Polycrystalline diamond (PCD) has ultra-high thermal conductivity and is suitable for use as a thermal substrate material for semiconductor power devices. However, the high hardness, good wear resistance and chemical inertness of PCD lead to low machining efficiency and poor machined surface quality. Chemically assisted mechanical polishing based on the photo-Fenton reaction enables efficient PCD processing and high surface quality. In this study, Box-Behnken response surface experiments were employed to investigate the influence of the photo-Fenton reaction polishing process parameters (H₂O₂ concentration, light intensity, polishing pressure and abrasive concentration) and their interactions on the polishing process. Regression equations were constructed to model the material removal rate (MRR) and surface roughness (Ra) and to optimise the process parameters. Finally, the polishing mechanism was analysed. The results demonstrated that the effects of polishing pressure, polishing pressure-abrasive concentration, abrasive concentration and H2O2 concentration on the material removal rate were statistically significant. Furthermore, the effects of polishing pressure, H2O2 concentration, abrasive concentration, polishing pressure-abrasive concentration, H2O2 concentration-light intensity and light intensity on the surface roughness were also found to be statistically significant. The optimal process parameters were identified as a light intensity of 150 mW/cm2, a H₂O₂ concentration of 15 wt%, a polishing pressure of 0.89 MPa, and an abrasive concentration of 5 wt%. These parameters yielded a material removal rate of up to 666.9 nm/h and a surface roughness of Ra 2.58 nm. The polishing mechanism of the photo-Fenton reaction on PCD can be described as follows: the photo-Fenton reaction produces •OH, which then oxidises the PCD surface to generate an oxide layer. This layer is subsequently removed by the mechanical action of the abrasive, and the oxidation and mechanical removal continue to occur on the exposed new PCD surface. It has been demonstrated that, under the condition of balance between the mechanical action and the chemical action, a better quality of the surface can be obtained. This paper offers further evidence in support of the use of the photo-Fenton reaction in the context of PCD polishing.
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