Level Packaging Research Articles

Effect of integrated crop management on brinjal yield and economics through frontline demonstration at farmers field

The studies were conducted on effect of integrated crop management on brinjal yield and economics through frontline demonstration at farmers field of Tumkuru district, Karnataka state during the year 2009-10 to 2011-12. The data revealed that the total yield gap between potential yield and actual yield of brinjal was 53.67 per cent, in which 16.92 per cent of yield gap between demonstration plot and actual farmers plot yield and 36.75 per cent of technological gap. The maximum number of farmers were adopted recommended spacing (88.33%) followed by seed treatment (83.33%), timely irrigation (81.67%) and weed management (81.67%). The increased in adoption level of package of practices were found to more in raising and selection of quality seedling from nursery (50.00%) fallowed by selection of high yielding hybrid variety (46.67%) and application of vegetable special (50.00%). Whereas, the package of practices viz. , plant protection measures to control pest and diseases (21.67%), application of recommended dose of fertilizer (25.00%) and seed treatment (26.67%) were found to less increase in adoption level after frontline demonstration. There was significantly increased in brinjal yield (36.51%), net return and B:C ratio after conduct of frontline demonstrations as compared to farmers practice. The adoption of package of practices even though after demonstrations programme, which shows positive impact of integrated crop management on brinjal yield and economics through adoption of demonstrated technology.

A Large-Scale Study of Android Malware Development Phenomenon on Public Malware Submission and Scanning Platform

With the steady growth of Android malware, we suspect that, during the malware development phase, some Android malware writers use the popular public scanning services (e.g., VirusTotal) for testing the evasion capability of their malware samples, which we name Android malware development cases (AMDs). In this work, we design an AMD hunter in the context of VirusTotal to hunt for AMDs and reveal new threats for Android. First, the AMD hunter sifts through millions of file submissions on VirusTotal efficiently and alert more suspicious submission traces. Second, it performs package level analysis, static code and dynamic analyses on the APKs of the suspicious submissions to validate the AMDs. The implemented hunter has been used in a leading security company for 4 months, which processed 153 million of submissions on VirusTotal, and identified 1,623 AMDs with 13,855 samples from 83 countries. We also performed case studies on 890 malware samples selected from the identified AMDs, which revealed lots of new threats, including the development cases of fake system/banking phishing app, new rooting exploits, new JavaScript based threats, new evasions and AV probing malware. We wrote industry research articles about some AMDs and notified other security vendors to help patch their false negatives. Besides raising the awareness of the existence of AMDs, more importantly, our research provides the first systematic and efficient way to study the malware development phenomenon on VirusTotal. We will share all the samples of the identified AMDs with the research community.

Virion-Packaged Pyruvate Kinase Muscle Type 2 Affects Reverse Transcription Efficiency of Human Immunodeficiency Virus Type 1 by Blocking Virion Recruitment of tRNA<sup>Lys3</sup>

Human immunodeficiency virus type 1 (HIV-1) recruits diverse cellular factors into viral particles during its morphogenesis, which apparently play roles in modulating its infectivity. In our study, proteomic techniques demonstrated that a key glycolytic protein, pyruvate kinase muscle type 2 (PKM2), is incorporated into viral particles. Here, we show that virion-packaged PKM2 significantly reduces viral infectivity by affecting the incorporation level of a cellular tRNALys3 into virions. Enhanced expression of PKM2 in HIV-1-producing cells led to a higher incorporation level of PKM2 into progeny virions without affecting the viral maturation process. Compared with the control virus, the high-level-PKM2-packaging virus showed decreased levels of both reverse transcription products and cellular tRNALys3 packaging, suggesting that the shortage of intravirion tRNALys3 suppresses reverse transcription efficiency in target cells. Interestingly, the enhanced expression of PKM2 also suppressed the virion recruitment of other nonpriming cellular tRNAs such as tRNALys1,2 and tRNAAsn, which are known to be selectively packaged into virions, without affecting the steady level of the cytoplasmic pool of those tRNAs in producer cells, suggesting that PKM2 specifically impedes the selective incorporation of tRNAs into virions. Taken together, our findings indicate that PKM2 is a vital host factor that negatively affects HIV-1 infectivity by targeting the tRNALys3-mediated initiation of reverse transcription in target cells.

