Poly Arylene Ether Nitrile Research Articles

Controlled Distribution of MXene on the Pore Walls of Polyarylene Ether Nitrile Porous Films for Absorption-Dominated Electromagnetic Interference Shielding Materials.

With the increasing application of electronic devices, absorption-dominated electromagnetic interference shielding materials (EMISM) have garnered significant attention for preventing secondary electromagnetic pollution. In this study, polyethyleneimine (PEI)-modified MXene (PEI@MXene) is fabricated and achieved its controlled distribution on the pore walls of polyarylene ether nitrile (PEN) porous films via the phase inversion method (PIM) to obtain a closed porous skeleton of MXene on the pore walls (CPS-MPW). The resulting PEI@MXene/PEN composite film (CFx) exhibited absorption-dominated EMIS efficiency (EMISE). Attributing to the strong interaction between PEI and the hydrophilic segment of amphiphilic Pluronic F127, with its hydrophobic segment anchored by the PEN matrix, PEI@MXene is directionally distributed on the pore walls of CFx. In addition, resulting from the cladding of MXene with PEI and isolating it with closed honeycomb pores, the obtained CFx are insulators without forming aconductive network. As a result, these CFx demonstrate absorption-dominated EMISE with the highest SET of 41.2 dB and coefficient A higher than 0.51. Further continuous hot pressing of CFx results in thinner and denser films with an impressive specific EMISE up to 750 dBcm-1. The successful fabrication of these CPS-MPW-type CFx with absorption-dominated EMISE provides a reference for developing and preparing novel EMISM.

Distributing fluorinated carbon nanotube on pore walls of polyarylene ether nitrile porous films for advanced electromagnetic interference shielding

Distributing fluorinated carbon nanotube on pore walls of polyarylene ether nitrile porous films for advanced electromagnetic interference shielding

Improvement of wear resistance of polyarylene ether nitrile composites through synergistic effect of PTFE and ZnO

Semi-crystalline polyarylene ether nitrile (PEN) has good thermal and mechanical properties, but its wear resistance needs to be improved, which limits its application in extreme environments. In this work, PEN was used as a matrix resin, disc-shaped zinc oxide (ZnO) was used as a wear-resistant reinforcing filler and nucleating agent, and polytetrafluoroethylene (PTFE) solid lubricating phase was introduced to fabricate the PEN/ZnO/PTFE composites. The lowest coefficient of friction and wear rate of PEN-based composites were observed when filled with 7.5 wt% of PTFE. To further improve the hardness and elastic modulus, the PEN/ZnO/PTFE composites were subjected to heat treatment, and the wear rate was decreased by 26.1 %. In addition, the properties of the composites were investigated under different loading conditions and the results showed a significant improvement in the tribological properties. This study further confirms that the synergistic effect of the rigid filler (ZnO) and solid lubricant (PTFE) can substantially reduce friction and wear. Thus, it is a significant advancement in the development of high-performance wear resistant PEN- based composites.

Polyarylene ether nitrile/boron nitride nanosheets thermally conductive films through heterogeneous multilayer electrostatic spinning

Thermal management materials with excellent thermal conductivity and electrical insulation are highly favorable in the modern integrated electronic areas. In present work, a novel polyarylene ether nitrile (PEN) composite film, integrating thermal conductivity, electrical insulation, and flexibility, was fabricated utilizing a hybrid approach combining heterogeneous multilayer electrostatic spinning with a subsequent hot pressing technique. BNNS acts as a thermally conductive filler which builds a good thermal conduction pathway, and PEN acts as a bonding agent which ensures the flexibility and insulation of the film. Heterogeneous multilayer electrostatic spinning ensures the formation of thermal conduction pathways. Compared to conventional composite film, heterogeneous multilayer film shows excellent thermal conductivity, increases by 83% in-plane, and 71% through-plane, respectively. Therefore, This work will provide a technological reserve for the preparation of thermally conductive and insulating flexible films.

