Plasma-assisted Molecular Beam Epitaxy Research Articles

Silicon implantation and annealing in β-Ga2O3: Role of ambient, temperature, and time

Optimizing thermal anneals of Si-implanted β-Ga2O3 is critical for low resistance contacts and selective area doping. We report the impact of annealing ambient, temperature, and time on the activation of room temperature ion-implanted Si in β-Ga2O3 at concentrations from 5 × 1018 to 1 × 1020 cm−3, demonstrating full activation (>80% activation, mobilities >70 cm2/V s) with contact resistances below 0.29 Ω mm. Homoepitaxial β-Ga2O3 films, grown by plasma-assisted molecular beam epitaxy on Fe-doped (010) substrates, were implanted at multiple energies to yield 100 nm box profiles of 5 × 1018, 5 × 1019, and 1 × 1020 cm−3. Anneals were performed in an ultra-high vacuum-compatible quartz furnace at 1 bar with well-controlled gas compositions. To maintain β-Ga2O3 stability, pO2 must be greater than 10−9 bar. Anneals up to pO2 = 1 bar achieve full activation at 5 × 1018 cm−3, while 5 × 1019 cm−3 must be annealed with pO2 ≤ 10−4 bar, and 1 × 1020 cm−3 requires pO2 < 10−6 bar. Water vapor prevents activation and must be maintained below 10−8 bar. Activation is achieved for anneal temperatures as low as 850 °C with mobility increasing with anneal temperatures up to 1050 °C, though Si diffusion has been reported above 950 °C. At 950 °C, activation is maximized between 5 and 20 min with longer times resulting in decreased carrier activation (over-annealing). This over-annealing is significant for concentrations above 5 × 1019 cm−3 and occurs rapidly at 1 × 1020 cm−3. Rutherford backscattering spectrometry (channeling) suggests that damage recovery is seeded from remnant aligned β-Ga2O3 that remains after implantation; this conclusion is also supported by scanning transmission electron microscopy showing retention of the β-phase with inclusions that resemble the γ-phase.

Electrical properties and structural optimization of GaN/InGaN/GaN tunnel junctions grown by molecular beam epitaxy

The InGaN films and GaN/InGaN/GaN tunnel junctions (TJs) were grown on GaN templates with plasma-assisted molecular beam epitaxy. As the In content increases, the quality of InGaN films grown on GaN templates decreases and the surface roughness of the samples increases. V-pits and trench defects were not found in the AFM images. p++-GaN/InGaN/n++-GaN TJs were investigated for various In content, InGaN thicknesses and doping concentration in the InGaN insert layer. The InGaN insert layer can promote good interband tunneling in GaN/InGaN/GaN TJ and significantly reduce operating voltage when doping is sufficiently high. The current density increases with increasing In content for the 3 nm InGaN insert layer, which is achieved by reducing the depletion zone width and the height of the potential barrier. At a forward current density of 500 A/cm2, the measured voltage was 4.31 V and the differential resistance was measured to be 3.75 × 10−3 Ω·cm2 for the device with a 3 nm p++-In0.35Ga0.65N insert layer. When the thickness of the In0.35Ga0.65N layer is closer to the “balanced” thickness, the TJ current density is higher. If the thickness is too high or too low, the width of the depletion zone will increase and the current density will decrease. The undoped InGaN layer has a better performance than n-type doping in the TJ. Polarization-engineered tunnel junctions can enhance the functionality and performance of electronic and optoelectronic devices.

Demonstration of 82% relaxed In0.18Ga0.82N on porous GaN pseudo-substrate by plasma-assisted molecular beam epitaxy

In this study, the impact of InGaN film thickness and different compositionally graded structures on InGaN relaxation grown on tiled GaN-on-porous-GaN pseudo substrates (PSs) were studied. In addition, the impact of the degree of porosification on the In incorporation and relaxation of InGaN were examined. 82% relaxed 1μm thick In0.18Ga0.82N, which is equivalent to a fully relaxed In-composition of 15%, on porous GaN PS was obtained. Additionally, multi-quantum wells (MQWs) grown on the MBE InGaN-on-porous GaN base layers by MOCVD showed ∼85 nm redshift in comparison with MQWs grown on planar GaN. The developed InGaN-on-porous-GaN PSs can provide an alternative route to grow MQW with a high In content which is essential for high-efficiency nitride-based red LEDs.