Effect of nisin-EDTA combinations and modified atmosphere packaging on the survival of Salmonella enteritidis in Turkish type meatballs

ABSTRACTMeatballs are widely consumed ready-to-cook meat products due to their favourable tastes and flavours. They can be contaminated with several saprophyte and pathogenic bacteria due to their ingredients. The aim of this study was to investigate the effect of nisin and EDTA treatments in combination with modified atmosphere packaging (ambient air, 80:20:0/O2:CO2:N2 and 0.4:30:69.60/CO:CO2:N2 gas mixtures) on the survival of Salmonella Enteritidis in Turkish type meatballs stored at 4°C. Shelf-life of meatballs containing nisin and/or EDTA was extended compared to control. The efficient inhibition of Salmonella Enteritidis was enhanced with increasing concentrations of EDTA when applied together with nisin (1000 µg/g nisin and 50 mM EDTA). In conclusion, combined effects of nisin and EDTA incorporation with low level of CO packaging appears to be an important strategy to increase food safety; thus, this application can contribute to minimize the incidence of foodborne diseases originated from Salmonella spp.

More Than Bar Codes: Integrating Global Standards-Based Bar Code Technology Into National Health Information Systems in Ethiopia and Pakistan to Increase End-to-End Supply Chain Visibility.

The United Nations Population Fund (UNFPA) and the United States Agency for International Development (USAID) DELIVER PROJECT work together to strengthen public health commodity supply chains by standardizing bar coding under a single set of global standards. From 2015, UNFPA and USAID collaborated to pilot test how tracking and tracing of bar coded health products could be operationalized in the public health supply chains of Ethiopia and Pakistan and inform the ecosystem needed to begin full implementation. Pakistan had been using proprietary bar codes for inventory management of contraceptive supplies but transitioned to global standards-based bar codes during the pilot. The transition allowed Pakistan to leverage the original bar codes that were preprinted by global manufacturers as opposed to printing new bar codes at the central warehouse. However, barriers at lower service delivery levels prevented full realization of end-to-end data visibility. Key barriers at the district level were the lack of a digital inventory management system and absence of bar codes at the primary-level packaging level, such as single blister packs. The team in Ethiopia developed an open-sourced smartphone application that allowed the team to scan bar codes using the mobile phone's camera and to push the captured data to the country's data mart. Real-time tracking and tracing occurred from the central warehouse to the Addis Ababa distribution hub and to 2 health centers. These pilots demonstrated that standardized product identification and bar codes can significantly improve accuracy over manual stock counts while significantly streamlining the stock-taking process, resulting in efficiencies. The pilots also showed that bar coding technology by itself is not sufficient to ensure data visibility. Rather, by using global standards for identification and data capture of pharmaceuticals and medical devices, and integrating the data captured into national and global tracking systems, countries are able to lay the foundation for interoperability and ensure a harmonized language between global health stakeholders.

PENGARUH KEMASAN, KEWAJARAN HARGA DAN BRAND AWARENESS TERHADAP BRAND LOYALTY (STUDI KASUS PADA WISATAWAN NUSANTARA DI KARTIKA SARI BANDUNG)

