Plate-fin Heat Sink Research Articles

Performance Evaluation of BTMS for Electric Vehicles using Heat Sink - A Numerical Study

Batteries have wide applications in engineering. They are extensively used in hybrid electric vehicles (HEVs) and electric vehicles (EVs), where a suitable battery thermal management system (BTMS) is vital in ensuring the safety and reliability operations of batteries. The purpose of this study is to offer an air-cooling system that utilizes a novel V-type staggered arrangement of plate-fin heat sink for forced air cooling. To keep the temperature of a lithium-ion battery pack within the optimal temperature range for the safety of the battery and the consumer to prevent the battery from catching fire. The paper also presents a comparison between straight rectangular fins and V-type staggered arrangement heat sinks. The thermal management of batteries equipped with a heat sink is numerically controlled, to ensure the battery's overall performance and longevity modules/packs for electric cars. A three-dimensional heat sink model was constructed and a numerical approach was used to explore the impacts of the number of fins on the heat sink, fin spacing and angle of inclination of the fins at different inlet air mass flow rates and varied heat input. The analysis presents a computational approach and traditional heat transfer theory.

Enhanced heat transfer in corrugated plate fin heat sink

Abstract To design a compact heat sink, a simplified geometry, enhanced heat dissipation, and the minimum pressure drop should be taken into consideration. With this objective, an experimental investigation has been conducted with the corrugated plate-fin heat sink by varying the relative radius of corrugation and relative corrugation pitch in the range of 0.16–0.31, and 0.06–0.16, respectively, for the Reynolds number range of 6000–14,000. Experiments were conducted on a corrugated plate-fin heat sink using an open-loop experimental system comprising a test section of a rectangular channel measuring 2300 mm long, 180 mm wide, and 80 mm high. The corrugated fin creates higher disturbances caused by multiple separations and reattachments in the flow and thereby yielding a higher localized heat transfer coefficient and enhanced heat transfer from the system. The maximum fin performance is found to be 5.87 for the corrugated plate-fin heat sink corresponding to the relative radius of corrugation and relative corrugation pitch of 0.16 and 0.125, respectively.

Numerical Investigation on Thermal Performance of Plate-Fin Heat Sink Designs Subjected to Parallel and Impinging Flow

The electronic industry has been working for decades to improve the cooling efficiency of heat sinks by creating more advanced, efficient cooling technologies. However, heat dissipation remains the major problem in this highly competitive sector. Plate-fin heat sinks with and without fillet profiles were investigated and two new proposed designs for plate-fin heat sinks with half-round pins attached to the fin were developed in this study. Numerical analysis was performed using ANSYS FLUENT R21 to evaluate the thermal performance of the proposed designs. For the element optimization, the grid independency test was performed to obtain the optimal number of elements. A constant heat flux of 18.750 kW/m2 was applied at the bottom plate of heat sinks as the input parameter and two different flow directions e.g., impinging flow and parallel flow at various mass flow rate was also applied to study the base temperature, thermal resistance and Nusselt number of these designs. The study has shown that plate-fin heat sinks with fillet profile and corrugated half-round pins (PFHS 4) subject to parallel flow and plate-fin heat sinks with fillet profile and symmetrical half-round pins (PFHS 3) subject to impinging flow exhibit better thermal performance over other configurations. Hence, these design configurations have a potential to be applied in the future.

Experimental and numerical analysis of effect of combined drop-shape pin fins and plate fins type heat sink under natural convection

As the junction temperature of a light-emitting diode (LED) is inversely proportional to its lifespan and efficiency. This study investigates the thermal performance of heat sink-based model with a drop-shaped pin fin for LED cooling under natural convection, experimentally, and numerically. The study used three distinct drop form pin fin arrays with variable vertical fin spacing (Sv = 25, 50, and 75 mm), with the best array being used in subsequent studies with variations in drop-shaped pin fin size (diameter DD and apex length LD ). The heat transfer coefficient and Nusselt number were obtained in the quantitative analysis of thermal performance. A numerical model with Boussinesq approximation for natural convection is used for this study and well-validated with experimental results. A qualitative investigation was also carried out utilizing numerical research to investigate velocity streamlines and their impacts on heat transfer enhancement in various configurations. An experimental test with conventional plate fin, circular pin fins were done for the verification of the test setup results and their results were compared with results calculated from the standard correlations presented in previous well-known literature. The maximum heat transfer coefficient was found to be 12.80 W/m2K for drop form pin fins with vertical fin spacing (Sv ) equal to 75 mm, a diameter of 6 mm, and a length of 7.2 mm, and the corresponding Nusselt number was 94.85. Also, the maximum enhancement in Nusselt number was found to be (Nu/Nu plate fin) 3.11 corresponding to the conventional plate-fin heat sink. This comparison will help the industrialists determine innovative passive cooling technology for electronic devices such as LED street lights.

