammetry). Deposits were analysed morphologically using transmission electron microscopy and the chemical composition was assessed by elemental mapping.During process integration, the surface-chemical composition of metals / alloys needs to be carefully controlled, as this can, for instance, critically impact metal line resistance or result in wet etching or corrosion. A few example cases in which this is relevant will be presented, e.g. the reversible surface oxidation and reduction of Cu was studied using EQCM, the surface chemistry of NiAl was characterized using electrochemical measurements, and the reversible surface nitridation of a model metal (Mo) is demonstrated as a method to protect against unwanted metal dissolution.
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