(Invited) Gallium Nitride for Vertical Power Devices: Improving Morphology and Unintentional Impurities for Better Devices

While GaN has been researched for many years as a material for light emitting diodes, lasers, high electron mobility transistors, and other devices, further improvements to material purity are still needed to realize the full potential of this material for vertical device applications. To achieve high quality, high purity GaN for power devices, our research employs ammonia-assisted molecular beam epitaxy (NH3-MBE) and plasma-assisted molecular beam epitaxy (PA-MBE). Past studies of fast growth rates (more than 1 μm/hr) and ultra-low impurity incorporation revealed that both PAMBE and NH3-MBE can achieve low net doping levels, and NH3-MBE as low as 1x1015 cm-3.1 However, This work also indicated that impurity incorporation increased with increasing growth rate.Recent research efforts have focused on further improvements to morphology and unintentional dopants in NH3-MBE-grown homoepitaxial layers with fast growth rates. By optimizing growth conditions for faster growth rates and using indium as a surfactant, devices with drift layers up to 10 μm thick were grown. These layers exhibited smooth surface morphology as seen in AFM scans with RMS surface roughness as low as 0.21 nm for a 2x2 μm2 scan area.2 Adding the In surfactant also led to reduced incorporation of unintentional Si impurities in UID films as shown by SIMS depth profiles for GaN films grown with and without In. The extremely low impurity levels were further confirmed by CV measurements which indicated that the net doping density in the UID GaN layers decreased from 2x1016 cm-3 to 5x1015 cm-3 with the addition of the In surfactant.2 Based on these UID levels and the theoretical critical electric field of GaN (3 MV/cm), drift layers up to 29.5 μm and 7.4 μm can be depleted with a triangular electric field profile for net donor concentrations of 5x1015 cm-3 and 2x1016 cm-3, respectively. Devices with the same net concentrations with drift regions 3 μm thick can hold voltages of 854 V and 717 V, respectively.Based on the previously described studies of low-impurity GaN at different growth rates, we developed vertical p-n GaN power devices grown by NH3 MBE.3 These p-n diodes contained a 0.25 µm n+ region, 4 µm n- region with 3x1015 cm-3 unintentional carriers, 0.4 µm p+ region and 10nm p++ capping layer to improve the ohmic anode contact. The circular diodes were fabricated with Pd/Pt anode contacts and Ti/Au cathode contacts. Device diameters were between 80 and 100 µm. The devices featured a 15 µm field plate made from Ti/Au contacts on top of an Al2O3/Si3N4 dielectric stack.The diodes exhibited outstanding forward J-V behavior with a low specific on-resistance (Ron,sp) of 0.28 mΩ-cm2 and a minimum ideality factor of 1.36, which are among the best achieved among similar homoepitaxial GaN p-n diodes.3-5 The best diodes also exhibited a breakdown voltage of > 1 kV (equipment limit 1 kV). The reverse-voltage properties indicate that punch-through was achieved with a peak electric field (EC) >2.6 MV/cm, as confirmed by Silvaco simulations (Fig. 7). The combination of >1 kV breakdown voltage and on-resistance of 0.28 mΩ-cm2 represents one of the best performances of the p-n GaN diodes, achieved with a significantly thinner drift layer compared to comparable MOCVD GaN p-n diodes with drift layers more than 8 µm. Work is ongoing to develop NH3-MBE p-n diodes with indium surfactant-assisted drift layer growth which shows promise to further improve the surface morphology, reduce leakage, and enhance breakdown performance of the vertical devices.

Epitaxial lattice-matched AlScN/GaN distributed Bragg reflectors

We demonstrate epitaxial lattice-matched Al0.89Sc0.11N/GaN 10 and 20 period distributed Bragg reflectors (DBRs) grown on c-plane bulk n-type GaN substrates by plasma-assisted molecular beam epitaxy. Resulting from a rapid increase in in-plane lattice coefficient as scandium is incorporated into AlScN, we measure a lattice-matched condition to c-plane GaN for a Sc content of just 11%, resulting in a large refractive index mismatch Δn greater than 0.3 corresponding to an index contrast of Δn/nGaN = 0.12 with GaN. The DBRs demonstrated here are designed for a peak reflectivity at a vacuum wavelength of 400 nm, reaching a reflectivity of 0.98 for 20 periods. It is highlighted that AlScN/GaN multilayers require fewer periods for a desired reflectivity than other lattice-matched Bragg reflectors such as those based on AlInN/GaN multilayers.

