Peeling Speed Research Articles

Evaluating elevated release liner adhesion of a transdermal drug delivery system (TDDS): A study of Daytrana™ methylphenidate transdermal system

Background: Complaints from healthcare providers that the adhesive on the Daytrana™ methylphenidate transdermal drug delivery system (TDDS) adhered to the release liner to such an extent that the release liner could not be removed prompted this study. Daytrana™ has a packaging system consisting of a moisture-permeable pouch contained within a sealed tray containing a desiccant; the tray is impermeable to ambient moisture. The objective of this project was to determine if the Daytrana™ packaging system influenced the difficulty in removing the release liner.Method: Both a sealed tray and an open tray containing sealed pouches were placed into an environmental chamber at 25°C and 60% relative humidity for 30 days; afterwards, release liner removal testing using a peel angle of 90° and a peel speed of 300 mm/min was performed.Results: TDDS from open chamber trays required less force to remove the release liner than did TDDS from closed chamber trays. For the 10 mg/9 h TDDS and the 15 mg/9 h TDDS (the dosages examined), there were substantial differences in release liner removal force between an old lot and a new lot for closed chamber trays but not for open chamber trays.Conclusion: The results demonstrate that for this particular TDDS, storage conditions such as humidity influence release liner adhesion. This project also demonstrates that, to ensure adequate product quality, adhesion needs to become an important design parameter, and the design of a TDDS should consider the ability to remove the release liner under anticipated storage conditions.

Research on the Key Parameter of the Core Part on the Equipment for Peeling Off the Gingko’s Shell

This paper takes decorticator's core part (Illustration of roller and shutter equipment) as the object of study, through analyzing the principle of the gingko decorticator for peeling off the shell, and choosing the roller's material and its superficial shape, we calculate the action of gingko’s entrance to the gap between roller and shutter, and elaborate the two influences on the effect of peeling off the shell, the gap between roller and shutter and the speed of peeling. The decorticator which makes through this research may achieve good results that the husking yield is bigger than 85%, percentages of damage is smaller than 10%, the broken kernel rate is smaller than 7%. And it provides the theory basis for the improvement design and use of the next generation installment for peeling the shell.

Investigation of the Correlation between IC Chip Pick-Up Performance and Peeling Behavior of Adhesive Tapes

It was investigated that the influences of the peeling behavior of adhesive tapes in peeling tests on IC chip pick-up performance. Needles peel off an IC chip with an adhesive film from the base material in the pick-up process, by sticking out the backside of the base material. In the case that the peeling forces of the adhesive tape decrease as the peeling speeds increase in peeling tests, only two kinds of behaviors were observed in pick-up test; the peeling propagated little and the IC chip was not peeled off under critical needle displacement while the pick-up was completed instantaneously over critical needle displacement. In the case that the peeling forces of the adhesive tape increase as the peeling speeds increase, the pick-up time decreased as the needle displacement increased. As a result, it can be concluded that the needle displacement where the peeling propagates instantaneously is critical for succeeded pick-up if the peeling forces of the adhesive tape decrease as the peeling speeds increase. If the peeling forces of the adhesive tape increase as the peeling speeds increase, the information of peeling speeds at each needle displacement are needed to estimate how long it takes to pick-up a chip.

On the peel behavior of polymer coating–steel system: Effect of hygrothermal aging

AbstractThis paper describes the development and application of a new peel protocols for the evaluation of adhesion of a flexible‐to‐rigid assembly. The developed apparatus allows simulating and predicting the delamination of the polymer coating from the steel substrate. The effect of certain test parameters such as a peel angle and peel speed was discussed. The durability of the retained assembly was equally investigated by considering an accelerated hygrothermal aging. The interfacial damages after conditioning and peel tests were characterized. Using two peeling angles of 90° and 180°, no significant difference was observed in terms of peel responses. The interface behavior seems to be not sensitive to the peel angle. However, an increase in the peel rate induces an increase in the peel strength. The characterization of the interface exhibits two mechanisms: The delamination process of the polymer coating is characterized by cohesive and mixed rupture, respectively, at low and high peel rates. Studying the effects of aging and coating defects on the interface behavior displays a continuous loss of adhesion of the polymer coating especially when it presents physical defects. © 2010 Wiley Periodicals, Inc. Adv Polym Techn 29:185–196, 2010; View this article online at wileyonlinelibrary. DOI 10.1002/adv.20188

Optimal Improvement on Cutting Yield Rate in ACF Attach Process of TFT-LCD Module Using Response Surface Method

In TFT-LCD manufacturing process, the ACF is an essential material. To make the driving circuit conductive, the ACF attach process is used in bonding process. Since the total manufacturing cost becomes lower year by year, the ACF material occupies a great deal of manufacturing cost. The boding technology has been changed from the conventional long bar type into short bar type to save the material usage. The parameter setting of the short bar type machine was not initially optimized. The NG rate of short bar type ACF attach process is higher as compared to the long bar type. The rework cost and material cost may increase in the short bar type process. Therefore, the parameter optimization for the associated short bar type ACF attach process becomes an essential problem. The response surface method is adopted to model the problem. The yield rate is selected as objective function for study. In the analysis of response surface method, the plasma clean speed, ACF peeling speed and ACF cutter spring setting are selected three key factors for discussion. Results reveal that the yield rate can be improved up to 99.35%, which is very helpful to improve the manufacturing process.