The competition of pastry business especially in Bandung is in rapid progress. Kartika Sari is one of the popular pastries brand in Bandung. Kartika Sari’s pastry which is start from small medium enterprise has growth and well known by domestic tourist as one of the most wanted pastry in Bandung. One of the reason is because the owner start to apply the marketing elements correctly in their entrepeneurship. In other words, an integration between entrepreneurship and marketing (entrepreneurial marketing) has created an effectiveness in competition. However, the presence of competitors' brands with various packaging, heterogenous prices and different level of brand awareness could potentially affect the brand loyalty of domestic tourist to Kartika Sari’s pastry brand. The purpose of this study is to determine the impact of packaging, price fairness and brand awareness to brand loyalty toward domestic tourist at Kartika Sari Bandung. The grand theory that used for the basis research were packaging, price and brand. The research method was descriptive method with quantitative research that processed by the regression model analysis techniques. The population study was domestic tourist whom were shopping at Kartika Sari Bandung. The technique of collecting data using questionnaires that distributed to a sample of 150 domestic tourist and who meet the eligibility rate of questionnaires was 110. The results showed that the packaging, the price fairness and brand awareness have significant positive impact to brand loyalty whether in parsial or simultanously. It means more quality in packaging tend to increase the brand loyalty of domestic tourist to Kartika Sari, more fairness in price tend to increase the brand loyalty of domestic tourist to Kartika Sari and the higher of brand awarness, result higher brand loyalty.Keywords: packaging, price fairness, brand awareness and brand loyalty

Nucleosomes Regulate Base Excision Repair in Chromatin.

Chromatin is a significant barrier to many DNA damage response (DDR) factors, such as DNA repair enzymes, that process DNA lesions to reduce mutations and prevent cell death; yet, paradoxically, chromatin also has a critical role in many signaling pathways that regulate the DDR. The primary level of DNA packaging in chromatin is the nucleosome core particle (NCP), consisting of DNA wrapped around an octamer of the core histones H2A, H2B, H3 and H4. Here, we review recent studies characterizing how the packaging of DNA into nucleosomes modulates the activity of the base excision repair (BER) pathway and dictates BER subpathway choice. We also review new evidence indicating that the histone amino-terminal tails coordinately regulate multiple DDR pathways during the repair of alkylation damage in the budding yeast Saccharomyces cerevisiae.

New Method of Screening Out Outlier; Expanded Part Average Testing During Package Level Test

To achieve the automotive quality for semiconductor devices represented by “zero-defect,” part average testing (PAT) is actively applied to outgoing test. PAT has been generally used on wafer level test. This time we expanded it to package level test and established the method of detecting the characteristic variations and screening out the outliers. Moreover, we suggest a way of thinking about the outliers and consideration on the basis of the actual data analysis. We were especially conscious of the statistical meaning of the outliers which were detected. It has been demonstrated that the expanded PAT to package level test can reject the outliers of characteristics variation even within spec. The outliers in distribution of characteristic variations were detected by maintaining chip traceability. The new method can screen out outliers outside the 6-sigma within spec, and there was a clear inflection point between the distribution of the abnormal data and that of the population. It was assumed that hidden failure devices which had not been rejected as early failure were screened out. Detecting the outlier with the new method can reduce the failure rate to the target.

Experimental investigation on the thermal performance of Si micro-heat pipe with different cross-sections

Increasing component densities of the integrated circuit (IC) and packaging levels has led to thermal management problems. Si substrates with embedded micro-heat pipes (MHPs) couple good thermal characteristics and cost savings associated with IC batch processing. The thermal performance of MHP is intimately related to the cross-sectional geometry. Different cross-sections are designed in order to enhance the backflow of working fluid. In this experimental study, three different Si MHPs with same hydraulic diameter and various cross-sections are fabricated by micro-fabrication methods and tested under different conditions of fluid charge ratios. The results show that the trapezoidal MHP associated with rectangular artery which is charged with 40% of vapor chamber’s volume has the best thermal performance. This silicon-based MHP is a passive approach for thermal management, which could widen applications in the commercial electronics industry and LED lightings.

A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line

Abstract This paper describes a systematic approach to the identification of primary contributing factors to the Chip Package Interaction (CPI) risk and reveals the mitigation strategy successfully applied by GLOBALFOUNDRIES. The strategy includes modeling at bump and package level, gathering experimental data on blanket dielectric back end of line (BEoL) films, collecting data on wafer material with a complete BEoL stack, and finally using readouts on the package level. Advanced measurement methods generate data on the wafer level to achieve fast turn-around times. These methods include: (i) Dual-Cantilever Beam (DCB) test, (ii) Modified Edge Lift-off Test (MELT), (iii) Single Pillar Shear Test (SPST) and (iv) Bump Assisted BEoL Stability Indentation (BABSI) tests. The paper describes the methodology to gather data on the wafer level with a complete BEoL metallization stack that assesses the BEoL integrity. Furthermore, the package level thermomechanical modeling approach is discussed. The model has been used to determine the critical factors on BEoL stress/strain during the flip-chip assembly reflow processes. Silicon design-related factors in the BEoL that contribute to the risk for CPI related failures were investigated and options to reduce the CPI risk are discussed. Finally the paper reveals package level qualification data flip-chip CSP and wafer level packaging Fan-In for advanced technology nodes.