Facile dual-functionalization of PEN nanofibrous membranes with solar evaporation and photocatalysis for efficient dye wastewater purification

Purification of dye wastewater by combining photocatalytic degradation with solar energy-driven interfacial water evaporation has emerged as a promising approach to address water pollution in recent years. In this work, a high-performance polymer, polyarylene ether nitrile (PEN), was electrostatically spun to construct a robust nanofibrous substrate, then dual-functionalized using polyaniline (PANI) and titanium dioxide (TiO2) via a facile polydopamine (PDA)-assisted vacuum self-assembly method. Moreover, the CA of the PEN membrane after PDA and PANI@TiO2 treatment changes from 20° to 0° within 0.4 s, showing superhydrophilic properties and providing rapid water supply for water evaporation. PANI and TiO2 were employed as the photo-thermal conversion component and photocatalytic component, respectively. The fabricated dual-functionalized PANI@TiO2/PEN composite nanofibrous membrane exhibited a high water evaporation rate of up to 3.23 kg m−2 h−1 under a simulated solar illumination of 1 KW m−2. Owing to the reduction in the photoelectron-hole recombination rate promoted by PANI, the composite nanofibrous membrane demonstrated a favorable dye removal rate of 92.18% in 6 h for methylene blue (MB). Furthermore, the robust PEN nanofibrous skeleton conferred the composite membrane with thermal resistance and corrosion resistance properties, ensuring long-term performance in harsh environments. The facile fabricated PANI@TiO2/PEN membrane achieved comprehensive performance, offering a promising strategy by combining solar-driven interfacial water evaporation and photocatalytic degradation for water purification.

Sandwich‐structured dielectrics constructed from carbon nanotube and polyarylene ether nitrile composite layers demonstrating positive and negative permittivity

Sandwich‐structured dielectrics constructed from carbon nanotube and polyarylene ether nitrile composite layers demonstrating positive and negative permittivity

Multifunctional basalt fiber reinforced polymer composites with in-situ damage self-sensing and temperature-sensitive behavior

In this work, a multifunctional basalt fiber reinforced polymer composite (BFRP) with damage self-sensing and temperature-sensitive behavior was developed. Firstly, carbon nanotubes (CNTs) were deposited on basalt fibers (BF) by electrostatic self-assembly. Then, strong shear forces were applied during melt mixing with polyarylene ether nitrile (PEN) to construct a structure of CNTs surrounding the BF (CSB). This CSB structure endowed the composite with a low percolation threshold (0.82 wt% CNTs), a high conductivity (1.53 × 10−2 S/m at 1.12 wt% CNTs) and enhanced mechanical properties. The combination of resistance and acoustic emission real-time measurements confirmed that the composite achieved an excellent damage self-sensing capability with a maximum gauge factor (GF) of 7.68. Moreover, the composite exhibited a temperature-sensitive behavior with a temperature coefficient of resistance (TCR) of 0.542 %/°C. This study provides a significant guidance for the development of multifunctional BFRP with damage self-sensing and temperature sensitive behavior.

Improving energy storage properties of polyarylene ether nitrile with coral-like CaCu3Ti4O12 nanorods

Film capacitors have attracted widespread attention in the field of power electronics due to their advantages of long service life, high-power density, rapid charging and discharging rates, operational safety, among others. Nonetheless, the persisting challenge regarding the dielectric capacitors’ insufficient energy storage density remains the primary obstacle impeding their advancement. Herein, one-dimensional (1D) coral-like calcium copper titanate (CaCu3Ti4O12) nanorod (CCTONR) is fabricated and interface modified to enhance energy storage properties of polyarylene ether nitrile (PEN). The CCTONR is fabricated through a two-step hydrothermal reaction followed by calcination, and then modified by KH550 and sulphonated PEN sequentially offering SPEN@CCTONR. Due to the 1D nature and the functionalization of SPEN on the surface of CCTONR, the compatibility and the distribution state of SPEN@CCTONR in the PEN matrix are conspicuously improved. Furthermore, a secondary dispersion of SPEN@CCTONR is achieved in the SPEN@CCTONR/PEN composite via uniaxial hot-stretching. As a result, the dielectric permittivity is increased to 17.96, while the breakdown strength remains 199.4 kV/mm for the stretched SPEN@CCTONR/PEN film with filler content of 15 wt%. Correspondingly, an energy storage density of 3.16 J/cm3, with an boosting of 320 % in comparing with that of PEN, is achieved. This stretched SPEN@CCTONR/PEN film with leaped energy storage density would be a promising candidate for future flexible dielectric materials.

