For the manufacture of plywood and chipboard are used urea-formaldehyde and phenol-formaldehyde hot curing adhesives. When it is necessary to reduce the content of toxic substances, to increase the strength and reliability of gluing, other properties of adhesive bonding heat urea and phenol-formaldehyde resins are modified. Urea-formaldehyde and phenol-formaldehyde resins were used for research. Urea-formaldehyde resin was modified with technical lignosulfonates with particle sizes of 0.01-0.2 mm, shungites with particle sizes of 0.2-0.8 mm, black shales with particle sizes of 0.005-0.2 mm and aluminosilicates with particle sizes of 0.2 - 0.8 mm. Phenol-formaldehyde resin was modified with pectol, black shales with particle sizes of 0.005-0.2, technical lignosulfonates with particle sizes of 0.01-0.2, and cold sludge from aluminum production with particle sizes of 0.01-0.2. A comparative analysis revealed that all the modifiers under study improve the physicochemical parameters of urea-formaldehyde and phenol-formaldehyde resins, increase the performance properties of glued materials from wood. Plywood was tested for shear strength over the adhesive layer and for the content of free formaldehyde in accordance with Russian standards. Modification of urea and phenol-formaldehyde resins with the proposed substances increases the strength of plywood, at the same time reducing the free formaldehyde content in products.