Properties Of Field-effect Transistors Research Articles

Self-Assembled Monolayer Doping for MoTe2 Field-Effect Transistors: Overcoming PN Doping Challenges in Transition Metal Dichalcogenides.

Transition metal dichalcogenides (TMDs) have gained significant attention as next-generation semiconductor materials that could potentially overcome the integration limits of silicon-based electronic devices. However, a challenge in utilizing TMDs as semiconductors is the lack of an established PN doping method to effectively control their electrical properties, unlike those of silicon-based semiconductors. Conventional PN doping methods, such as ion implantation, can induce lattice damage in TMDs. Thus, chemical doping methods that can control the Schottky barrier while minimizing lattice damage are desirable. Here, we focus on the molybdenum ditelluride (2H-MoTe2), which has a hexagonal phase and exhibits ambipolar field-effect transistor (FET) properties due to its direct band gap of 1.1 eV, enabling concurrent transport of electrons and holes. We demonstrate the fabrication of p- or n-type unipolar FETs in ambipolar MoTe2 FETs using self-assembled monolayers (SAMs) as chemical dopants. Specifically, we employ 1H,1H,2H,2H perfluorooctyltriethoxysilane and (3-aminopropyl)triethoxysilane as SAMs for chemical doping. The selective SAMs effectively increase the hole and electron charge transport capabilities in MoTe2 FETs by 18.4- and 4.6-fold, respectively, due to the dipole effect of the SAMs. Furthermore, the Raman shift of MoTe2 by SAM coating confirms the successful p- and n-type doping. Finally, we demonstrate the fabrication of complementary inverters using SAMs-doped MoTe2 FETs, which exhibit clear full-swing capability compared to undoped complementary inverters.

The Effect of a Vacuum Environment on the Electrical Properties of a MoS2 Back-Gate Field Effect Transistor

Adsorption of gas molecules on the surface of two-dimensional (2D) molybdenum disulfide (MoS2) can significantly affect its carrier transport properties. In this letter, we investigated the effect of a vacuum environment on the electrical properties of a back-gate MoS2 FET. Benefiting from the reduced scattering centers caused by the adsorbed oxygen and water molecules in a vacuum, the current Ion/Ioff ratio of back-gate MoS2 field effect transistor increased from 1.4 × 106 to 1.8 × 107. In addition, the values of field effect carrier mobility were increased by more than four times, from 1 cm2/Vs to 4.2 cm2/Vs. Furthermore, the values of subthreshold swing could be decreased by 30% compared with the sample in ambient air. We demonstrate that the vacuum process can effectively remove absorbates and improve device performances.

Improving the optoelectronic properties of monolayer MoS2 field effect transistor through dielectric engineering

The reduced dielectric screening in atomically thin two-dimensional materials makes them very sensitive to the surrounding environment, which can be modulated to tune their optoelectronic properties. In this study, we significantly improved the optoelectronic properties of monolayer MoS2 by varying the surrounding environment using different liquid dielectrics, each with a specific dielectric constant ranging from 1.89 to 18. Liquid mediums offer the possibility of environment tunability on the same device. For a back-gated field effect transistor, the field effect mobility exhibited more than two-order enhancement when exposed to a high dielectric constant medium. Further investigation into the effect of the dielectric environment on the optoelectronic properties demonstrated a variation in photoresponse relaxation time with the dielectric medium. The rise and decay times were observed to increase and decrease, respectively, with an increase in the dielectric constant of the medium. These results can be attributed to the dielectric screening provided by the surrounding medium, which strongly modifies the charged impurity scattering, the band gap, and defect levels of monolayer MoS2. These findings have important implications for the design of biological and chemical sensors, particularly those operating in a liquid environment. By leveraging the tunability of the dielectric medium, we can optimize the performance of such sensors and enhance their detection capabilities.

Electrical Properties of Double-Gate Field-Effect Transistor Based on MA2N4 (M = Ti, Zr, and Hf; A = Si, Ge, and Sn) Monolayers

Electrical Properties of Double-Gate Field-Effect Transistor Based on MA₂N₄ (M = Ti, Zr, and Hf; A = Si, Ge, and Sn) Monolayers

Quantum Transport Properties of InAs NWFET with Surface Traps

The quantum transport properties of InAs nanowire field effect transistor (NWFET) have been calculated and analyzed depending on the surface trap concentrations. Surface traps can be either impurity atoms, dangling bonds or structural deformations. Here, we have left some In and As atoms unsaturated to obtain surface traps. Our calculations show that the on-state voltage increases as the surface trap concentration increases. Within an equivalent circuit model, we have found that the effective field mobility is as low as 250 cm2/V.s following with small transconductance value of 2.4 nS for our simulated device. This shows that surface traps significantly effect the benchmarking properties of InAs NWFET.