Heat transfer characteristics of thermally and hydrodynamically developing flows in multi-layer mini-channel heat sinks

In this study, a novel type of air-cooled heat sink is proposed, which consists of several layers of mini-channels. In this design, the hydraulic diameter is smaller than in conventional types of heat sinks, such as plate-fin heat sinks, and consequently, the achievable heat transfer rates are higher. To predict the cooling performance of this heat sink, an innovative analytical method is proposed, results from which are complemented by an extensive number of numerical simulations of the simultaneously developing flows, thermally and hydrodynamically, inside a rectangular channel of the heat sink. The results of the analytical method are compared against two- and three-dimensional simulations and good agreement is found, while from the simulations, correlations are proposed for the Nusselt number in these flows. Finally, the performance of the proposed heat sink is compared to a plate-fin heat sink. This comparison reveals that entropy generation in the latter is around 27% higher than in the former, and suggests a promising advantage of the proposed heat sink design.

Experimental and numerical investigation of thermal-hydraulic performance of bi-metallic (Al-Cu) plate fin heat sink

In this research, an experimental study of thermal-hydraulic performance of bi-metallic (Al-Cu) plate fin heat sink (PFHS) under forced convection in wind tunnel is investigated. The key parameters such as pressure drop, Reynolds and Nusselt numbers, heat transfer coefficient, thermal resistance, power pumping and profit factor have studied. Then the PFHS has simulated and the results have validated with test. A good agreement is seen in the results of pressure drop between test and simulation. The results show an increase of performance of the applied bi-metal sink compared with similar single aluminum one in available literature. Finally, in order to improve the thermal behavior of PFHS, porous materials have been used in numerical simulation. Because of using a porous layer in the fin spaces, the pressure drop has been increased in comparison with the normal state. Thus, pumping power has increased which means the more energy consumption is needed for the cooling process so the profit factor is decreased. On the other hand, the amount of thermal resistance is decreased by 12% compared with bi-metallic PFHS without porous materials. The results of this study could be used as the fundamental of the future researches.

Performance analysis and optimal design of a water-cooled thermoelectric component for air cooling based on simulation and experiments

In the present study, a water-cooled thermoelectric component model for air cooling is established. To validate the present model, the results of transient and steady-state experiments are compared with numerical calculations. The effects of different air flow rates and water flow rates on the TEC performance and thermal-hydraulic characteristics of the plate-fin heat sinks (PFHS) are studied. The heat transfer and flow characteristics (JF) and coefficient-of-performance (COP) are adopted as optimization goals. A standard design of experiment (DOE) method called a partial factorial design (PFD) is applied in this experimental plan. The significant influential factors are distinguished from six parameters in the PFHS (fins width, fins length, substrate thickness, fins number, fin thickness, and fins height). The number and height of fins have a great effect on the heat transfer and flow characteristics of the PFHS, while the width of the PFHS and fin height have a great effect on the COP of the TEC. The aim is to maximize the response variable JF of the PFHS under the criterion of COP of the TEC. A three-level Box-Behnken design (BBD) based on the response surface methodology (RSM) has been established for predicting and optimizing the response variables JF and COP with the design constraints. The predicted results also indicate that the model proposed in this study is reasonable and accurate and can be used for describing the heat transfer and flow characteristics and coefficient-of-performance with the limitations of the factors studied. This work is expected to provide help in the analysis and optimization of thermoelectric components.

