Customer Quality Requirements Research Articles

A study of soldering heat evaluation for SMDs

Environmental factors affecting package crack occurrence are: • -humid atmosphere and time; • -soldering heat method and the number of times; • -heating temperature and time, etc. As mounting styles have become diversified, the above environmental conditions have been included in customer's quality requirements. Therefore, reasonable soldering heat evaluation methods are required. This paper demonstrates that resistance to package crack of a package made of a highly adhesive mold resin can be explained in terms of the Interface moisture content and maximum temperature applied to the package only.

Design Reviews: Highly Lucrative Targets for Process Improvement

AbstractThis paper is a case study taken from the F/A‐18E/F Initial & Preliminary Design Reviews conducted during Sept 92 and Jun 93 respectively. These highly successful events serve as models from which the design review process can be documented, analyzed and improvement initiatives identified. The end objective is an improved process, road map and game plan that will lead to future successful Design Reviews. Key to the development of this road map, and the implementation of a game plan that would guarantee Design Review success is the clear understanding of: Who is the real customer for the Design Review. What are the customer expectations relative to the Design Review product. What are the customer's quality requirements. What processes will be employed to develop and deliver the product that will satisfy those requirements. Post Design Review Presenter survey results and Design Review Process Improvement Team (DRPIT) findings and recommendations serve as the basis for process and product quality improvement initiatives with “real world” applicability to a wide range of acquisition programs. These initiatives will be implemented in preparation for future Design Reviews.