Release Liner Removal Method For Transdermal Drug Delivery Systems (TDDS)

A release liner removal test is a valuable test for assessing the quality of a transdermal drug delivery system (i.e., TDDS, patch). This test measures the force required to remove the release liner from a patch. The objective of the present study was to establish sample preparation and instrument parameters for measuring release liner removal adhesion for TDDS. Ten TDDS were evaluated (six drugs for a total of 29 lots). Patches which had a rate-controlling membrane were run as-is, since they could not be cut to a precise width without sacrificing their structural integrity. Patches that were square or rectangular in shape were run as-is, and the width of these patches was determined using a digital caliper. Patches which were not square or rectangular in shape and did not have a rate-controlling membrane were cut to a precise width using a specimen cutter. Double-sided tape was used to adhere the liner side of the transdermal system to a clean stainless steel test panel. A release liner peel adhesion method for TDDS is proposed using a dwell time of approximately 3 min, a peel angle of 90 degrees , and a peel speed of 300 mm/min.

Improvement on Yield of Anisotropic Conductive Film Attach Process in TFT-LCD Module Using Taguchi Method

Anisotropic Conductive Film (ACF) is one of the important materials in LCM (Liquid Crystal Module) process, it is used in bonding process to make the driving circuit conductive. Because the price of TFT-LCD is much lower than before in recent years, the ACF cost has higher ratio in manufacture cost. The conventional long bar ACF attach unit is changed to short bar ACF attach unit in new bonding equipment. However, the new type machine was not optimized in process and mechanical design. Therefore, the failure rate of ACF attach process is much higher than the one of conventional method. This wastes the material and rework cost is also invisible. How to make the manufacturing cost down effectively and promote the product quality will be the important concern to keep the product competition. Therefore, the Taguchi method is used to analyze the problem. The ACF attach yield rate is selected to be objective function for optimization. By the optimization of quality characteristic using Taguchi method, the plasma clean speed, ACF peeling speed and ACF cutter spring setting are studied to optimize the design parameters.

Study on Peeling Behavior in Pick-up Process of IC Chip with Adhesive Tapes

A method to evaluate pick-up performance of four kinds of adhesive tape materials with different thickness has been studied numerically and experimentally. Needles peel an IC chip with an adhesive film off the base material in the pick-up process, by pushing the back of the base material. In our evaluation method, the dependence of the peel energy on the peel speed was measured using a peel test. The finite element method was applied to calculate the energy release rate of the pick-up process for various peel lengths. The pick-up time was obtained from the results of the peel tests and the finite element analysis. Our results indicate that the peel energy is the dominant property influencing the pick-up performance, and the difference in energy release rate in the pick-up process between the samples is not significant. Furthermore, the minimum needle displacement was estimated from the calculated pick-up time using our method. The minimum needle displacement of the experimental pick-up values was in good agreement with the estimated result.

A New Methodology to Measure Strength of Adherence of the Fetal Membrane Components, Amnion and the Choriodecidua

We have previously shown that separation of the amnion from choriodecidua occurs as an integral part of the fetal membranes (FM) rupture process. We have also reported that spontaneous separation of FM is nearly universal with term vaginal delivery. The etiology of this spontaneous FM separation is unknown. If biochemical degradation at the amnion–choriodecidua interface is a factor, decreased adhesive force between the FM components prior to their complete separation would be expected. The purpose of this project was to develop and validate machinery and procedures to measure the adhesive force between amnion and choriodecidua. Commercial tensile testing equipment was adapted to perform a standard T-peel test, per the American Society for Testing and Materials (ASTM) guidelines. FM test strip dimensions, peel speed, and peel force data measurements from force versus displacement curves were optimized for reproducibility. Test system validation was performed using Shurtape CP 60 (slow release painter's masking tape) as the standard. Equipment and procedures for a standard T-peel test on FM were developed. Shurtape CP 60 of decreasing widths showed reproducible, linear changes in the adhesive force range for FM (r2=0.96). The adhesive force between FM components ranged from 0.017 to 0.262N/cm. Reproducibility was optimal with FM test strips of 4×6cm and a peel speed of 25.4cm/min. FM showed greater adhesive force adjacent to the placental disc than distal from the disc (p<0.05). We have developed equipment and procedures to accurately and reproducibly measure adhesive force between the FM amnion and choriodecidua.