Probing the Electronic and Opto-Electronic Properties of Multilayer MoS2 Field-Effect Transistors at Low Temperatures.

Transition metal dichalcogenides (TMDs)-based field-effect transistors (FETs) are being investigated vigorously for their promising applications in optoelectronics. Despite the high optical response reported in the literature, most of them are studied at room temperature. To extend the application of these materials in a photodetector, particularly at a low temperature, detailed understanding of the photo response behavior of these materials at low temperatures is crucial. Here we present a systematic investigation of temperature-dependent electronic and optoelectronic properties of few-layers MoS2 FETs, synthesized using the mechanical exfoliation of bulk MoS2 crystal, on the Si/SiO2 substrate. Our MoS2 FET show a room-temperature field-effect mobility μFE ~40 cm2·V-1·s-1, which increases with decreasing temperature, stabilizing at 80 cm2·V-1·s-1 below 100 K. The temperature-dependent (50 K < T < 300 K) photoconductivity measurements were investigated using a continuous laser source λ = 658 nm (E = 1.88 eV) over a broad range of effective illuminating laser intensity, Peff (0.02 μW < Peff < 0.6 μW). Photoconductivity measurements indicate a fractional power dependence of the steady-state photocurrent. The room-temperature photoresponsivity (R) obtained in these samples was found to be ~2 AW-1, and it increases as a function of decreasing temperature, reaching a maximum at T = 75 K. The optoelectronic properties of MoS2 at a low temperature give an insight into photocurrent generation mechanisms, which will help in altering/improving the performance of TMD-based devices for various applications.

Synergistic Use of All-Acceptor Strategies for the Preparation of an Organic Semiconductor and the Realization of High Electron Transport Properties in Organic Field-Effect Transistors.

The development of n-type organic semiconductor materials for transporting electrons as part of logic circuits is equally important to the development of p-type materials for transporting holes. Currently, progress in research on n-type materials is relatively backward, and the number of polymers with high electron mobility is limited. As the core component of the organic field-effect transistor (OFET), the rational design and judicious selection of the structure of organic semiconductor materials are crucial to enhance the performance of devices. A novel conjugated copolymer with an all-acceptor structure was synthesized based on an effective chemical structure modification and design strategy. PDPPTT-2Tz was obtained by the Stille coupling of the DPPTT monomer with 2Tz-SnMe3, which features high molecular weight and thermal stability. The low-lying lowest unoccupied molecular orbital (LUMO) energy level of the copolymer was attributed to the introduction of electron-deficient bithiazole. DFT calculations revealed that this material is highly planar. The effect of modulation from a donor-acceptor to acceptor-acceptor structure on the improvement of electron mobility was significant, which showed a maximum value of 1.29 cm2 V-1 s-1 and an average value of 0.81 cm2 V-1 s-1 for electron mobility in BGBC-based OFET devices. Our results demonstrate that DPP-based polymers can be used not only as excellent p-type materials but also as promising n-type materials.

MoRe Electrodes with 10 nm Nanogaps for Electrical Contact to Atomically Precise Graphene Nanoribbons.

Atomically precise graphene nanoribbons (GNRs) are predicted to exhibit exceptional edge-related properties, such as localized edge states, spin polarization, and half-metallicity. However, the absence of low-resistance nanoscale electrical contacts to the GNRs hinders harnessing their properties in field-effect transistors. In this paper, we make electrical contact with nine-atom-wide armchair GNRs using superconducting alloy MoRe as well as Pd (as a reference), which are two of the metals providing low-resistance contacts to carbon nanotubes. We take a step toward contacting a single GNR by fabricating electrodes with needlelike geometry, with about 20 nm tip diameter and 10 nm separation. To preserve the nanoscale geometry of the contacts, we develop a PMMA-assisted technique to transfer the GNRs onto the prepatterned electrodes. Our device characterizations as a function of bias voltage and temperature show thermally activated gate-tunable conductance in GNR-MoRe-based transistors.

