When space solar cell array is subjected to harsh temperature cycle, such as planet orbit, thermal fatigue cracks in bonding area are easily induced. With the aim of improving bonding quality and elucidating failure mechanism of parallel gap resistance welding (PGRW) joints in temperature cycling environment, the present research investigates the effect of current density on bonding quality and thermal fatigue behavior of PGRW joint between Ag interconnector and front electrode of GaAs solar cell. When current density is set at 417 A/mm2, a solid diffusion bonding is achieved at the Ag/Au interface, which also possesses adequate joint strength as ensured by both pressure and input energy of PGRW. Crack initiation by thermal fatigue is found at joint edge, which subsequently propagates along the interface as the environment temperature cycling continues. Further investigation reveals that the conducted temperature cycling generates serious tensile and compressive stress in the multi-layered joint structure. Since such reciprocating forces directly induce micro-plastic deformation and strain accumulation at joint interface, failure by crack is finally generated at the joining interface.
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