Measurements with a New Peel Adhesion Test on Waterproof Membranes Used on Concrete Bridge Decks

Abstract Interface adhesion is one of the critical performance criteria to evaluate the engineering properties of the waterproof membrane (WM) used on concrete bridge decks. The standardized methods such as the ones specified by ASTM have provided guidance to conduct interface adhesion tests. However, these methods are not specially designed for a WM used on concrete bridge decks, and ASTM D3359 is a qualitative test for evaluation of peel strength. Meanwhile, the interface adhesion is affected by a myriad of sophisticated field conditions. Accordingly, this research investigates the interface adhesion strength of the WM using a new 90° peel test. Laboratory and field tests were conducted in which the influences of peeling speed, use of subcoat, and construction temperature were taken into account. The four-point bending fatigue test on a WM was designed to account for the influences of repeated vehicle loadings on adhesion strength. Test results indicate that peel strength increases with increasing peeling speed, while it increases initially and then decreases with increasing the construction temperature of the WM and the content of subcoat. It is also found that peel strength has a linear log-log relationship with fatigue loading cycles.

Evaluation of substrates for 90° peel adhesion—A collaborative study. II. Transdermal drug delivery systems

In a previous study on peel adhesion for medical tapes, it was shown that a stainless steel (SS) substrate better discriminated among medical tapes than a high-density polyethylene (HDPE) substrate. The objective of this study was to determine if a SS substrate would also better distinguish among transdermal drug delivery systems (TDDSs). Five TDDSs (Vivelle Dot, Climara, Catapres-TTS, Duragesic, and Mylan Fentanyl) were evaluated on three different substrates (SS, HDPE, and human cadaver skin). All measurements were made using a dwell time of approximately 3 min, a peel angle of 90 degrees, and a peel speed of 300 mm/min. Differences among TDDSs were greater for SS than for HDPE, using the F statistic for testing for differences among TDDSs means as a measure of heterogeneity, thereby indicating greater discrimination by SS.

Peel process simulation of sealed polymeric film computational modelling of experimental results

PurposeThe purpose of this paper is to evaluate current simulation capabilities for thin film delamination on the basis of real test data as well as a contribution to its extension in order to partly substitute experimental investigations.Design/methodology/approachThe proposed model consists of a formulation that describes the behaviour of the bulk material and an approach that introduces the film's delamination capability. An implicit finite element framework with a cohesive zone implementation is used and described in detail. The numerical results on the basis of the a priori identified material parameters are related to the experimental work. In order to capture the obvious peel speed dependency of these delamination processes, a viscoelastic cohesive formulation is introduced and compared with a pure separation rate dependent cohesive material in the second part of this contribution.FindingsThe performed numerical simulations show a good approximation of the experimental peel process. The extension in order to take time‐dependent effects into account is required for the simulation of such problems. In contrast with the pure rate‐dependent model, the presented consistent formulation of the cohesive part is able to cover the whole range of observed material phenomena.Research limitations/implicationsOwing to the absence of suitable experimental single mode investigations of the sealed layer, the used cohesive material parameters are identified in relation to the pre‐existing experimental results. Furthermore, the resultant peel force has a constant value due to the assumed homogeneous cohesive material and therefore gives only a mean approximation of the experimental values at this stage of the investigation.Originality/valueThe numerical representation of such a thin film delamination process in relation to real experimental results shows the additional capabilities and the usability of the implicit finite element method with a cohesive zone implementation in a clear and illustrative way. The first proposed cohesive extension based on a rheological model shows the capability to cover the full range of time‐dependent interface layer behaviour.

Spectroscopic Measurement of Faint Light Produced by Rapid Separation of an Adhesive Tape

This paper describes results on an experimental study of faint light emission produced by separation of an adhesive tape from a glass or from a polymer film. Spectroscopic measurements of the faint light were carried out using a monochromator and a photomultiplier. The results indicated that the light emission was caused by discharges near the tape-air-glass triple junction. We found that the frequency of the light emission was strongly changed by changing the peeling speed of the tape. Discharge lights were detected in many times in the case of high-speed peeling, whereas no light was detected in the case of low-speed peeling. We also measured surface potential distributions on the film after separation from the tape using a XY-movable probe and an electrostatic voltmeter. The surface potential on the film after the fast-speed peeling became slightly higher than that on the film after the low-speed peeling.