Electrical and Electronic Properties of Magnesium/Molybdenum Disulfide Heterojunction Field Effect Transistors: A Theoretical Study

The present article designs two-dimensional heterojunction duplex material FETs based on binary monolayer material, Mg and molybdenum disulfide. Despite having a hexagonal crystal structure, the monolayer Mg and molybdenum disulfide have good lattice matching ability, with a mismatch degree of approximately 5%. The electrostatic characteristics of Mg/molybdenum disulfide field effect transistors (FETs) are well suited for compact fabrication. Electronic structure of first-principles investigations, optical, mechanical, and electrochemical properties of MODES field-effect transistors based on density functional theory are mastered in order to master the electrostatic doping associated features of FETs. Based on the Silvaco TCAD platform, this simulation study was performed. There is theoretical value in engineering practice, both in terms of design and application.

Modeling the Impact of Phonon Scattering with Strain Effects on the Electrical Properties of MoS2 Field-Effect Transistors.

Molybdenum disulfide (MoS2) has distinctive electronic and mechanical properties which make it a highly prospective material for use as a channel in upcoming nanoelectronic devices. An analytical modeling framework was used to investigate the I-V characteristics of field-effect transistors based on MoS2. The study begins by developing a ballistic current equation using a circuit model with two contacts. The transmission probability, which considers both the acoustic and optical mean free path, is then derived. Next, the effect of phonon scattering on the device was examined by including transmission probabilities into the ballistic current equation. According to the findings, the presence of phonon scattering caused a decrease of 43.7% in the ballistic current of the device at room temperature when L = 10 nm. The influence of phonon scattering became more prominent as the temperature increased. In addition, this study also considers the impact of strain on the device. It is reported that applying compressive strain could increase the phonon scattering current by 13.3% at L = 10 nm at room temperature, as evaluated in terms of the electrons' effective masses. However, the phonon scattering current decreased by 13.3% under the same condition due to the existence of tensile strain. Moreover, incorporating a high-k dielectric to mitigate the impact of scattering resulted in an even greater improvement in device performance. Specifically, at L = 6 nm, the ballistic current was surpassed by 58.4%. Furthermore, the study achieved SS = 68.2 mV/dec using Al2O3 and an on-off ratio of 7.75 × 104 using HfO2. Finally, the analytical results were validated with previous works, showing comparable agreement with the existing literature.

Recovering the Intrinsic Electrical Property of a Graphene Field-Effect Transistor by Interface Cleaning Technology

Recovering the Intrinsic Electrical Property of a Graphene Field-Effect Transistor by Interface Cleaning Technology

Stability and Power Analysis of Schmitt Trigger Based Low Power SRAM Bit-Cell Using CMOS and CNTFET Technology at 22nm Technology Node

SRAM (Static Random Access Memory) is an essential component of memory devices such as laptops, phones, etc., which act as a semiconductor memory. The “Carbon Nanotube Field Effect Transistor (CNTFET)” is silicon associated high-stability, low-power device with excellent performance. CNTFET has been verified to be very advantageous for Very large-scale integration circuit designs in the nanoscale range because of its remarkable properties of metal oxide semiconductor field effect transistor (MOSFET). The material was brought to light because of its genuinely incredible electrochemical performance. Carbon nanotubes have unique properties such as high charge carrier mobility, high voltage, small footprint, exceptionally short and high control over pulse duration, and large current densities. In traditional MOSFET, bulk silicon is used, which has high leakage current and high field-effect; thus, CNTFET has been used as an alternative in recent years. When compared to the 10T CNTFET SRAM Bit cell is designed using HSPICE Tool in 22nm technology. Long-term stability and significant process variable changes are significant challenges with nanoscale SRAM cells.

Intrinsic Electronic Properties of BN-Encapsulated, van der Waals Contacted MoSe2 Field-Effect Transistors

Two-dimensional (2D) semiconductors have attracted considerable interest for their unique physical properties. Here, we report the intrinsic cryogenic electronic transport properties in few-layer MoSe2 field-effect transistors (FETs) that are fully encapsulated in ultraclean hexagonal boron nitride dielectrics and are simultaneously van der Waals contacted with gold electrodes. The FETs exhibit electronically favorable channel/dielectric interfaces with low densities of interfacial traps (< 1010 cm−2), which lead to outstanding device characteristics at room temperature, including near-Boltzmann-limit subthreshold swings (65 mV/dec), high carrier mobilities (53–68 cm2⋅V−1⋅s−1), and negligible scanning hystereses (< 15 mV). The dependence of various contact-related parameters with temperature and carrier density is also systematically characterized to understand the van der Waals contacts between gold and MoSe2. The results provide insightful information about the device physics in van der Waals contacted and encapsulated 2D FETs.