Determination of the Optimum Operating Conditions and Geometrical Dimensions of the Plate Fin Heat Sinks Using Teaching-Learning-Based-Optimization Algorithm

Abstract Electronic devices must be effectively cooled for long-term reliability and safe operation. It is essential to determine operating conditions and optimum dimensions of cooling devices in terms of device weight, space, cost, and sound limits. Plate fin heat sinks (PFHSs) are frequently used for cooling electronic devices. Optimum thermal designs of PFHSs are explored in this study using a teaching-learning-based-optimization (TLBO) algorithm where entropy generation (S˙gen) minimization, profit factor (J) maximization, base plate temperature excess (θb) minimization, total mass (mass) minimization, and total volume (volume) minimization are the objective functions of the constrained single-objective optimization problems. For further investigations of the entropy generation minimization method, three different optimization problems are also studied: minimization of thermal resistance (Rth), minimization of pressure drop (ΔP), and minimization of pumping power (W˙pump). Each optimization problem is subjected to a constraint, namely, temperature excess of base plate temperature (θb) should be lower than 10 K. Four optimization variables are considered which are the number of plate fins (N), freestream velocity (Vf), the thickness of the fin (tfin), and height of the fin (Hfin). Optimum configurations belonging to the different optimization problems are compared, and the effect of each optimization variable on the objective functions is discussed in detail. It is found that one can obtain optimum operating conditions and geometrical dimensions of the PFHSs according to the design objective, i.e., minimum mass requirement, space limitation, minimum base plate requirement, etc. As a result, the optimum designs of the studied cases are different which are superior to each other in terms of design targets.

Thermal improvement of the vertical plate-fin heat sink by variable fin thickness pattern and utilizing phase change material: A numerical investigation

In this 3-D (three-dimensional) numerical study, variable fin thickness is proposed to address the thermal problem of the vertical plate-fin heat sink (PFHS) under natural convection. This design aims to facilitate heat transfer by preventing the merging of boundary layers and reducing the weight and cost of manufacturing. Simulations are carried out with COMSOL Multiphysics to solve continuity, momentum, and energy equations under a time-dependent condition. The PFHS with the dimension of 10 × 5.5 × 4.5 cm is hired with two fin convergence angles (α = 1.145, 0.572), and the number of fins and applied heat rate are varied from 4 to 7 and 2.5 W to 20 W, respectively. The numerical results show that the influence of the fin convergence angle on the thermal resistance rises by increasing fin numbers in the PFHS. The maximum reduction of 45.5 % is registered for thermal resistance in the highest density of fin numbers. Simulations are also expanded to study the PFHS under high temporary heat loads (40 and 80 W). For this, employing single and multiple PCMs for the thermal management of PFHS along with air cooling is proposed. The combined heat transfer mode results indicate that using PCM can decrease the critical temperature of PFHS by up to 8 %. Furthermore, the obtained result indicates that using multiple PCM with different melting temperatures is not advised for thermal management as it deters the full utilization of latent heat, and better performance achieves for a single PCM with a lower melting temperature.

Server processor heat sink analysis and modifications to improve its thermal performance

Heat generation in the electronic components of high-performance computing servers is a matter of concern. Heat generation adversely affects the performance of these servers, certain temperature limits are required for these server processors and other electronic components to work within suitable conditions. Furthermore, in order to improve CPU performance and functioning, the heat flux in today's processor packages is increasing day by day, even as server CPUs and other components shrink in size. The air-cooling technique is the most broadly utilized and efficient technique of the present accessible electronic cooling advances. In data centers, heat sinks with forced air are utilized to keep server processors and other electronic components cool. The cooling systems of electronic gadgets are a growing field of research. The aim of this work is to contribute to this research field by investigating the effects of inlet air properties on server processor heat sink thermal performance with a heat load of 140 W. The heat sink performance depends on various parameters. The influence of various geometries of lateral perforation on heat sink fin walls was numerically analysed in this study to improve the thermal performance of the server processor plate fin heat sink. The CFD Solver is used for analysing the performance of heat sink and the effect of lateral perforation shapes on heat sink fins. The three shapes of perforation are considered as square, circular, and hexagonal types, with the same cross-sectional area and pitch of inline arrangement. In comparison to plate fin heat sinks, the numerical results demonstrate that a laterally perforated finned heat sink has a lower base temperature and a low thermal resistance. The use of a perforated heat sink also saves material and reduces the weight of the heat sink.