Highly efficient thermal conductivity of polyarylene ether nitrile composites via the introduction of hybrid fillers and tailored cross-linked structure

Polymer dielectrics with high thermal conductivity (λ) and excellent insulating properties are of interest in miniaturized and integrated electronic devices. However, most polymers are unable to fulfill this need due to their inherent structure. In this work, a polymer alloy with balanced thermal conductive and dielectric properties was successfully prepared by polyarylene ether nitrile(PEN), bisphthalonitrile-microsphere@boron nitride nanosheets(Bm@BNNS), and silicon carbide whisker (SiCws) at different scales. Specifically, introduction of Bm@BNNS fillers with core-shell structure into PEN resins results in heterogeneous interfaces, which effectively reduces the agglomeration and dosage of BNNS and synergistically improves the λ and dielectric performance. Besides, it has high breakdown strength (Eb) and high energy storage density (242.26 kV/mm, 1.66J/cm3) when filled with only 4.37 vol% BNNS compared to pure PEN. Furthermore, effects of one-dimensional SiCws at different scales on formation of heat-conduction pathways and electrical insulation properties of PEN/Bm@BNNS composites were investigated. The findings display that PEN/Bm@BNNS/SiCws composites with large size SiCws (7.81 vol%) achieved a high λ of 2.376 W/m.K, which was 135.24 % and 87.09 % higher than pure PEN and PEN/Bm@BNNS composites, respectively. Thus, the thermal conductive pathways are constructed by line-plate structure (SiCws-BNNS), and insulating performance primarily on the core-shell structure (Bm@BNNS). Besides, the novel PEN/Bm@BNNS/SiCws hybrid materials are together with a low coefficient of thermal expansion of 38–89 ppm/°C and high Tg of 220 °C. Thus, it gives a promising insight to achieve highly λ polymer-based insulating film materials used for high-temperature-resistant fields.

Polyarylene ether nitrile dielectric composites with good formability and processability

High dielectric constant polymer matrix composites are widely used in the domain of dielectric energy storage and electric field regulation depending on their high energy density, easy processing and light weight. Nevertheless, high dielectric constants are often achieved by adding fillers to the polymer, which increase the viscosity of the resin and make processing difficult. In this work, a novel filler GO coated with silicone powder (GO-silicone) was designed and prepared. The silicone powder on the surface of GO acts as a lubricant and improves the dispersion of GO in the polyarylene ether nitrile (PEN) resin, thus enhancing the dielectric properties of the PEN-based composite. The dielectric constant of the PEN/GO-silicone composite film with 4 wt% filler loading reaches 15.9 at 1 kHz, which is 4.3 times greater than that of the pure PEN film and 1.1 times greater than that of PEN composite simply filled with GO and silicone powder. Besides, the incorporation of GO-silicone declines the viscosity, which is very favorable for the processing and shaping of high dielectric composites. This work provides a novel technical route for the large-scale production of high dielectric composites.

In-situ polymerization of PANI nanocone array on PEN nanofibrous membranes for solar-driven interfacial evaporation

Solar-driven interfacial evaporation (SDIE) holds great potential for desalination, but it also poses challenges to application performance. Herein, a novel polyaniline (PANI) modified polyarylene ether nitrile (PEN) electrospun nanofibrous membranes (PANI@PEN) was developed by introducing PDA and CTAB, which increased the polymerization amount of PANI and controlled its morphology by sequential in-situ polymerization, aiming to enhance its SDIE comprehensive performance. This unique structure can generate multiple diffuse reflections under sunlight, resulting in the highest water evaporation rate of the nanofibrous membrane at 1.822 kg m−2 h−1, while evaporation rate at 1.527 kg m−2 h−1 for a 3.5 wt% sodium chloride solution. Due to the good flexibility of PEN polymer substrate, the obtained membranes can be easily arched, showcasing an interesting ability to collect salt through salt deposition. Meanwhile, PEN also provides a robust skeleton, endowed PANI@PENs with corrosion-resistant, capable of desalination in acidic media, purifying heavy metal ion solutions through evaporation, as well as good mechanical properties for reusability. The study potentially provides a strategy for utilizing dopamine and CTAB loaded on high-performance polymer nanofibrous membranes and the convenient in-situ polymerization to generate advanced photothermal PANI. This strategy paves a way to enable high-performance engineering polymer, PEN, with solar-thermal evaporation capabilities, further opening its potential applications in seawater desalination and industrial wastewater purification.

