AbstractThe increasing use of electronic devices raises concerns about resource availability and end‐of‐life management, particularly regarding conductors for interconnects and sensing elements. While gold and silver are the leading materials for interconnects, they pose challenges related to scarcity, cost, and toxicity. Zinc offers a promising alternative due to its good electrical conductivity, non‐toxicity, abundance, and affordability. However, challenges in achieving high conductivity and waste generation from processing techniques like screen‐printing remain. To address this, a zinc ink optimizes for 3D printing is proposed, using active zinc particles in a shellac matrix. The methods, including chemical and photonic sintering, achieve conductivities of up to 8.74•104 S m⁻¹ on paper substrates, with stable performance over a range of 30%–70% relative humidity at 15, 20, 25, and 30 °C respectively. Potential applications in high‐conductivity transducers for humidity sensing and metal‐air batteries are demonstrated, achieving a maximum power output of 3.5 mW and an open‐circuit voltage of 1.25 V. The integration of digital material assembly of zinc, reliable high‐performance operation, and non‐toxicity pave the way for innovative advancements in sustainable electronics, including applications in environmental sensing, e‐textiles, and healthcare.
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