Package Failure Research Articles

Failure Analysis of the Solder Joints in Flip-Chip BGA Packages under Free-Drop Test

The failure of plastic ball grid array under intense dynamic loading was studied in the project. This paper presents the drop test reliability results of SnPb flip-chip on a standard JEDEC drop reliability test board. The failure mode and mechanism of planar array package in the drop test was comprehensively analyzed. High acceleration dropping test method was used to research the reliability of BGA (ball grid array) packages during the free-drop impact process. The model RS-DP-03A drop device was used to simulate the falling behavior of BGA chip packages under the real conditions, The drop condition meets the JEDEC22-B111 standards (pulse peak 1500g, pulse duration 0.5 ms) when dropping from the 650mm height . In the testing, according to the real-time changes of dynamic voltage, the relationship between drop times and different phases of package failure was analyzed. With the dye-penetrated method and optical microscopy, it was easy to observe the internal crack and failure locations. The growth mechanism of the cracks in solder joints under the condition of drop-free was analyzed and discussed.

Long-term storage life of light source modules by temperature cycling accelerated life test

Light source modules are the most crucial and fragile devices that affect the life and reliability of the interferometric fiber optic gyroscope (IFOG). While the light emitting chips were stable in most cases, the module packaging proved to be less satisfactory. In long-term storage or the working environment, the ambient temperature changes constantly and thus the packaging and coupling performance of light source modules are more likely to degrade slowly due to different materials with different coefficients of thermal expansion in the bonding interface. A constant temperature accelerated life test cannot evaluate the impact of temperature variation on the performance of a module package, so the temperature cycling accelerated life test was studied. The main failure mechanism affecting light source modules is package failure due to solder fatigue failure including a fiber coupling shift, loss of cooling efficiency and thermal resistor degradation, so the Norris-Landzberg model was used to model solder fatigue life and determine the activation energy related to solder fatigue failure mechanism. By analyzing the test data, activation energy was determined and then the mean life of light source modules in different storage environments with a continuously changing temperature was simulated, which has provided direct reference data for the storage life prediction of IFOG.

Shock Impact Reliability and Failure Analysis of a Three-Axis MEMS Gyroscope

This paper presents the reliability assessment of a three-axis microelectromechanical systems (MEMS) gyroscope subjected to various shock loading conditions. The reliability tests include three different impact orientations and several acceleration levels of shock impact, ranging from 1500 to 15 000 g. The package failure and functional failure of the MEMS devices are studied separately. The failure analysis shows package failures of the MEMS device at a shock level above 8000 g and the functional failures of the device caused by stiction or fractures in the comb structure at a moderate shock level around 4000 g. To have a comprehensive understanding of the failure modes and predict the failure modes, dynamic finite element analyzes with direct integration are employed to investigate the nonlinear responses of the MEMS device under shock impact loadings. Internal collisions between the movable elements and the stationary parts are modeled by contact definitions. The simulation results, such as the calculated structural deformation and stress distributions, can be used to predict potential failure sites and offer explanations to the observed package failures and comb structure fractures. Furthermore, the locations of possible stiction inside the MEMS structure are also predicted by the simulation results.

In Situ Diagnostics and Prognostics of Wire Bonding Faults in IGBT Modules for Electric Vehicle Drives

This paper presents a diagnostic and prognostic condition monitoring method for insulated-gate bipolar transistor (IGBT) power modules for use primarily in electric vehicle applications. The wire-bond-related failure, one of the most commonly observed packaging failures, is investigated by analytical and experimental methods using the on-state voltage drop as a failure indicator. A sophisticated test bench is developed to generate and apply the required current/power pulses to the device under test. The proposed method is capable of detecting small changes in the failure indicators of the IGBTs and freewheeling diodes and its effectiveness is validated experimentally. The novelty of the work lies in the accurate online testing capacity for diagnostics and prognostics of the power module with a focus on the wire bonding faults, by injecting external currents into the power unit during the idle time. Test results show that the IGBT may sustain a loss of half the bond wires before the impending fault becomes catastrophic. The measurement circuitry can be embedded in the IGBT drive circuits and the measurements can be performed in situ when the electric vehicle stops in stop-and-go, red light traffic conditions, or during routine servicing.