An electron paramagnetic resonance study of the electron transport in heavily Si-doped high Al content AlxGa1−xN

High Al mole fraction AlGaN is an ultrawide bandgap semiconductor with potential applications in power electronics and deep UV detectors. Although n-type material is achievable with Si-doping, the role of Si is controversial, particularly for AlxGa1−xN with x > 0.8. For this paper, AlGaN films were grown by plasma-assisted molecular beam epitaxy onto bulk AlN substrates and doped with 1018–1020 cm−3 Si. We examine electron transport in heavily Si-doped AlxGa1−xN with x ≥ 0.65 using magnetic resonance, which allows us to probe the neutral donors directly rather than the free carriers and avoids complications due to electrical contacts. Transport was studied through the temperature-dependent linewidth of the electron paramagnetic resonance (EPR) signature for the neutral donor. Analysis shows evidence of hopping conductivity in the most lightly doped samples and impurity band formation in the most heavily doped ones. The EPR results, which are consistent with Hall measurements performed on the same samples, are promising for the development of highly conducting high Al content AlGaN.

Comparative studies of nanoscale columnar AlxGa1-xN/AlN heterostructures grown by plasma-assisted molecular-beam epitaxy on cSi, porSi/cSi and SiC/porSi/cSi substrates

Problems of the growth of nanoscale columnar AlxGa1-xN/AlN heterostructures on hybrid substrates involving porous silicon and silicon carbide layers by molecular beam epitaxy technique with plasma-activated nitrogen are discussed in this study. The epitaxial growth of nanoscale columnar AlxGa1-xN/AlN heterostructure is shown to be specified by the layer of silicon carbide, which is formed by atomic substitution technique, and a porous silicon sublayer predetermines the oriented growth of SiC. The performed complex of structural-spectroscopic analysis demonstrated that epitaxial growth of the nuclear AlN layer on all types of the substrates in N-enriched conditions resulted in the formation of AlxGa1-xN/AlN heterostructures with Ga-polar surface. At the same time it was found that the layer of ordered AlxGa1-xN alloy was formed only on the hybrid SiC/porSi/cSi substrate. The layer of AlxGa1-xN on the substrates of cSi and porSi/cSi is present in the state of disordered alloy with an excess content of gallium atoms. Nanocolumns of AlxGa1-xN/AlN grown on the hybrid SiC/porSi/cSi substrate have two types of preferential azimuthal orientation that affects not only their structural and optical properties but also the value of elastic deformation in the heterostructure nanoscale layers. For the first time, azimuthal dependence of intensity of E1(TO) and E2high photon modes was detected in the Raman spectra. The observed periodicity angle in micro-Raman scattering coincides with the characteristic swivel of nanoscale columns of AlxGa1-xN/AlN around c-axis according to the data of XRD pole figure measurements. Results obtained in our work show promising capabilities in the use of SiC/porSi/сSi substrates for integration of silicon technology and technology of synthesis of the nanoscale columnar AlxGa1-xN heterostructures by molecular-beam epitaxy with plasma-activated nitrogen.

Effect of two-step cubic GaN buffer layer on the radio-frequency plasma-assisted molecular beam epitaxy growth of cubic AlN films grown on MgO (001) substrates

Cubic AlN (c-AlN) films were grown on MgO (001) substrates through the use of a two-step cubic GaN (c-GaN) buffer layer using radio-frequency plasma-assisted molecular beam epitaxy (RF-MBE) technique. The two-step c-GaN buffer layer was found to be crucial for the epitaxial growth of c-AlN, as it showed a specific epitaxial relationship between c-AlN and c-GaN along the MgO [100] zone axis. On the other hand, the c-AlN films grown with the one-step and nonGaN buffer layers showed columnar grain structure. The optical study found that the c-AlN films grown with the two-step c-GaN buffer layer had an indirect bandgap energy of 4.99 ± 0.02 eV, which is consistent with previous experimental data and theoretical calculations. The c-AlN films grown with the one-step and nonGaN buffer layers had indirect bandgap energies of 5.00 ± 0.02 eV and 5.18 ± 0.02 eV, respectively. These results highlight the importance of the two-step c-GaN buffer layer in enhancing the MBE growth of c-AlN on MgO (001) substrate.

Geometrical Selection of GaN Nanowires Grown by Plasma-Assisted MBE on Polycrystalline ZrN Layers.

