With the development of information technology, the heating power of data transmission equipment (mobile phones, notebook computers, data center processors, etc) continues to rise, and the high temperature failure has become a major cause of equipment damage. At present, the heat flux of high-power chips has reached 2 ´ 106 W/m2. Therefore, the traditional single-phase heat transfer is unable to meet the heat dissipation requirements of new data equipment, and more efficient heat exchange methods are urgently needed to ensure the normal operation of the equipment. As a highly efficient phase change heat transfer element, the thin plate grooved heat pipe is researched in the order of millimeters or even micrometers. Therefore, flat grooved heat pipes simultaneously satisfy the heat dissipation and packaging requirements of high power data transmission equipment, and thus have been extensively studied. In the present study, the phase change characteristics and heat transfer performance of flat-plate heat pipes with rectangular grooves were experimentally studied. Each micro heat pipe test section consisted of twenty parallel grooves with the same total length of 90 mm. The cross-sectional area of G-400 heat pipe and G-800 heat pipe were 400 μm ´ 400 μm and 800 μm ´ 800 μm, respectively. The evaporation section, adiabatic section and condensation section had the same size of 30 mm, and vapor space height was equal to 3.6 mm. The flat-plate was sealed on its upper face with transparent plate, and the phase change phenomenon in the grooves could be observed. A high speed camera was used to visualize the phase change phenomenon in evaporation and condensation regimes. The experiments were carried out with the same cooling water temperature of 30°C under the conditions comprising the heat power range of 18–90 W and filling ratio of 150%–400%, respectively. In order to systematically investigate the performance of flat heat pipes with different dimensions of micro grooves, the analysis was focused on the heat resistance and phase change phenomenon in evaporation section and condensation section. The results showed that the heat pipe with wide grooves was able to maintain stable heat transfer performance at higher heat power, while heat pipes with narrow grooves would dry out at lower heat power. The optimal liquid filling rate of G-400 heat pipe was 400%, and the optimal liquid filling ratio of G-800 heat pipe was 150%. Furthermore, the heat transfer in the evaporation section of flat heat pipe with narrow grooves was mainly dominated by liquid film evaporation. Comparatively, the heat transfer phenomenon in the evaporation section of a heat pipe with wide grooves was affected by the liquid filling ratio. The liquid film evaporation was the main solution at low liquid filling ratio, and continuous bubble behavior was visualized in high filling ratio. In addition, the phase change behaviors in the condensation section of rectangular-grooved flat heat pipe not only occured at the gas-liquid interface, but also had droplet condensation phenomenon on the top surface of the groove rib. The cycle of condensation consisted of three stages: Droplet growth, droplet coalescence, and droplet department.