Impact of high frequency current ripple on supercapacitors ageing through floating ageing tests

Supercapacitors (SC) are energy storage systems (ESS) which are appreciated in hybrid vehicle. Hybrid vehicles electrical network is based on DC–DC converter which imply HF current ripple. This article proposes through ageing tests exploitation to study the influence of hybrid car HF current ripple on SC ageing (with current ripple of the same order of magnitude and frequency than for hybrid onboard network). Impedance parameter evolution is used to monitor SC state of health. Obtained results show that current ripple has significant effects on SC ageing kinetic and reliability (packaging failures). The packaging failures are linked to overpressure induced by HF current ripple. Finally a new model for SC ageing under current ripple is proposed thanks to electrolyte degradation by an electrical resonance process.

Expected dose and associated uncertainty and sensitivity analysis results for all scenario classes in the 2008 performance assessment for the proposed high-level radioactive waste repository at Yucca Mountain, Nevada

Extensive work has been carried out by the U.S. Department of Energy (DOE) in the development of a proposed geologic repository at Yucca Mountain (YM), Nevada, for the disposal of high-level radioactive waste. In support of this development and an associated license application to the U.S. Nuclear Regulatory Commission (NRC), the DOE completed an extensive performance assessment (PA) for the proposed YM repository in 2008. The conceptual structure and organization of the 2008 YM PA is based on decomposing the analysis into the following scenario classes: nominal, early waste package failure, early drip shield failure, igneous intrusive, igneous eruptive, seismic ground motion, and seismic fault displacement. This presentation describes how results obtained for the individual scenario classes are brought together in the determination of expected dose to the reasonably maximally exposed individual (RMEI) specified by the NRC in the regulatory requirements for the YM repository and presents associated uncertainty and sensitivity analysis results. The following topics are addressed: (i) determination of expected dose to the RMEI from all scenario classes, (ii) expected dose and uncertainty in expected dose to the RMEI for 0 to 20,000yr, (iii) expected dose and uncertainty in expected dose to the RMEI from for 0 to 106yr, (iv) justification for the decomposition procedure used to estimate expected dose to the RMEI from all scenario classes, and (v) effectiveness of individual barrier systems in reducing releases from the repository and thus dose to the RMEI. The present article is part of a special issue of Reliability Engineering and System Safety devoted to the 2008 YM PA; additional articles in the issue describe other aspects of the 2008 YM PA.

Uncertainty and sensitivity analysis for the nominal scenario class in the 2008 performance assessment for the proposed high-level radioactive waste repository at Yucca Mountain, Nevada

Extensive work has been carried out by the U.S. Department of Energy (DOE) in the development of a proposed geologic repository at Yucca Mountain (YM), Nevada, for the disposal of high-level radioactive waste. In support of this development and an associated license application to the U.S. Nuclear Regulatory Commission (NRC), the DOE completed an extensive performance assessment (PA) for the proposed YM repository in 2008. This presentation describes uncertainty and sensitivity analysis results for the nominal scenario class (i.e., for undisturbed conditions) obtained in the 2008 YM PA. The following topics are addressed: (i) uncertainty and sensitivity analysis procedures, (ii) drip shield and waste package failure, (iii) engineered barrier system conditions, (iv) radionuclide release results for the engineered barrier system, unsaturated zone, and saturated zone, and (v) dose to the reasonably maximally exposed individual specified in the NRC regulations for the YM repository. The present article is part of a special issue of Reliability Engineering and System Safety devoted to the 2008 YM PA; additional articles in the issue describe other aspects of the 2008 YM PA.

Uncertainty and sensitivity analysis for the early failure scenario classes in the 2008 performance assessment for the proposed high-level radioactive waste repository at Yucca Mountain, Nevada

Extensive work has been carried out by the U.S. Department of Energy (DOE) in the development of a proposed geologic repository at Yucca Mountain (YM), Nevada, for the disposal of high-level radioactive waste. In support of this development and an associated license application to the U.S. Nuclear Regulatory Commission (NRC), the DOE completed an extensive performance assessment (PA) for the proposed YM repository in 2008. This presentation describes uncertainty and sensitivity analysis results for the early waste package failure scenario class and the early drip shield failure scenario class obtained in the 2008 YM PA. The following topics are addressed: (i) engineered barrier system conditions, (ii) release results for the engineered barrier system, unsaturated zone, and saturated zone, (iii) dose to the reasonably maximally exposed individual (RMEI) specified in the NRC regulations for the YM repository, and (iv) expected dose to the RMEI. The present article is part of a special issue of Reliability Engineering and System Safety devoted to the 2008 YM PA; additional articles in the issue describe other aspects of the 2008 YM PA.

