Qualcomm Technologies Research Articles

Exploring the role of artificial intelligence in the human era involves a multidimensional perspective that encompasses technological, ethical, social, and economic considerations

The artificial intelligence (AI) device is powered by an advanced Snapdragon platform from Qualcomm Technologies and boasts a range of sensors that enable contextual and ambient compute interactions. The Humane AI Pin offers a plethora of features that enhance our daily lives, including Contextual AI: The device can understand and respond to our natural language commands, allowing us to control music, make calls, send texts, and set reminders with ease. Ambient Awareness: The AI Pin's sensors provide real-time information about our surroundings, enabling it to adjust audio volume, provide notifications, and translate languages in context. Seamless Integration: The device eliminates the need for a smartphone, allowing us to interact with AI without the need to constantly look at a screen. Establishing robust frameworks for AI governance, promoting transparency, and prioritizing ethical considerations will be essential in harnessing the full potential of AI while minimizing its risks. Ultimately, a multidimensional perspective is crucial to charting a course for AI that aligns with human values, fosters responsible innovation, and enhances the overall well-being of society in the human era.

5G Sets Sail Around the Globe [Mobile Radio

The third annual Qualcomm Snapdragon Technology Summit was held on Maui, Hawaii, on 4-6 December 2018. This event featured several industry milestones related to 5G mobile communication systems and the Snapdragon mobile platforms. During the second day of the technology summit, Qualcomm Technologies unveiled the Snapdragon 855 chipset, the company?s newest generation in the Snapdragon 8 Series Mobile Platform. This is the world's first commercial mobile platform supporting, collectively, multigigabit 5G, industry-leading artificial intelligence (AI) and immersive extended reality, ushering in a new decade of revolutionary mobile devices. Using new chip architectures built on leading 7-nm process technology, the Snapdragon 855 will offer users long-lasting battery life and enhanced experiences in such areas as imaging, audio, gaming, and extended reality.

It?s Time to Go Big with 5G [Mobile Radio

In July 2018, Qualcomm Technologies unveiled the world's first fully integrated fifth-generation (5G), New Radio (NR), millimeter wave (mm-wave), and sub-6-GHz radio-frequency (RF) modules for smartphones and other mobile devices. The Qualcomm QTM052 mmwave antenna module family and the Qualcomm QPM56xx sub-6-GHz RF module family pair with the Qualcomm Snapdragon X50 5G modem to deliver modem-to-antenna capabilities across several spectrum bands in a very compact footprint suited for integration in mobile devices.

Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements

Abstract This paper describes major contributing factors to the CPI risk and reveals the mitigation strategy successfully applied jointly by GLOBALFOUNDRIES as the silicon supplier and Qualcomm Technologies, Inc., as the customer responsible for packaging. This strategy involves thermo-mechanical modelling, data collection on wafer level using shear test to assess the BEoL-stability, Cu Pillar process development and optimization. The qualification of these process changes had been completed and implemented in volume production. The paper also discusses mechanical wafer level and thermo-mechanical package modeling approaches. A model has been applied to determine the critical factors on BEoL stress/strain during the flip-chip assembly reflow process. These factors include for instance the Cu Pillar bump geometry and stack up. The results of the modelling work were used to set up experiments to further mitigate CPI related failure modes in BEoL on the package level. GLOBALFOUNDRIES and Qualcomm Technologies, Inc., assessed Cu Pillar design related rules such as Cu Pillar diameter and height as well as the Cu Pillar stack up. Process improvements were carried out to reduce the undercut of the barrier underneath the Cu Pillar. The paper reveals how effectively an optimized Cu Pillar design and improved Cu Pillar processing can contribute to the risk mitigation of CPI failure modes in the BEoL for critical package designs and assembly processes with low margin against BEoL fracture during solder reflow. Furthermore, process improvements applied to enhance the BEoL stack strength were investigated and have been implemented in high-volume production. A strong correlation was established between data collected on wafer level to assess the BEoL strength and data collected on package level.

Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology

Abstract Electrical Chip Board Interaction (e-CBI) has emerged as a new risk in chip design as silicon die can directly interact with printed circuit board (PCB) in substrate-less wafer level packaging technology. To assess this risk Qualcomm Technologies, Inc. has converted an existing test chip to wafer level packaging technology. Both the measured data and simulation results show that e-CBI risk is significant and must be carefully managed.

Profile: Beth Keser - This engineer is macgyvering a jump to Hollywood [Resources_Careers

Beth Keser is an established professional, an IEEE senior member, and a principal engineer in electronic packaging for Qualcomm Technologies. But now she's diving into a parallel career as a newbie, albeit one where she hopes to leverage her engineering chops: TV scriptwriter.

MSDGC, CH2M, and Qualcomm Technologies, Inc. Work Together to Create Step Change in Asset Management Technology

MSDGC, CH2M, and Qualcomm Technologies, Inc. Work Together to Create Step Change in Asset Management Technology

MSDGC, CH2M, and Qualcomm Technologies, Inc. Work Together to Create Step Change in Asset Management Technology

MSDGC, CH2M, and Qualcomm Technologies, Inc. Work Together to Create Step Change in Asset Management Technology

Long-Term Evolution Direct: A Device-to-Device Discovery Platform [Mobile Radio

Qualcomm Technologies and Deutsche Telekom announced that they will collaborate on the first long-term evolution (LTE) Direct operator trial in Germany. LTE Direct is expected to be an operator-owned platform that enables the next generation of proximity-based services. This platform operates in licensed spectrum and relies on the LTE physical layer. LTE Direct is a device-to-device discovery platform that enables the continuous discovery of thousands of devices and services while maintaining privacy and battery efficiency. The upcoming trial would be enabled by trial devices from Qualcomm Technologies, Samsung, and LTE Direct-enabled base stations. The standardization of LTE Direct in a Third-Generation Partnership Project (3GPP) Release 12 is expected to be completed at the end of this year.