In this study, Co60Fe20Sm20 alloy was employed for sputter deposition onto Si(100) substrate within a high vacuum environment, and subsequent thermal treatment was conducted using a vacuum annealing furnace. Thorough measurements and analyses were carried out to evaluate how various film thicknesses and annealing temperatures affect the material. The investigations encompassed observations of structural and physical properties, magnetic traits, mechanical behavior, and material adhesion. The results from the four-point probe measurements clearly demonstrate a trend of decreasing resistivity and sheet resistance with increasing film thickness and higher annealing temperature. Analysis through atomic force microscopy (AFM) shows that heightened annealing temperature corresponds to decreased surface roughness. Furthermore, when analyzing low-frequency alternating current magnetic susceptibility (χac), it became evident that the maximum magnetic susceptibility value consistently rises with increased film thickness, regardless of the annealing temperature. Through magnetic force microscopy (MFM) observations of magnetic domain images in the films, it became apparent that there was a noticeable reduction in the brightness contrast of the magnetic domains. Furthermore, nanoindentation analysis reveals a clear trend. Elevating the film thickness leads to a reduction in both hardness and Young’s modulus. Contact angles range between 67.7° and 83.3°, consistently under 90°, highlighting the hydrophilic aspect. Analysis of surface energy demonstrates an escalation with increasing film thickness, and notably, annealed films exhibit a substantial surge in surface energy. This signifies a connection between the reduction in contact angle and the observed elevation in surface energy. Raising the annealing temperature causes a decline in surface roughness. To summarize, the surface roughness of CoFeSm films at different annealing temperatures significantly impacts their magnetic, electrical, and adhesive properties. A smoother surface reduces the pinning effect on domain walls, thus enhancing the χac value. Furthermore, diminished surface roughness leads to a decline in the contact angle and a rise in surface energy. Conversely, rougher surfaces exhibit higher carrier conductivity, contributing to a reduction in electrical resistance.