김치생산용 알타리무 전처리가공시스템 개발(II) - 평면형 삭피칼날의 최적형상 -

In this study, peeling test of the Altari radish on kimchi pre-processing system for mechanization was performed with the longitudinal plane peeling type with wider cutting blade than that of the peeled chip's. To determine the optimum cutter shape to match this plane peeling type, the peeling tests depending on variable cutting speed, rake angle and blade angle using the blade with thickness as 2 m and width as 50mm were performed, and the patterns of the peeled chips and peeling resistances were investigated. As the result of the tests, the rake angle of the blade with clean peeled surface of the Altari radish was over <TEX>$45^{\circ}$</TEX>, and the blade angle and rake angle with the minimum peeling resistance was <TEX>$20^{\circ}\;and\;60^{\circ}$</TEX>, respectively. The optimum peeling conditions were; the peeling speed 0.2m/s, blade angle <TEX>$20^{\circ}$</TEX> and the rake angle <TEX>$60^{\circ}$</TEX>, and the peeling resistance of each blade was 15 N.

김치생산용 알타리무 전처리가공시스템 개발(III) - 삭피장치의 개발 -

A prototype peeling device with rotating cutter blades was designed to peel altari radish skin. With the designed blades, the maximum peeling depth increased as the cutter clearance increased but the effect of the peeling speed was not significant. The optimal operating conditions for peeling was; the peeling speed was at 0.19m/s when peeled 2.5 blades/sec and the maximum peeling depth was 1.5mm, the minimum peeling depth was 0.5mm, and the leaf rotating speed was 12 rpm, respectively. In the peeling test fur the optimum operation conditions, with a auxiliary rolling device could adjust the rotational speed of the root uniformly, the altari radishes under 70mm diameter were peeled perfectly.

Stability of Tunnel Structure and Relationship between Peel Load and Spatiotemporal Pattern by Deformed Adhesive during Peeling

We investigated (i) the relationship between the spatiotemporal pattern of a deformed adhesive and peel load during peeling, and (ii) the dependence of the pattern formation on peel speed in the hard spring limit case. In the hard spring limit case, it is found that elastic and viscous peeling states coexist. It is also found that the occupation ratio of tunnel structures in a separation front is determined by the peel speed and is a monotonically decreasing function of peel speed. We experimentally confirmed that the value of peel load has a linear dependence on the occupation ratio of tunnel structures. An explanation of dynamical behavior is also given on the basis of the creation–annihilation dynamics of tunnel structures.

粘着テープの基礎と物性

Stringiness phenomena of PSA tapes at peeling were observed.(1) Effects of the backing materials;It becomes clear that the stringiness conformation of adhesives of the porous backings was observed as a honeycomb structure and that of the nonporous backing was a sawtooth shape structure.(2) Effects of the peel load;Stringiness phenomena of acrylic adhesive were observed under constant load conditions. In the results, peeling behavior was classified into the following two regions depending on peel load.A) Balanced region of peeling load vs. stress distribution caused by deformation of the adhesive tape at considerably low peeling speed.B) Unbalanced region where peeling occurred before peeling stress had been distributed equally in the adhesive at higher peeling speed.

알타리무 삭피용 최적 칼날형상의 구명

This study was conducted to determine the optimum blade shape for peeling Altari radish. To figure out the required peeling force according to various angles of blade and rakes of peeling cutter, two peeling tests such as circumferential peeling and longitudinal peeling of Altari radish were carried out. Based on the pretest results, which performed to investigate the applicability of the optimum shape of cutter and to find out the cutting pattern according to the lapse of days after harvesting the radish, the peeling depth and width of the blade were fixed at 2 mm and 10 mm. From two methods of circumferential and longitudinal peeling test, the angles of rake and blade as cutter shape factors were affected on peeling force. But the peeling speed was not affected on it under the safety speed as 0.2 m/s, without blade vibrating on peeling operation. The rake angle was more effective factor than the blade angle, and the optimum angles of blade and rake were 10<TEX>$^{\circ}$</TEX> and 55<TEX>$^{\circ}$</TEX> respectively. The cutting surface by the longitudinal peeling was more smooth than that by the circumferential peeling. There was no problem in peeling work during 4 days after harvest because the freshness of the Altari radish was maintained.

Global solutions to a one-dimensional hyperbolic free boundary problem which arises in peeling phenomena

This problem arises from the physical model “Peel a thin film from a domain”. The behavior of the peeling front is governed by a hyperbolic equation. As the first step, the one-dimensional case is treated. The local solutions have been already given. In this note, the global solution is constructed under the assumption the peeling speed is non negative.

Dynamical–Morphological Property of Adhesive Tape in Peeling

We experimentally investigated the dynamical behavior of adhesive tape in peeling with emphasis on the emergence of slow and fast peeling motions. The dynamical–morphological phase diagram for peeled adhesive tape as a function of peel speed and spring constant was obtained. The spatiotemporal patterns of peeled adhesive were classified into four types: low-speed pattern, high-speed pattern, oscillatory pattern, and spatiotemporal intermittent pattern.