Surviving the Heat Wave – A presentation on thermally induced failures and reliability risks created by advancements in electronics technologies

Abstract Since the advent of surface mount technology back in the 1970's we, as an industry, have continually worked to miniaturize our products. This evolution of product design has impacted us at the semiconductor, package, circuit board and system levels. So, the question is, Why do Electronics Fail Under Thermal Cycling? At the semiconductor level, you can have issues with delamination, IC complexity, degradation mechanisms, associated ceramic capacitor wearout, and electrical overstress (EOS). At the package level issues with bond wires and stacked die add to the reliability impact. At the printed circuit board level issues with solder wearout, solder phase coarsening, PWB laminates and glass materials, plated through hole (PTH) fatigue, and the impact of potting can also affect reliability while at the system level, heat sinks and other methods of heat removal can improve the situation. What drives these issues is that we use a variety of materials e.g. semiconductors, ceramics, metals and polymers. We then bond them together with other materials like solder and adhesives. Each of these materials has a Coefficient of Thermal Expansion (CTE) that is unique and therefore expands and contracts at different rates.

A high-efficiency low-voltage class-E PA for IoT applications in sub-1 GHz frequency range**Project supported by the National Natural Science Foundation of China (No. 61574125) and the Industry Innovation Project of Suzhou City of China (No. SYG201641).

We present and propose a complete and iterative integrated-circuit and electro-magnetic (EM) co-design methodology and procedure for a low-voltage sub-1 GHz class-E PA. The presented class-E PA consists of the on-chip power transistor, the on-chip gate driving circuits, the off-chip tunable LC load network and the off-chip LC ladder low pass filter. The design methodology includes an explicit design equation based circuit components values' analysis and numerical derivation, output power targeted transistor size and low pass filter design, and power efficiency oriented design optimization. The proposed design procedure includes the power efficiency oriented LC network tuning, the detailed circuit/EM co-simulation plan on integrated circuit level, package level and PCB level to ensure an accurate simulation to measurement match and first pass design success. The proposed PA is targeted to achieve more than 15 dBm output power delivery and 40% power efficiency at 433 MHz frequency band with 1.5 V low voltage supply. The LC load network is designed to be off-chip for the purpose of easy tuning and optimization. The same circuit can be extended to all sub-1 GHz applications with the same tuning and optimization on the load network at different frequencies. The amplifier is implemented in 0.13 μm CMOS technology with a core area occupation of 400 μm by 300 μm. Measurement results showed that it provided power delivery of 16.42 dBm at antenna with efficiency of 40.6%. A harmonics suppression of 44 dBc is achieved, making it suitable for massive deployment of IoT devices.

Packaging Challenges for the Next Generation of Mobile Devices

Changes in board technology, denser packaging due to board size limitations, and phone thickness trends pose number of technical challenges for designing IC packages for mobile applications. While thin packages are required to meet height constraints requirements, room temperature co-planarity and high temperature warpage become critical issues for packages with thin substrate, die, and mold cap. Similarly, while PoP provides numerous benefits from size and business standpoint; heat dissipation and thickness constraints requires continuous development of new packaging technologies. In addition, changes in board behavior is affecting the overall stress equation, making Chip-Package-Board interaction very important when deciding chip and package level interconnections. This presentation will highlight some of these challenges and identify technology innovations in areas such as System in Package (SIP) to mitigating these factors while simplifying supply chain and improving overall time to market.

Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses

Abstract Delamination at the mold compound and leadframe interface is the most common failure mode observed during processing and qualification of the microelectronic package. Mold compound to leadframe delamination is typically observed after environmental reliability stresses like: moisture preconditioning and reflow, air-to-air thermal cycling, biased highly accelerated stress etc. Leadframe based packages constitutes majority of microelectronic packages that are manufactured today, which makes mold compound/leadframe interface of great interest requiring thorough understanding of the adhesion characteristics and its evolution as a function of reliability stresses. This study used four-point bend testing to evaluate the adhesion strength of commercially available mold compound to bare copper and silver plated copper leadframes exposed to automotive grade environmental stresses. Results show that adhesion of mold compound to silver plated leadframes is significantly lower than adhesion to bare copper leadframes. Results obtained from this study can be used to carefully select the qualification reliability stresses to prevent overstressing the package and causing failures related to wire bond cracking, delamination etc., which have significant time and cost implications. Finite element simulations were also performed to validate the empirical adhesion test results and can be extended to full package level models to enable delamination prediction.

Package-Level Reconfiguration of RF Matching Networks Using SMD Components

Digital power amplifiers provide an unprecedented level of flexibility in their ability to operate on different signals using simple reprogramming of the digital signal processing, but their output matching networks must be redesigned for different frequency bands. This involves a redesign of part of the back-end-of-line mask set at a great cost. We present a package-level reconfiguration technique that allows a single transmitter to be reconfigured for multiple frequency bands, or different output power levels by soldering different surface mount device (SMD) components directly to the surface of the die, saving design and fabrication cost while delivering similar performance. We demonstrate the technique on a multiphase transmitter IC, showing optimized operation at three different frequencies using soldered SMD components to reconfigure the matching network of the IC at the package level. The transmitter’s linearity and performance are validated using a 5-MHz, 64-QAM LTE signal.

An efficient reliability testing method combined with thermal performance monitoring

Die attach delamination in power electronic devices is a common failure mode besides bond wire damage. This paper describes the chip and packaging level effects of a newly developed power cycling test on novel mid-power automotive MOSFETs. The introduced method was pilot tested with our new approach, using a recently developed test environment. The idea was to combine the existent guidelines of the most relevant semiconductor characterization and cycling standards while saving time and resources during testing. Thermal transient measurements during the actively mimicked temperature cycling reliability test were evaluated along with K-factor calibration to identify different failure modes. This approach allows distinguishing between electrical and thermal related structural failure modes. The major target was to test the reliability of a new thermal interface material which was used in the MOSFETs under test. We found that the new material was able to withstand the 150°C temperature amplitude beyond 100,000cycles without critical failures. The changes of the thermal performance of the complete assembly were tracked from the pre-stress state until a sample reached critical condition.

AN EFFICIENT APPROACH OF REGRESSION TESTING USING HIERARCHICAL DECOMPOSITION SLICING

The purpose of regression testing is to ensure that bug fixes and new functionality introduced in a new version of a software do not adversely affect the correct functionality inherited from the previous version. I have proposed a new slicing method to decompose a Java program into affected packages, classes, methods and statements identified with respect to the modification made in the program.Because java program has hierarchical characteristics(Package/Class/Method), this decomposition is based on this characteristic. I also have proposed an intermediate representation for Java programs that shows Package Level, Class Level, and Method Level Dependency. I have named this intermediate representation as Program Dependency Tree(PDT). This PDT is used to identify the program parts that are possibly affected by the change made to the program. With the help of PDT, we can obtain program slices. The packages, classes, methods, and statements thus affected are identified by traversing the Program Dependency Tree. The proposed approach maps the decomposed slice (comprising of the affected program parts) with the coverage information of the existing test suite to select the appropriate test cases for regression testing.