Optimization of 14 nm double gate Bi-GFET for lower leakage current

In recent years, breakthroughs in electronics technology have resulted in upgrades in the physical properties of the metal oxide semiconductor field effect transistor (MOSFET) toward smaller sizes and improvements in both quality and performance. Hence, the growth field effect transistor (GFET) is being promoted as one of the worthy contenders due to its superior material characteristics. A 14 nm horizontal double-gate bilayer graphene FET with a high-k/metal gate is proposed, which is composed of hafnium dioxide (HfO 2 ) and tungsten silicide (WSi x ) respectively . It is simulated and modelled using silvaco ATHENA and ATLAS technology computer-aided design (TCAD) tools, as well as the Taguchi L9 orthogonal array (OA). The threshold voltage (V TH ) adjustment implant dose, V TH adjustment implant energy, source/drain (S/D) implant dose, and S/D implant energy have all been investigated as process parameters. While the V TH adjustment tilt angle and the S/D implant tilt angle have both been investigated as noise factors. When compared to the initial findings before optimization, the I OFF has a value of 29.579 nA/µm, indicating a significant improvement. Findings from the optimization technique demonstrate excellent device performance with an I OFF of 28.564 nA/µm, which is closer to the international technology roadmap semiconductor (ITRS) 2013 target than before.

Low-Temperature Direct Growth of Amorphous Boron Nitride Films for High-Performance Nanoelectronic Device Applications.

We successfully demonstrated the improvement and stabilization of the electrical properties of a graphene field effect transistor by fabricating a sandwiched amorphous boron nitride (a-BN)/graphene (Gr)/a-BN using a directly grown a-BN film. The a-BN film was grown via low-pressure chemical vapor deposition (LPCVD) at a low growth temperature of 250 °C and applied as a protection layer in the sandwiched structure. Both structural and chemical states of the as-grown a-BN were verified by various spectroscopic and microscopic analyses. We analyzed the Raman spectra of Gr/SiO2 and a-BN/Gr/a-BN structures to determine the stability of the device under exposure to ambient air. Following exposure, the intensity of the 2D/G-peak ratio of Gr/SiO2 decreased and the position of the G and 2D peaks red-shifted due to the degradation of graphene. In contrast, the peak position of encapsulated graphene is almost unchanged. We also confirmed that the mobility of a-BN/Gr/a-BN structure is 17,941 cm2/Vs. This synthetic strategy could provide a facile way to synthesize uniform a-BN film for encapsulating various van der Waals materials, which is beneficial for future applications in nanoelectronics.

Surface band bending caused by native oxides on solution-processed twinned InSb nanowires with p-type conductivity.

Indium antimonide nanowires (InSb NWs) are attractive building-block candidates for bottom-up construction of high-efficiency electronics and optoelectronics due to their narrow direct band gap, fast room temperature carrier mobilities and small exciton binding energy. However, InSb NWs synthesized by the vapor-liquid-solution (VLS) mechanism generally suffer from an increased carrier and phonon scattering rate, which is thought to be caused by randomly distributed crystal defects along the NW growth direction. In this study, by utilizing the recently developed low-temperature, solution-processed technique, these crystal defects were successfully suppressed by periodically distributed twin planes to form twinned InSb nanowires. Importantly, measurements of the electrical transport properties of field effect transistors (FETs) reveal that the InSb NWs exhibit a hole-dominated conductivity with room temperature mobilities of up to 50.71 cm2 V-1 s-1, which is distinctly contrary to the intrinsic n-type InSb NWs. This observation of n-p switching behavior is probably attributed to the surface band bending effect with regard to the Fermi energy level, which is caused by surface oxide trap states arising from the native-oxide layer at the surface of the InSb NWs. All these results illustrate that the as-prepared colloidal InSb NWs can potentially be used as p-type materials for integration with next-generation nanoscale electronics and optoelectronics via surface engineering.

Impact of high-k metal oxide as gate dielectric on the certain electrical properties of silicon nanowire field-effect transistors: A simulation study

Standard Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) are gaining prominence in low-power nanoscale applications. This is largely attributed to their proximity to physical and thermal limits, rendering them a compelling option for energy-efficient electronic devices. In this study, we hypothesized that the high-? HfO2 in a quasi-ballistic SiNW MOSFET acts as the gate dielectric. In this case, the data from the TCAD simulation and the model demonstrated exceptional agreement. The proposed model for a SiNW MOSFET with high-? HfO2 exhibits a consistently increasing drain current, albeit with a smaller magnitude compared to a quasi-ballistic device (QBD). Additionally, it shows reduced mobility and decreased transconductance when considering the combined effects of scattering and temperature. As gate voltage increases, temperatureinduced transconductance decline in SiNW MOSFETs becomes significant. Our method is suitable for modeling scattered SiNW MOSFETs with temperature effects, as TGF values are similar in the subthreshold region for both Near Ballistic and Scattered SiNW MOSFET models.

