Deposition Of Patterned Films Research Articles

Selective atomic layer deposition of HfO2 on copper patterned silicon substrates

Selective atomic layer deposition (ALD) was performed on copper patterned silicon substrates to selectively deposit HfO2 film on silicon. The selectivity is based on differences of surface physics/chemistry rather than use of any molecular masking such as self-assembled monolayers. On silicon, the growth rate of HfO2 is 0.11 nm /cycle with no initial inhibition of film growth, while on copper no HfO2 deposition was observed up to at least 25 ALD cycles. The selective growth on silicon over copper at 25 ALD cycles provides a patterned film deposition at thicknesses of 2.8 nm HfO2 which is relevant to semiconductor nanofabrication.

Polystyrene thin film formed by synchrotron radiation chemical vapor deposition

Formation of polystyrene thin film by the synchrotron radiation chemical vapor-deposition method was investigated using a styrene monomer. Polystyrene film was deposited at the irradiated area and vicinity along the irradiated area on a Si substrate. The deposition rate depended on the monomer gas pressure, substrate temperature, and x-ray wavelength. Polystyrene film at the irradiated area was insoluble in benzene solvent, while that at the unirradiated area was easily dissolved. A patterned film deposition could be successfully performed under an irradiation of synchrotron radiation through a Ni mesh mask. The pattern profile was influenced by the gap length between the Si substrate and mask and a clear pattern was obtained after benzene treatment.