Abstract
Formation of polystyrene thin film by the synchrotron radiation chemical vapor-deposition method was investigated using a styrene monomer. Polystyrene film was deposited at the irradiated area and vicinity along the irradiated area on a Si substrate. The deposition rate depended on the monomer gas pressure, substrate temperature, and x-ray wavelength. Polystyrene film at the irradiated area was insoluble in benzene solvent, while that at the unirradiated area was easily dissolved. A patterned film deposition could be successfully performed under an irradiation of synchrotron radiation through a Ni mesh mask. The pattern profile was influenced by the gap length between the Si substrate and mask and a clear pattern was obtained after benzene treatment.
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