GaN nanowires grown on metal substrates have attracted increasing interest for a wide range of applications. Herein, we report GaN nanowires grown by plasma-assisted molecular beam epitaxy on thin polycrystalline ZrN buffer layers, sputtered onto Si(111) substrates. The nanowire orientation was studied by X-ray diffraction and scanning electron microscopy, and then described within a model as a function of the Ga beam angle, nanowire tilt angle, and substrate rotation. We show that vertically aligned nanowires grow faster than inclined nanowires, which leads to an interesting effect of geometrical selection of the nanowire orientation in the directional molecular beam epitaxy technique. After a given growth time, this effect depends on the nanowire surface density. At low density, the nanowires continue to grow with random orientations as nucleated. At high density, the effect of preferential growth induced by the unidirectional supply of the material in MBE starts to dominate. Faster growing nanowires with smaller tilt angles shadow more inclined nanowires that grow slower. This helps to obtain more regular ensembles of vertically oriented GaN nanowires despite their random position induced by the metallic grains at nucleation. The obtained dense ensembles of vertically aligned GaN nanowires on ZrN/Si(111) surfaces are highly relevant for device applications. Importantly, our results are not specific for GaN nanowires on ZrN buffers, and should be relevant for any nanowires that are epitaxially linked to the randomly oriented surface grains in the directional molecular beam epitaxy.

Anisotropic strain relaxation in epitaxially constrained α -(Al,Ga)2O3 thin films on a-plane Al2O3

Binary α-Ga2O3 and ternary α-(AlxGa1−x)2O3 thin films with x = 0.29 and 0.54 were deposited on a-plane Al2O3 substrates via plasma-assisted molecular beam epitaxy. The strain relaxation dynamics along three orthogonal crystal directions was investigated ex situ and in situ by synchrotron-based high-resolution x-ray diffraction. A pronounced in-plane anisotropy was observed as strain is preferably built up across [1¯1.0] whereas along [00.1] it is effectively relieved. The particular behavior depends on the Al content with almost immediate plastic relaxation for x = 0 and 0.29. For x = 0.54, strain relaxation is elastic within the first monolayers. A dislocation glide on the r-plane slip system has been identified as the dominating plastic relaxation mechanism as layers grow thicker.

Optical properties of ScN layers grown on Al2O3(0001) by plasma-assisted molecular beam epitaxy

Accurate knowledge of optical constants (refractive index n and extinction coefficient k) of ScN is crucial for understanding optical properties of this binary nitride semiconductor as well as for its use in optoelectronic applications. Using spectroscopic ellipsometry in a spectral range from far infrared to far ultraviolet (0.045–8.5 eV), we determine n and k of ScN layers grown on Al2O3(0001) substrates by plasma-assisted molecular beam epitaxy. Fits of ellipsometry data return the energies of four oscillators representing critical points in the band structure of ScN, namely, 2.03, 3.89, 5.33, and 6.95 eV. As the infrared range is dominated by free carriers, the vibrational properties of the layers are examined by Raman spectroscopy. Despite the rock salt structure of ScN, several first-order phonon modes are observed, suggesting a high density of point defects consistent with the high electron density deduced from Hall measurements. Finally, photoluminescence measurements reveal an emission band slightly above the lowest direct bandgap. We attribute the redshift of the peak emission energy from 2.3 to 2.2 eV with increasing layer thickness to a reduction in the O concentration in the layers.

Indium: A surfactant for the growth of ɛ/κ-Ga2O3 by molecular beam epitaxy

The influence of In on the growth of ɛ-Ga2O3 by plasma-assisted molecular beam epitaxy is investigated. We demonstrate alloying of ɛ-Ga2O3 with In and describe its incorporation limits and catalytic effect on the growth kinetics. A special focus lies on the metal-rich growth regime, where we show that In acts as a surfactant for the ɛ-Ga2O3 growth. Both the In-incorporation and the ɛ-(In,Ga)2O3 growth rate follow a non-monotonous trend with increasing In-supply. Whereas both entities show an increase for low In-fluxes, they decrease again for very high In-fluxes, combined with the formation of an atomically smooth surface for layers with thicknesses of several hundred nanometers in this regime. Based on these results, the influence of the growth temperature and the amount of Sn, supplied to initiate the ɛ-Ga2O3 phase formation, is discussed, revealing their impact on the surfactant ability and incorporation of In. Using In as a surfactant, we demonstrate the pseudomorphic growth of ɛ-(In,Ga)2O3/ɛ-(Al,In,Ga)2O3 heterostructures with sharp interfaces and surfaces.