Core-shell structure polydopamine and polyethylenimine co-assisted MoS2-BaTiO3/polyarylene ether nitrile nanocomposites for high-temperature resistant organic dielectrics

In this work, a novel nanoparticle ((MoS2-BT)@(PDA+PEI)) was constructed through two-dimensional molybdenum disulfide (MoS2) and zero-dimensional barium titanate (BT) via in-situ polymerization and co-modification of polydopamine (PDA) and polyethylenimine (PEI). Then the nanofillers were dispersed in the Polyarylene ether nitrile (PEN) matrix by film casting to obtain PEN/(MoS2-BT)@(PDA+PEI) nanocomposite dielectric films. Subsequently, the latter were subjected to chemical crosslinking at high temperature to obtain CPEN/(MoS2-BT)@(PDA+PEI) nanocomposites. The effects of filler content on the properties of PEN matrix composite films were investigated. The results indicate excellent compatibility between (MoS2-BT)@(PDA+PEI) and the PEN matrix due to the introduction of an organic modification layer, resulting in overall good performance of nanocomposite films, including good thermal stability with a glass transition temperature (Tg) exceeding 240 °C after chemical crosslinking. The dielectric constant of CPEN nanocomposites containing 40wt% of the hybrid nanoparticles is 20.2 and the dielectric loss is 0.032 at 1kHz, the dielectric constant-temperature coefficient of all CPEN nanocomposites is less than 6×10-4 °C-1 at the temperature range of 25-220 °C. In short, the incorporation of (MoS2-BT)@(PDA+PEI) effectively enhances the thermal, mechanical, and dielectric properties of PEN-based nanocomposites.

Synthesis and Properties of Semicrystalline Poly(ether nitrile ketone) Copolymers.

As a high-performance engineering plastic, polyarylene ether nitrile (PEN) is widely used in many fields. The presence of cyano groups of PEN ensures its good adhesion to other substrates, but the inherent low crystallinity of PEN limits its application. In this work, the poly(aryl ether ketone) segment was introduced into PEN via copolymerization using both 2,6-Dichlorobenzonitrile and 4,4'-Difluorobenzophenone as the starting reagents to prepare poly (ether nitrile ketone) (BP-PENK). The effect of composition and thermal treatment on the crystallization behavior and properties of poly (ether nitrile ketone) were systematically studied. It was found that when the content of DFBP is 30%, the copolymer BP-PENK30 had the best mechanical properties, with a tensile strength of 109.9 MPa and an elongation at a break value of 45.2%. After thermal treatment at 280 °C for 3 h, BP-PENK30 had the highest crystallinity with a melting point of 306.71 °C, a melting enthalpy of 5.02 J/g, and crystallinity of 11.83%. Moreover, with the increase in crystallinity, the dielectric constant and energy density increased after thermal treatment. Therefore, the introduction of poly(aryl ether ketone) chain segments and thermal treatment can effectively improve the crystallization and the comprehensive properties of PEN.

Lightweight and high-strength polyarylene ether nitrile-based composites for efficient electromagnetic interference shielding

Abstract The proliferation of electronic devices and the widespread adoption of microwave-based technologies have resulted in a notable rise in electromagnetic radiation pollution. In present work, a novel flexible lightweight polyarylene ether nitrile (PEN)-based composite for efficient electromagnetic interference (EMI) shielding was prepared by introducing dual-loss hybrid material (PKMWCNT@Fe3O4) into PEN via non-solvent induce phase separation method and assembling it layer-by-layer with carbon fiber (CF) fabric. The porous morphology of the PEN layer, the electrical conductivity of the CF fabric, and the dual-loss property of the filler enable the material to reflect and absorb electromagnetic waves multiple times, resulting in superior electromagnetic shielding performance. With the addition of PKMWCNT@Fe3O4 at a mass fraction of 50%, the EMI SE T and specific shielding effectiveness SSE/t can reach up to 47.08 dB and 617 dB cm2/g, respectively, indicating absorption dominated shielding mechanism. Furthermore, the material exhibits a lightweight nature with a density of 0.55 g/cm3, and excellent mechanical properties, including a tensile strength of 43.98 MPa and elongation at break of 43.32%. This work presents a new approach to prepare high-performance composites that are both lightweight and resistant to secondary contamination by electromagnetic waves.