Manipulation of the electrical and memory properties of MoS2 field-effect transistors by highly charged ion irradiation.

Field-effect transistors based on molybdenum disulfide (MoS2) exhibit a hysteresis in their transfer characteristics, which can be utilized to realize 2D memory devices. This hysteresis has been attributed to charge trapping due to adsorbates, or defects either in the MoS2 lattice or in the underlying substrate. We fabricated MoS2 field-effect transistors on SiO2/Si substrates, irradiated these devices with Xe30+ ions at a kinetic energy of 180 keV to deliberately introduce defects and studied the resulting changes of their electrical and hysteretic properties. We find clear influences of the irradiation: while the charge carrier mobility decreases linearly with increasing ion fluence (up to only 20% of its initial value) the conductivity actually increases again after an initial drop of around two orders of magnitude. We also find a significantly reduced n-doping (≈1012 cm-2) and a well-developed hysteresis after the irradiation. The hysteresis height increases with increasing ion fluence and enables us to characterize the irradiated MoS2 field-effect transistor as a memory device with remarkably longer relaxation times (≈ minutes) compared to previous works.

Epitaxial van der Waals contacts of 2D TaSe2-WSe2 metal-semiconductor heterostructures.

The electronic contact between two-dimensional (2D) transition metal dichalcogenide (TMD) semiconductors and metal electrodes is a formidable challenge due to the undesired Schottky barrier, which severely limits the electrical performance of TMD devices and impedes the exploration of their unconventional physical properties and potential electronic applications. In this study, we report a two-step chemical vapor deposition (CVD) growth of 2D TaSe2-WSe2 metal-semiconductor heterostructures. Raman mapping confirms the precise spatial modulation of the as-grown 2D TaSe2-WSe2 heterostructures. Transmission electron microscopy (TEM) characterization reveals that this two-step method provides a high-quality and clean interface of the 2D TaSe2-WSe2 heterostructures. Meanwhile, the upper 1T-TaSe2 is formed heteroepitaxially on/around the pre-synthesized 2H-WSe2 monolayers, exhibiting an epitaxial relationship of (20-20)TaSe2//(20-20)WSe2 and [0001]TaSe2//[0001]WSe2. Furthermore, characterization studies using a Kelvin probe force microscope (KPFM) and electrical transport measurements present compelling evidence that the 2D metal-semiconductor heterostructures under investigation can improve the performance of electrical devices. These results bear substantial significance in augmenting the properties of field-effect transistors (FETs), leading to notable improvements in FET mobility and on/off ratio. Our study not only broadens the horizons of direct growth of high-quality 2D metal-semiconductor heterostructures but also sheds light on potential applications in future high-performance integrated circuits.

Hysteretic behavior of all CVD h-BN/graphene/h-BN heterostructure field-effect transistors by interfacial charge trap

Superior electrical transport properties of graphene field-effect transistors (FETs) can be achieved when graphene is supported by a high-quality hexagonal boron nitride (h-BN) layer. The h-BN layer can serve as a high-performance insulator for a graphene channel to achieve high carrier mobility and to minimize doping effects on graphene by screening out the interaction with a gate oxide substrate. However, chemical vapor deposition (CVD) grown h-BN can have surface defects and impurities unlike mechanically exfoliated h-BN layers, which can result in completely different electrical transport properties of graphene FETs. In this study, we fabricated all CVD h-BN/graphene/h-BN FETs to explore how surface defects and impurities on the supporting h-BN layer can influence electrical transport properties of graphene. The presence of surface defects and impurities on the supporting h-BN layer, as revealed by Raman spectroscopy analysis, resulted in significant p-doping and hysteresis in the h-BN/graphene/h-BN FETs. Hysteresis in the FETs was induced by charge carrier trapping at the surface defects and impurities of the h-BN layer, which can be controlled by modulating a back-gate voltage. Based on the charge trapping mechanism on the surface of the h-BN, electrical charge states in all CVD h-BN/graphene/h-BN can be modulated dynamically by realizing two different resistance states (‘trap’ vs. ‘release’ states), which can be utilized as memristive devices or sensors.