GaAs/GaInNAs core-multishell nanowires with a triple quantum-well structure emitting in the telecommunication range

Semiconducting nanowires (NWs) fabricated from III–V materials have gained significant attention for their application in advanced optoelectronic devices. Here, the growth of GaAs/GaInNAs/GaAs core-multishell NWs with a triple quantum-well structure, having about 2% N and 20% In, is reported. The NWs are grown via selective area plasma-assisted molecular beam epitaxy on patterned Si(111) substrates with SiO2 mask holes. The nucleation and growth of the GaAs nanowires' core are carried out by Ga-induced vapor–liquid–solid growth at the open holes. Finely controlled, vertically aligned, regular core-multishell NWs with uniform wire length and diameter are obtained with a 96% yield and targeted nitrogen concentrations of 0%, 2%, and 3%. The GaInNAs NWs exhibit a spectral red shift relative to the GaAs NWs' peak. Their emission wavelength increases with the N content reaching up to 1.26 μm, which makes them a promising tool in telecommunication light sources.

Overcoming the Miscibility Gap of GaN/InN in MBE Growth of Cubic InxGa1-xN.

The lack of internal polarization fields in cubic group-III nitrides makes them promising arsenic-free contenders for next-generation high-performance electronic and optoelectronic applications. In particular, cubic InxGa1-xN semiconductor alloys promise band gap tuning across and beyond the visible spectrum, from the near-ultraviolet to the near-infrared. However, realization across the complete composition range has been deemed impossible due to a miscibility gap corresponding to the amber spectral range. In this study, we use plasma-assisted molecular beam epitaxy (PAMBE) to fabricate cubic InxGa1-xN films on c-GaN/AlN/3C-SiC/Si template substrates that overcome this challenge by careful adjustment of the growth conditions, conclusively closing the miscibility gap. X-ray diffraction reveals the composition, phase purity, and strain properties of the InxGa1-xN films. Scanning transmission electron microscopy reveals a CuPt-type ordering on the atomistic scale in highly alloyed films with x(In) ≈ 0.5. Layers with much lower and much higher indium content exhibit statistical distributions of the cations Ga and In. Notably, this CuPt-type ordering results in a spectrally narrower emission compared to that of statistically disordered zincblende materials. The emission energies of the films range from 3.24 to 0.69 eV and feature a quadratic bowing parameter of b = 2.4 eV. In contrast, the LO-like phonon modes that are observed by Raman spectroscopy exhibit a one-mode behavior and shift linearly from c-GaN to c-InN.

Two dimensional boron nitride growth on nickel foils by plasma assisted molecular beam epitaxy from elemental B and N sources

The growth of two dimensional sp2-bonded boron nitride (2D-BN) was studied in a plasma-assisted molecular beam epitaxy set-up, using independent boron and nitrogen sources. We studied the growth conditions on polycrystalline Ni foils: B and N respective fluxes, growth temperature and time, which are influencing the surface morphology, stoichiometry and the 2D-BN domain size. Using a B/N precursor flux ratio ≫1 yields films with incorporated boron largely in excess and intermixed with 2D-BN. On the contrary, precursor flux ratios from moderately B-rich to moderately N-rich leads to stoichiometric 2D-BN. The optimum growth temperature is found to be 900 °C, a temperature for which the crystallographic quality is improved compared to lower temperatures thanks to the increased adatom surface mobility although a partial sublimation of BN occurs. Increasing the growth time under the optimized settings shows that the growth does not occur in a layer-by-layer mode, but rather by stacking BN domains on top of each other with a rather slow lateral extension of the domains.

Temperature dependence of the bandgap of Eu doped {ZnCdO/ZnO}30 multilayer structures

In situ Eu-doped {ZnCdO/ZnO}30 multilayer systems were grown on p-type Si-substrates and on quartz substrates by plasma-assisted molecular beam epitaxy. Various Eu concentrations in the samples were achieved by controlling temperature of the europium effusion cell. The properties of as-grown and annealed {ZnCdO/ZnO}30:Eu multilayers were investigated using secondary ion mass spectrometry (SIMS) and X-ray diffraction methods. SIMS measurements showed that annealing at 700 °C and 900 °C practically did not change the Eu concentration and the rare earth depth profiles are uniform. It was found that the band gap depends on the concentration of Eu and it was changed by rapid thermal annealing. Varshni and Bose-Einstein equations were used to describe the temperature dependence of the band gap of {ZnCdO/ZnO}30:Eu multilayer structures and Debye and Einstein temperatures were obtained.