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

AbstractThermal conductive polymer‐based composites synchronously with stable dielectric and excellent mechanical properties are urgently needed for high‐temperature‐resistant electronic devices. Here, a significant improvement in the thermal conductivity (TC), thermal stability, dielectric, and mechanical performance was simultaneously achieved in the polyarylene ether nitrile (PEN)/divinyl siloxane‐bisbenzocyclobutene (BCB) matrix through the incorporation of boron nitride nanosheets (BNNS) combined together with the post‐solid phase chemical reaction technique. The significant increase in the effective filler‐filler and filler‐crystal contacts in the composites was the main reason for the improvement in TC and dielectric constant. Besides, glass transition temperature (Tg) and mechanicals were enhanced in the presence of cross‐linked networks. By synchronously adding 15 vol% BNNS, the TC of composites after treatment reached up to 5.582 W/m.K, enhanced by 4.4 times higher than untreated. The dielectric constant was down to 2.93 at 1 MHz and the loss remained at a relatively low level. Meanwhile, the composite showed significantly enhanced thermal stability, mechanicals, and hydrophobicity (Tg = 336°C, T5% = 529°C, tensile strength and modulus was 94.5 MPa and 5.3 GPa, respectively, the contact angle was 101.76°). Thus, it promotes an effective strategy for fabricating a high‐performance‐polymer composite, which has the potential used in electronic materials.Highlights Crystallization‐crosslinking strategy optimizes overall performance. Crystals fill gaps between BNNS layers and connect thermal conductive pathway. Crosslinked networks limit molecular chain motion to reduce phonon scattering. The highest TC of the PEN/BCB/BNNS composite is up to 7.451 W/m.K. Thermal property shows significant improvement after crosslinking especially Tg.

Polyarylene ether nitrile/divinyl siloxane‐bisbenzocyclobutene composite films: Curing reaction and thermal/mechanical/dielectric properties

AbstractPolymer dielectrics, are commonly used as insulating materials for electronic products. Light weight, good mechanical properties and high thermal conductivity are important properties. However, electrical and thermal parameters are interrelated, and it is challenging to have a dielectric polymer that is also resistant to high temperatures and high thermal conductivity. Hence, high‐performance composite films were prepared by the method of post‐solid phase chemical reaction using polyarylene ether nitrile (PEN) and divinyl siloxane‐bisbenzocyclobutene (BCB) as raw materials. First, parameters of the curing reaction were determined by rheological and activation energy calculations. Then, through adjusting the content of BCB resin and treatment temperature, the performance of PEN/BCB composites could be tuned. Thermal properties have been studied by differential scanning calorimetry, dynamic mechanical analysis, thermal gravimetric analysis, and hot‐disk method. Here, the PEN/BCB composite electric insulating materials with outstanding thermal performance (Tg: 208–400°C, T5%: 469–544°C, thermal conductivity: 1.270–2.215 W/m K). Besides, its mechanical and dielectric properties were investigated in detail. It is noteworthy that the tensile strength of composite film can exceed a maximum of 130 MPa, which is 23.19% higher compared to the untreated one. Also, PEN/BCB composites own low dielectric constant (2.27–4.08 at 1 KHz), and the relationship between frequency or a wide temperature range and dielectric constant/loss is stable. Thus, it has a greater potential for applications in electronics in high‐temperature environments.

Modification on phthalonitrile containing benzoxazine with hydroxy-terminated polyarylene ether nitrile: Curing reaction and thermomechanical properties

In this work, a kind of BA-ph/BPA-PEN composite film was prepared by modifying phthalonitrile resin containing benzoxazine rings (BA-ph) with hydroxy-terminated polyarylene ether nitrile resin (BPA-PEN). Results show that the introduction of BPA-PEN has a facilitating effect on the polymerization reaction of BA-ph resin, which directly affects the polymerization reaction of the benzoxazine ring and then the cross-linking reaction of the nitrile group. With the increase of BPA-PEN content, a phase reversion structure appeared, which promoted the improvement of the mechanical properties of the system. Meanwhile, the thermal performance of the system was good, and the Td5 of BA-ph (2 h)/10BPA-PEN reached 342.26 °C, which was 43.13 °C higher compared with the pure BA-ph system, and the char yield at 600 °C was 71.57%.