Expected dose for the early failure scenario classes in the 2008 performance assessment for the proposed high-level radioactive waste repository at Yucca Mountain, Nevada

Extensive work has been carried out by the U.S. Department of Energy (DOE) in the development of a proposed geologic repository at Yucca Mountain (YM), Nevada, for the disposal of high-level radioactive waste. In support of this development and an associated license application to the U.S. Nuclear Regulatory Commission (NRC), the DOE completed an extensive performance assessment (PA) for the proposed YM repository in 2008. This presentation describes the determination of expected dose to the reasonably maximally exposed individual (RMEI) specified in the NRC regulations for the YM repository for the early waste package (WP) failure scenario class and the early drip shield (DS) failure scenario class in the 2008 YM PA. The following topics are addressed: (i) properties of the early failure scenario classes and the determination of dose and expected dose the RMEI, (ii) expected dose and uncertainty in expected dose to the RMEI from the early WP failure scenario class, (iii) expected dose and uncertainty in expected dose to the RMEI from the early DS failure scenario class, (iv) expected dose and uncertainty in expected dose to the RMEI from the combined early WP and early DS failure scenario class with and without the inclusion of failures resulting from nominal processes, and (v) uncertainty in the occurrence of early failure scenario classes. The present article is part of a special issue of Reliability Engineering and System Safety devoted to the 2008 YM PA; additional articles in the issue describe other aspects of the 2008 YM PA.

Overview of total system model used for the 2008 performance assessment for the proposed high-level radioactive waste repository at Yucca Mountain, Nevada

A summary is presented for the total system model used to represent physical processes associated with the seven scenario classes (i.e., nominal conditions, early waste package (WP) failure, early drip shield (DS) failure, igneous intrusive events, igneous eruptive events, seismic ground motion events and seismic fault displacement events) considered in the 2008 performance assessment for the proposed repository for high-level radioactive waste at Yucca Mountain, Nevada. The total system model estimates dose to an exposed individual resulting from radionuclide movement through the repository system and biosphere. Components of the total system model described in this presentation include models for (i) climate analysis, (ii) land surface infiltration and associated unsaturated zone flow, (iii) multi-scale thermal hydrology and engineered barrier system (EBS) thermal–hydrologic environment, (iv) EBS physical and chemical environment, (v) WP and DS degradation, (vi) drift seepage and drift wall condensation, (vii) waste form degradation and mobilization, (viii) water and radionuclide movement in the EBS and underlying unsaturated and saturated zones, (ix) radionuclide movement in the biosphere and resultant human exposure, and (x) processes specific to early WP and DS failures, intrusive and eruptive igneous events, and seismic ground motion and fault displacement events.

Impaired genome encapsidation restricts the in vitro propagation of human parvovirus B19

The lack of a permissive cell culture system hampers the study of human parvovirus B19 (B19V). UT7/Epo is one of the few established cell lines that can be infected with B19V but generates none or few infectious progeny. Recently, hypoxic conditions or the use of primary CD36+ erythroid progenitor cells (CD36+ EPCs) have been shown to improve the infection. These novel approaches were evaluated in infection and transfection experiments. Hypoxic conditions or the use of CD36+ EPCs resulted in a significant acceleration of the infection/transfection and a modest increase in the yield of capsid progeny. However, under all tested conditions, genome encapsidation was impaired seriously. Further analysis of the cell culture virus progeny revealed that differently to the wild-type virus, the VP1 unique region (VP1u) was exposed partially and was unable to become further externalized upon heat treatment. The fivefold axes pore, which is used for VP1u externalization and genome encapsidation, might be constricted by the atypical VP1u conformation explaining the packaging failure. Although CD36+ EPCs and hypoxia facilitate B19V infection, large quantities of infectious progeny cannot be generated due to a failure in genome encapsidation, which arises as a major limiting factor for the in vitro propagation of B19V.