Capturing knowledge from lessons learned at the work package level in project engineering teams

PurposeThe purpose of this paper is to describe the knowledge management (KM) loop process in a work package (WP)-based project engineering management method. The purpose of the KM loop is the routine capture of learnings to improve work practices in both the project and the firm.Design/methodology/approachA conceptual model for a project KM loop is developed by researching various KM theories found in the literature and incorporating the most applicable concepts and bridging any gaps in an attempt to overcome the reported impediments to learning in projects. A specific WP-based project engineering method (the STBQ method) is chosen as the framework for illustrating the workings and advantages of the KM loop. The author’s experiential judgement is used in applying selected academic concepts to create a KM process particularly useful for consulting engineering firms engaged in the detailed design phase of heavy industrial projects notwithstanding the fact that it may be beneficial in other project environments.FindingsCompletion of a WP can be used as a natural point in time for the collection of lessons learned (LL). At post-WP debriefing meetings, intuitive learnings can be contributed by individuals and interpreted in the context of the recently completed WP. When seen to be applicable, the project engineer integrates this newly gained experiential knowledge into the project’s job instructions for immediate implementation on other WPs remaining in the project scope. Through the project manager, these new or revised job instructions are proposed as candidates for new or revised standard practices to the senior managers of the engineering firm who can institutionalize them by approval for use in other in-progress or future projects.Research limitations/implicationsThe KM loop described here is specifically intended to be used with the STBQ method where the 100 per cent rule is applied and where each WP sub-team is tasked with the delivery of their WP safely, on-time, on-budget and with no quality deficiencies as the criteria for success of their WP. A research limitation is that capturing learnings throughout the project does not solve the problem of capturing post-project learnings from design errors surfacing during construction, in commissioning, or after start-up during on-going operations and maintenance. Nonetheless, innovative ideas and improvements can be found during the detailed engineering phase and the KM loop captures these for intra-project and inter-project use.Practical implicationsThe extra effort of decomposing requirements into WPs not only helps control project costs, schedule, quality and safety but also provides an effective way to capture knowledge from project learnings for intra-project and inter-project use.Social implicationsThe lessons-learned sessions held at the completion of each WP provides an opportunity to provide motivation and morale boosting to the WP sub-team members.Originality/valueThis paper contributes what is believed to be the first WP-based KM loop in project engineering management using a specific application of the 4I framework of organizational learning. In addition, when applied in the STBQ method or any other method that uses interim WPs for both planning and reporting, the LL sessions can be pre-scheduled and budgeted separately from the subject WP. This helps to overcome the problem widely reported in projects that not enough calendar time or person-hours can be spared to attend the LL sessions.

Nonlinear conductivity in silicon nitride

To better comprehend electrical silicon-package interaction in high voltage applications requires full characterization of the electrical properties of dielectric materials employed in wafer and package level design. Not only the packaging but wafer level dielectrics, i.e. passivation layers, would experience high electric fields generated by the voltage applied pads. In addition the interface between the passivation layer and a mold compound might develop space charge because of the mismatch in electrical properties of the materials. In this contribution electrical properties of a thin silicon nitride (Si3N4) dielectric is reported as a function of temperature and electric field. The measured values later analyzed using different temperature dependent exponential expressions and found that the Mott variable range hopping conduction model was successful to express the data. A full temperature/electric field dependency of conductivity is generated. It was found that the conduction in Si3N4 could be expressed like a field ionization or Fowler-Nordheim mechanism.

All in, one-at-a-time or somewhere in the middle? Leveraging the composition and size of the negotiating package

PurposeWhile industrial marketers have long bundled their products and services to sell them as packages, to what extent should negotiators also rely on packaging their offers? Clearly, negotiating at a package level can tax the cognitive capacity of the involved parties at some point. Therefore, this study aims to analyze the impact of the number and type of issues that should be negotiated simultaneously to leverage the package strategy efficiently and effectively in multi-issue buyer-seller negotiations.Design/methodology/approachThe authors conducted and analyzed negotiation simulations with 676 students from 2 public universities.FindingsThe authors’ results suggest that negotiating three out of six issues simultaneously is the least efficient but most effective strategy in multi-issue buyer-seller negotiations. Moreover, they found that bundling distributive and integrative issues is more efficient and effective than only bundling distributive or integrative negotiation issues in a package offer.Originality/valuePast research has examined the impact of negotiating a package as compared to each issue separately; however, little empirical attention has been directed toward understanding how to apply a package strategy in complex multi-issue negotiations.