Novel design to enhance the thermal performance of plate-fin heat sinks based on CFD and artificial neural networks

• A novel design to enhance thermal performance of plate-fin heat sinks. • Artificial neural network. • Numerical analysis based on Computational Fluid Dynamic. • Plate-fin heat sink with symmetrical half-round hollow pins in vertical arrangement. Over the last decades, intensive attentions have been spent for thermal performance enhancement of the heat sinks as a result of the heat dissipation problems in an extremely competitive industry of electronics. In the present work, an efficient thermal design of a plate-fin heat sink with symmetrical half-round hollow pins vertically arranged and subjected to parallel flow is implemented. In particular, a computational fluid dynamic (CFD) analysis was performed for evaluating the thermal performance of the different possible designs, i.e. different values for inside and outside diameters of the attached hollow pins. These limited data points are then fed into a feed-forward back-propagation neural network to predict the base temperature and pressure drop that can be based on to judge the most effective geometry of the hollow pins. This is next followed by a CFD analysis of the pin’s pitch effect on the thermal performance of the studied heat sinks to find the most efficient design. The study has shown that the proposed design shows higher thermal performance over the other configurations in the literature while maintaining the bare minimum change in fabrication and implementation. Therefore, this design has a promising potential to enhance the thermal efficiency of the electronic devices.

ANALYSIS OF PLATE-FIN HEAT SINK INFUSED WITH PHASE CHANGE MATERIALS FOR INTERMITTENT SPACE MISSIONS

In this work, we numerically investigated the heat transfer effectiveness of different phase change materials (PCMs) when infused in a plate-fin heat sink with a fixed volume fraction of thermal conductivity enhancer. The PCM's ability to absorb and release large amounts of thermal energy at constant temperature is a desired feature in transient electronics cooling applications. In this study, we focused on examining the effect of the number of fins, type of PCM, heat flux, PCM volume fraction, and heat sink bottom wall thickness. The results showed that increasing the number of fins improved the performance of the PCM-infused heat sink. When a heat flux of 4000 W/m<sup>2</sup> was applied for 30 minutes on a plate-fin heat sink infused with paraffin wax, the maximum temperature did not exceed 70°C in the four-fin design, while it exceeded 80°C in the two-fin design. A salt hydrate PCM outperformed paraffin wax and RT35. The bottom wall of the heat sink acted as a thermal spreader and a nonlinear relationship existed between the bottom wall thickness and the maximum electronics temperature. Compared to the two- and four-fin heat sink models, the zero-fin model required the longest time to fully melt the entire PCM due to the additional amount of PCM present in the heat sink gaps.

CONVECTIVE HEAT TRANSFER OF HEAT SINKS WITH PARTIALLY CUT PLATE FINS AND TURNING OF THEIR CUT SECTIONS

Plate-fin heat sinks are widely used for cooling radio electronic, power electronic, and telecommunication components. The current trends in the development of radio and microelectronic systems dictate the need to dissipate large heat fluxes. The present article uses the methods of numerical simulation, verified by experimental data, to study convective heat transfer of different-type heat sinks with partially cut plate fins. The heat sink with partially cut plate fins served as the basis of study. Three types of heat sinks with extended surfaces were also considered. First, we analyzed the fin cut section turned at an angle of 30° and then - the fin cut section with diverging or converging shape. Comparing the thermal and hydraulic performance of such heat sinks showed that the thermal and hydraulic performance of heat sinks with a fin cut section with diverging shape at a turning angle of 30° is by 10% higher than that of heat sinks with partially cut plate fins. As the velocity distribution in the wake shows, the use of heat sinks with partially cut plate fins and turning of their cut sections for cooling real microelectronic devices needs to correctly design an installation, in which the device is located.

Design optimization of plate-fin heat sink with forced convection for single-module thermoelectric generator

Thermoelectric generators (TEGs) often use plate-fin heat sinks as cold side heat exchangers under forced convection. The available net electrical power obtained from these TEGs corresponds to that generated (Seebeck effect) minus that consumed (cooling fan). Generation and self-consumption have different trends as a function of the air flow speed, so a maximum of the net electrical power is expected when varying the cooling flow rate. Here, a semi-analytical model was developed to predict the maximum net electrical power of a single TEG module with a plate-fin heat sink with non-bypassed forced convection. The model was successfully validated with experimental data. It was applied to determine the heat sink design (fin thickness and fin-to-fin distance) that optimized the net electrical power for given values of hot source temperature, TEG properties, and duct cross-section. Numerical results indicated that the optimal dimensions of the plate-fin heat sink depended, among others, on the TEG effective properties. For a given TEG, the net output power was less sensitive to changes in fin thickness than in fin spacing. The optimal heat sink designs predicted by the model for the cases studied had fin thicknesses of 0.32 and 0.44 mm with fin-to-fin distances of 1 mm.