Selective area growth of high quality GaN nanocolumns on Si(0 0 1) by plasma assisted molecular beam epitaxy

Two different arrays of GaN nanocolumns, with average diameters of 140 nm and 260 nm, were selectively grown by molecular beam epitaxy on GaN-buffered on-axis Si(001) substrates. Footprint of the nanocolumns with respect to the grain size of the GaN buffer layer plays and important role on the crystalline quality of the nanocolumnar material. Despite the rather low crystalline quality of the GaN buffer, very high quality GaN nanocolumns were achieved in the case of the array with 140 nm average diameter, as indicated from a low temperature photoluminescence donor-bound exciton linewidth of 1.9 meV and negligible densities of stacking faults and threading dislocations determined by transmission electron microscopy. These results may help to the integration of GaN-based nano-devices with the conventional Si(001) electronics platform.

Ferroelectric YAlN grown by molecular beam epitaxy

We report the demonstration of ferroelectric switching in yttrium (Y)-doped nitride semiconductors. In this study, single-crystalline, wurtzite Y0.07Al0.93N films were epitaxially grown on GaN/sapphire templates by plasma-assisted molecular beam epitaxy. The ferroelectric switching process has been investigated by current density–electric field (J-E) and polarization–electric field (P-E) loops as well as positive-up-negative-down measurements, showing a coercive field of ∼6 MV/cm and a switchable polarization of ∼130 μC/cm2. Ferroelectric switching was further confirmed via butterfly shape capacitance–voltage (C-V) loops and polarity-sensitive wet etching. The realization of ferroelectric, Y-doped AlN films further extends the family of nitride ferroelectrics and unravels a wealth of intriguing opportunities in III-nitride based electronic, piezo-electronic, and optoelectronic devices.

In situ study and modeling of the reaction kinetics during molecular beam epitaxy of GeO2 and its etching by Ge

Rutile GeO2 has been predicted to be an ultra-wide bandgap semiconductor suitable for future power electronic devices, while quartz-like GeO2 shows piezoelectric properties. To explore these crystalline phases for application and fundamental materials investigations, molecular beam epitaxy (MBE) is a well-suited thin film growth technique. In this study, we investigate the reaction kinetics of GeO2 during plasma-assisted MBE using elemental Ge and plasma-activated oxygen fluxes. The growth rate as a function of oxygen flux is measured in situ by laser reflectometry at different growth temperatures. A flux of the suboxide GeO desorbing off the growth surface is identified and quantified in situ by the line-of-sight quadrupole mass spectrometry. Our measurements reveal that the suboxide formation and desorption limits the growth rate under Ge-rich or high temperature growth conditions and leads to etching of the grown GeO2 layer under a Ge flux in the absence of oxygen. The quantitative results fit the sub-compound mediated reaction model, indicating the intermediate formation of the suboxide at the growth front. This model is further utilized to delineate the GeO2-growth window in terms of oxygen-flux and substrate temperature. Our study can serve as a guidance for the thin film synthesis of GeO2 and defect-free mesa etching in future GeO2-device processing.

Correlated carrier transport and optical phenomena in CdO layers grown by plasma-assisted molecular beam epitaxy technique

In this work, we have investigated a series of CdO layers grown by the plasma-assisted molecular beam epitaxy technique on the m-plane sapphire substrate. The relation between Cd and O2 parameters during growth influences the stoichiometry of the CdO layers and it affects morphological, optical, and electrical properties which are manifested in the roughness parameter, lattice constant, optical bandgap, and electrical parameter of the layers. The surface morphology and structural properties of CdO layers were studied using atomic force microscopy and X-ray diffraction respectively. Temperature-dependent Hall measurement revealed the maximum mobility of 352 cm2V−1s−1 achieved at room temperature with a carrier concentration of about 4.5 × 1019 cm−3. The optical properties and bandgap of CdO layers were investigated using UV–Visible spectroscopy at room temperature. It is observed that the shift of the bandgap depends upon the carrier concentration and is acquired by combining the effect of bandgap widening and bandgap narrowing.