Trans-packaging of human immunodeficiency virus type 1 genome into Gag virus-like particles in Saccharomyces cerevisiae

BackgroundYeast is recognized as a generally safe microorganism and is utilized for the production of pharmaceutical products, including vaccines. We previously showed that expression of human immunodeficiency virus type 1 (HIV-1) Gag protein in Saccharomyces cerevisiae spheroplasts released Gag virus-like particles (VLPs) extracellularly, suggesting that the production system could be used in vaccine development. In this study, we further establish HIV-1 genome packaging into Gag VLPs in a yeast cell system.ResultsThe nearly full-length HIV-1 genome containing the entire 5′ long terminal repeat, U3-R-U5, did not transcribe gag mRNA in yeast. Co-expression of HIV-1 Tat, a transcription activator, did not support the transcription. When the HIV-1 promoter U3 was replaced with the promoter for the yeast glyceraldehyde-3-phosphate dehydrogenase gene, gag mRNA transcription was restored, but no Gag protein expression was observed. Co-expression of HIV-1 Rev, a factor that facilitates nuclear export of gag mRNA, did not support the protein synthesis. Progressive deletions of R-U5 and its downstream stem-loop-rich region (SL) to the gag start ATG codon restored Gag protein expression, suggesting that a highly structured noncoding RNA generated from the R-U5-SL region had an inhibitory effect on gag mRNA translation. When a plasmid containing the HIV-1 genome with the R-U5-SL region was coexpressed with an expression plasmid for Gag protein, the HIV-1 genomic RNA was transcribed and incorporated into Gag VLPs formed by Gag protein assembly, indicative of the trans-packaging of HIV-1 genomic RNA into Gag VLPs in a yeast cell system. The concentration of HIV-1 genomic RNA in Gag VLPs released from yeast was approximately 500-fold higher than that in yeast cytoplasm. The deletion of R-U5 to the gag gene resulted in the failure of HIV-1 RNA packaging into Gag VLPs, indicating that the packaging signal of HIV-1 genomic RNA present in the R-U5 to gag region functions similarly in yeast cells.ConclusionsOur data indicate that selective trans-packaging of HIV-1 genomic RNA into Gag VLPs occurs in a yeast cell system, analogous to a mammalian cell system, suggesting that yeast may provide an alternative packaging system for lentiviral RNA.

Estimation of ACF packaging failure probability for IC/substrate assemblies with different pad array dimensions

An analytical model based on the V-shaped curve method is proposed for estimating the failure probability of anisotropic conductive film (ACF) packages with different pad array dimensions. In analyzing the failure probability of the ACF package, the probability of an opening event in the conductivity direction is modeled as a Poisson distribution, while the probability of a bridging event in the insulation direction is modeled using the enhanced box model. The overall failure probability of the package is then calculated in accordance with the inclusion–exclusion principle of combinatorial mathematics. The results presented in this study suggest that the failure probability of ACF packages with a high pad array dimension can be improved by reducing the pad height, decreasing the conductive particle size, increasing the pad pitch, increasing the pad size, or setting the ACF volume fraction close to the tip of the V-shaped curve.

Composite Anisotropic Conductive Film

Anisotropic conductive film (ACF), is a lead-free and fine-pitch interconnect materials that is commonly used in liquid crystal display (LCD) manufacturing to make and maintain the electrical and mechanical connections from the driver IC to the substrate. A key issue in the ACF technology is the packaging yield or failure probability, and performance of ACF’s material formula composition. This paper utilizes the V-shaped curve method to analyze the failure probability of composite ACF packages with a smart composition or a functional formula. In the proposed model, the probability of opening failures is modeled using a Poisson function, modified to take into account the average conception on the effective conductive area between opposing pads. Meanwhile, the probability estimation of bridging failures is based on the Box-Strip-Brick model between the neighboring pad pairs in the array. The results show the derived probability formulation can involve the probability conceptions of the composite ACF into a complete evaluation computation.

Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact

Lead free solders are replacing lead rich solders in the electronic industry, the performance and safety of lead free solder interconnects in electric packaging under drop impact becomes a critical concern of semiconductor and electronic product manufacturers. Compared with the lead rich solder alloy, lead free solder alloy typically has higher rigidity and lower ductility. The presence of the Intermetallic Compound (IMC) layer can also affect the drop impact response of the solder interconnect, which may lead to quasi-brittle solder/IMC interfacial fracture. The traditional drop test is expensive and time consuming, and it is quite difficult to observe the full dynamic responses during the drop impact. In the present study, numerical analysis is performed to investigate drop impact effect on ball grid array (BGA) electronic packaging with the intention of predicting the performance of solders under drop impact and providing the fundamental understanding required to design a reliable electric packaging. A three dimensional finite element model is developed to simulate the solder interconnect and electronic packaging failure under board-level drop impact. An impact analysis procedure coupled with sub-modeling technique is established. The Cu6Sn5 and Cu3Sn IMC layers are incorporated in the solder interconnects model; cohesive fracture mechanics based method is applied to predict the crack initiation and propagation near the IMC/solder interface. A lead-free solder alloy constitutive relationship comprising elastic and rate dependent plastic effects is incorporated in the computational model.

Biomedical sensor packaging failures: Regulations are not design standards

Design of biomedical sensors and probes are limited by failure analysis tools that are unable to prediction product life, partially due to the absence of time-dependant materials property databases. “Design for reliability” lags “test for reliability,” thus less than optimal product designs reach the market. Regulatory agencies have identified several critical path design projects that could alleviate the situation. An argument is made that design standards are the province of Industry and an initiative for collaboration on pre-competitive material design data should be undertaken.

Past, Present, and Future of Polymer Science at BAM

Past, Present, and Future of Polymer Science at BAM

Failure modes and effects criticality analysis and accelerated life testing of LEDs for medical applications

While use of LEDs in Fiber Optics and lighting applications is common, their use in medical diagnostic applications is not very extensive. Since the precise value of light intensity will be used to interpret patient results, understanding failure modes [1–4] is very important. We used the Failure Modes and Effects Criticality Analysis (FMECA) tool to identify the critical failure modes of the LEDs. FMECA involves identification of various failure modes, their effects on the system (LED optical output in this context), their frequency of occurrence, severity and the criticality of the failure modes. The competing failure modes/mechanisms were degradation of: active layer (where electron–hole recombination occurs to emit light), electrodes (provides electrical contact to the semiconductor chip), Indium Tin Oxide (ITO) surface layer (used to improve current spreading and light extraction), plastic encapsulation (protective polymer layer) and packaging failures (bond wires, heat sink separation). A FMECA table is constructed and the criticality is calculated by estimating the failure effect probability (β), failure mode ratio (α), failure rate (λ) and the operating time.Once the critical failure modes were identified, the next steps were generation of prior time to failure distribution and comparing with our accelerated life test data. To generate the prior distributions, data and results from previous investigations were utilized [5–33] where reliability test results of similar LEDs were reported. From the graphs or tabular data, we extracted the time required for the optical power output to reach 80% of its initial value. This is our failure criterion for the medical diagnostic application. Analysis of published data for different LED materials (AlGaInP, GaN, AlGaAs), the Semiconductor Structures (DH, MQW) and the mode of testing (DC, Pulsed) was carried out. The data was categorized according to the materials system and LED structure such as AlGaInP–DH–DC, AlGaInP–MQW–DC, GaN–DH–DC, and GaN–DH–DC. Although the reported testing was carried out at different temperature and current, the reported data was converted to the present application conditions of the medical environment. Comparisons between the model data and accelerated test results carried out in the present are reported. The use of accelerating agent modeling and regression analysis was also carried out. We have used the Inverse Power Law model with the current density J as the accelerating agent and the Arrhenius model with temperature as the accelerating agent. Finally, our reported methodology is presented as an approach for analyzing LED suitability for the target medical diagnostic applications.

Modified Atmosphere Packaging Failure and Its Effect on the Microbiological Quality of the Product

Modified Atmosphere Packaging Failure and Its Effect on the Microbiological Quality of the Product

Detection of cheese packaging containment failures using reversible optical oxygen sensors

This study investigated the capacity of optical oxygen sensors to nondestructively detect containment packaging failures in commercial vacuum packed cheddar cheese. Unacceptable oxygen levels in packs lead to product deterioration and can significantly reduce shelf life. Vacuum packed cheddar cheese was monitored for oxygen levels over time at 4 °C with optical sensors prefitted to packaging laminates polyethyleneterephthalate/polypropylene. Oxygen levels present in packs immediately after packaging were 3% on average. Further ingress of oxygen into all packs occurred over storage time and levels ranged from 3.6% to 8.2% after 6 days. Information obtained using oxygen sensors led to further assessments and identification of the causes of packaging containment failure.