Porous-fin microchannel heat sinks for future micro-electronics cooling

Porous-fin microchannel heat sinks offering high solid-fluid interfacial areas have the potential to be an integral part of future microelectronic cooling systems. Replacing solid with porous fins reduces the pressure drop penalty of the straight plate-fin microchannel heat sinks. However, prior research has shown that in some cases porous fins adversely affect the thermal performance of the microchannel heat sinks. The reduced effective thermal conductivity of the porous fins compared to the solid ones has been considered the main reason for the reduced thermal performance of porous-fin microchannels. In this work, a detailed study is conducted to assess the feasibility of using porous fins to simultaneously improve the thermal and hydraulic performances of the straight plate-fin microchannel heat sinks. Results revealed that the porous-fin microchannels outperform the solid-fin microchannels at small channel heights. However, at high channel heights, the low effective thermal conductivity of porous fins results in a weak vertical thermal diffusion. Consequently, replacing solid with porous fins degrades the thermal performance of the microchannel at high channel heights. Additionally, the porous-fin microchannels exhibit better thermal performance than the solid-fin microchannels at fin to fluid width ratios above 0.25. The increased coolant mass flow penetrated the porous fin section is the main reason for the enhanced heat transfer rate of the porous-fin microchannels at higher width ratios. Moreover, the porous-fin microchannels offer a lower pressure drop penalty than the solid-fin microchannels under all examined operating conditions. This research confirms the potential of substituting solid with porous fins to simultaneously improve the thermal and hydraulic performances of the straight plate-fin microchannel heat sinks.

Entropy generation analysis of a dual-height plate-fin heat sink with Nanofluid coolant applying two-phase mixture model

In this work, the two-phase mixture model is applied to solve the velocity field, the pressure field and obtain the entropy generation rates in a dual-height plate-fin heatsink. The governing equations were solved using the second-order upwind discretization scheme as well as SIMPLE scheme used in coupling the pressure and velocity fields. The Re, nanoparticle concentration (ψ), secondary fin height (hsf), and fin spacing (dsf) were considered within the ranges of 500-2000, 0%-1%, 5 mm-17.5 mm, and 0.25 mm-0.5 mm, respectively. The results demonstrated that S˙th almost decrease by 30% as hsf increases from 5 mm to 17.5 mm. The increase in hsf escalates S˙fr by 308% and 238% at Re numbers of 500 and 2000, respectively. In addition, the escalation of Re from 500 to 2000 increases S˙fr by 2125% and 1748% for hsf 5 mm and 17.5 mm, respectively. The fin spacing analysis revealed that the lowest S˙th and highest S˙fr belong to dsf=0.5 mm. The lower the dsf the higher the backward flow and mixing flow at the heatsink outlet, thereby delay in flow passage and intensification of S˙th and S˙fr.

Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators

PurposeThis study aims to provide an insight into the relationship between design parameters and thermal performance of plate fin heat sinks (PFHSs) incorporating longitudinal vortex generators (VGs) inside a PFHS channel.Design/methodology/approachA computational fluid dynamics model of a delta winglet pair VG mounted inside a PFHS geometry is detailed, and the model is validated by comparison with experimental data. The validated model is used to perform a virtual design of experiments study of the heat sink with bottom plate and vertical plate mounted VGs. Data from this study is used to regress a response surface enabling the influence of each of the assessed design variables on thermal performance and flow resistance to be determined.FindingsThe results of this study show that the thermal hydraulic performances of a PFHS with bottom plate mounted VG and vertical plate fin mounted VG are, respectively, 1.12 and 1.17 times higher than the baseline PFHS. Further, the performance variation of the heat sink with VG, relative to delta winglet’s arrangement (common flow up and common flow down), trailing edge gap length and Reynolds number were also evaluated and reported.Originality/valueFor the first time, performance characteristics of delta winglet VGs mounted inside the PFHS are evaluated against different design variables and a polynomial regression model is developed. The developed regression model and computed results can be used to design high performance PFHSs mounted with delta winglet VGs.