Polyarylene ether nitrile dielectric films modified by HNTs@PDA hybrids for high-temperature resistant organic electronics field

Abstract In this work, mussel-inspired surface functionalization of halloysite nanotubes (HNTs) were coated by in situ self-polymerization of polydopamine (PDA) to synthesize core-shell structural composites (HNTs@PDA), and then incorporated into polyarylene ether nitrile (PEN) matrix. Due to the strong adhesion of the PDA modification layer and the formation of hydrogen bonds between the polar nitrile group of PEN and the catechol group of PDA, the dispersion and interfacial compatibility of HNTs@PDA in the PEN matrix are improved. The results show that the dielectric constant of PEN/HNTs@PDA 20 nanocomposites reaches 11.56 (1 kHz), which is 3.2 times that of pure PEN. In addition, after heat treatment, a chemical cross-linking reaction occurred between the PEN matrix to form a cross-linked PEN (CPEN) based nanocomposites, which further improved the thermal stability of the nanocomposites. The results show that the T g of CPEN/HNTs@PDA 20 nanocomposites reaches 215.5°C, which is 47.7°C higher than that of PEN/HNTs@PDA 20. Moreover, the dielectric constant-temperature coefficient of all CPEN nanocomposites is less than 7 × 10−4°C−1 at the temperature range of 25–180°C. All in all, this work provides a simple and environmentally friendly strategy to adjust the dielectric properties of polymer-based ceramic nanocomposites, which provides a pathway for its application as a dielectric material in the film capacitors field.

Preparation and performance of PEN-OH@BNNS-OH/PEN interlayer dielectric films with superior interfacial compatibility

Polymer dielectric composites featuring great thermal stability, excellent mechanicals, and good dielectric properties have sparked considerable attention. Here, the preparation of hybrid filler was first performed. The hydroxyl end-capped polyarylene ether nitrile (PEN-OH) was synthesized and then hydroxy BNNS (BNNS-OH) was combined with PEN-OH to obtain PEN-OH@BNNS-OH, which is fabricated by ultrasonic combined with applying post-solid phase chemical reaction technology. The aim is to use the -OH interactions of BNNS-OH and PEN-OH to form hydrogen bonds that greatly enhance interfacial heat transport. Next, the post-solid phase chemical reaction is utilized to make PEN-OH crystallize, and its crystals located on the two-dimensional planes of BNNS-OH or between the layers can serve as a thermal bridge. Then, the as-prepared film with 10 wt% hybrid filler displays high thermal conductivity (1.17 W/m.K), 13.67%-fold higher than pure PEN film, boasts outstanding mechanical properties (stress 105 MPa, strain 6%), high glass transition temperature (Tg: 224 ℃), a dielectric constant (4.30 at 106 Hz), together with low dielectric loss (0.007 at 106 Hz). Besides, the film was post-treated to increase the thermal conductivity to 1.77 W/m.K, reach a higher Tg of 263 ℃, reduce the dielectric constant and loss to 3.68 and 0.006 at 106 Hz. Thus, it is suitable as a high-temperature-resistant dielectric material.

Synthesis and characterization of cyano-terminated bisphenol AF-type polyarylene ether nitrile

Four novel phthalonitrile-capped polyarylene ether nitrile oligomers containing trifluoromethyl groups (FPEN-Ph) with different molecular weight were designed and synthesized by adjusting the ratio of bisphenol AF (BPAF) and 2,6-dicholorobenzonitrile (DCBN). The molecular structure of FPEN-Ph oligomers were characterized and analyzed by FTIR, 1HNMR and Gel permeation chromatography. Their curing behaviors were studied by Differential scanning calorimetry and rheological tests, and curing kinetics were also discussed by gel method in detail. The glass fiber cloth reinforced FPEN-Ph composites (FPEN-Ph/GF) had flexural strengths of 415.9–497.5 MPa, shear strengths of 34.5–50.5 MPa, and glass transition temperatures ( Tgs) in the range of 211.3°C–416.6°C. The initial thermal decomposition temperatures ( T5%) of various FPEN-Ph cured products were higher than 500°C under nitrogen. Meanwhile, Fracture morphologies showed that the GF/FPEN-Ph composites had excellent interfacial adhesion between FPEN-Ph matrix and GF reinforcement. Herein, the FPEN-Ph resin could be a good candidate for high-performance polymeric composites and the advanced FPEN-Ph/GF composites can be used under high temperature environment.