An etch pitting technique has been developed and has been combined with electron fractography to study the crystallographic features of tensile fracture of polycrystalline beryllium. The crack initiation and the plane of crack propagation of a fine-grain forged beryllium, as well as commercial sheet, were determined from room temperature to 800°F. The fracture origin was internal for both forged beryllium and commercial beryllium sheet. An intergranular origin was observed for forged beryllium at ambient and elevated temperatures, with crack propagation occurring by {11 2 0} fracture. Only transgranular cleavage was observed for commercial beryllium sheet, with crack initiation occurring by basal plane cleavage.
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