Local hotspot thermal management using metal foam integrated heat sink

Single phase liquid-cooled parallel micro/mini-channel heat sinks are commonly used for electronic cooling because of their superior thermal–hydraulic performance. However, heterogeneous integration of electronic chips, especially in 2.5D and 3D integrated circuits (ICs), results in highly non-uniform heat flux distribution and consequently generates localized hotspots. Conventional micro/mini-channel heat sinks often fail to suffice concentrated local hot spots due to the insufficient heat transfer area and local heat transfer coefficient. Therefore, in this paper, three novel water-cooled aluminum (Al) metal foam (MF) integrated compound heat sink layouts, namely solid fin-MF, rectangular fin-MF, and MF heat sink, have been proposed to mitigate local hotspot resulting from non-uniform heat generation. The main concept of the proposed compound heat sinks is to deploy MF in the hotspot region to take advantage of the superior thermal performance of metal foam with minimal pumping power. 3D computational fluid dynamics/heat transfer (CFD/HT) simulations have been performed to quantify and compare the effectiveness of the proposed compound heat sinks with conventional plate-fin heat sink over a wide coolant flow rates/pressure difference ΔP range within the laminar flow regime. Numerical results showed that the solid fin-MF layout provides the best thermal–hydraulic performance compared to all other layouts and offers the highest temperature uniformity, especially at a higher coolant flow rate. Moreover, for the solid fin-MF layout, an optimal porosity and pore density of MF has been identified as 0.9 and 5 PPI (pores per inch), respectively. Finally, at ΔP of 250 Pa and 400 Pa, the optimized solid fin-MF heat sink layout successfully dissipated ∼22.6% and ∼33.4% higher hotspot heat flux compared to the conventional solid fin layout with ∼21% and ∼18.3% lower pumping power penalty while maintaining the peak junction temperature below 85°C.

Experimental research on a semiconductor freezer utilizing two-stage thermoelectric modules

This paper presents an experimental study on the performance of a semiconductor freezer for food and medicine preservation. The developed two-stage thermoelectric cooler (TTEC) for the freezer contains two-stage thermoelectric modules (TTEMs), a plate fin heat sink, and a heat pipe heat sink. The experiments were carried out for 37.8-liters freezer prototype in a standard climatic chamber. Effects of TTEC configurations on the refrigeration performance of the freezer at different ambient temperatures were experimentally evaluated. The tested results indicate that the lowest temperature inside the freezer cabinet can reach −14.9 °C in the optimal input current of 4.67A when the ambient temperature is 25 °C. and the largest temperature difference between both sides of the TTEMs is 62.1 K in the proper configuration. Furthermore, the evaluated refrigerating capacity of TTEC can reach the largest of 53.50 W, and the COPs of TTEM and freezer achieve the maximum values of 0.237 and 0.153, respectively. The experimental results mean that we extend the application field of thermoelectric cooling technology to the freezer, which provides the experimental basis for the research and development of thermoelectric freezers. In general, the performance characteristics of the developed semiconductor freezer with the TTEMs could demonstrate its potential for small freezing device applications.

CFD analysis and environmental assessment on the heat transfer and flow of the pure water or water/silver Nano fluid coolants in a plate-fin heat sink applying two-phase mixture model

Environmental impacts are the consequences caused by the elementary flows on human health, plants, and animals (ecological health) or by the future availability of natural resources (resource depletion). The heat transfer characteristics of a plate-fin heatsink were investigated using a 3-dimensional numerical analysis based on the two-phase mixture model. The effect of using NF, fin spacing, and fin height on the performance of the system were studied considering the constant heat flux of 100 kW/m2 at the bottom of heatsink and NF inlet temperature of 300 K. The results showed that the increase in the secondary fin height (hsf) from 5 mm to 17.5 mm leads to increase in the pressure drop by 11.6%, 52%, to improve the heat convection coefficient (h) by 32.92%-23.84%, and consequently reduces the central processing unit (CPU) mean temperature by 4.31% and 2.34% for Re=500-2000. The maximum performance evaluation criterion (PEC) was obtained as 1.11-1.05 at Re numbers of 500-2000 for heatsink with hsf=12.5 mm. In addition, the optimum location for the secondary fin was determined to be at the mid-space of two primary fins (dsf=0.5 mm) which leads to improving h by 18%-5% at Re numbers of 500-2000 as compared to other fin spacing scenarios. Moreover, the intensification of nanoparticle concentration (ψ) leads to improve h by 15.71%-17.21% for Re=500-2000. Besides, the escalation of ψ decreases the pressure drop by 14.18% for all Re numbers. The PEC of the system with hsf=12.5 mm, ψ=1%, at Re=2000 was obtained as the highest PEC of 1.226 among the other studied cases. According to the design, the heat sink has an environmental impact of 0.5233.