Package Layout Research Articles

운전자 정적 거동 특성을 이용한 차량 패키지 개선용 등가 인지지도 개발

This study was aimed at developing I) iso-perception maps for various groups of drivers in terms of age, gender, and anthropometry and 2) the experiment framework required for obtaining subjective and objective measures. A total of 9 maps, which describe drivers' perceptions regarding their static behaviors inside a typical mid-size sedan, can be used to improve the utilization of the limited driver workspace, and to select better design altematives for occupant packaging. An adjustable seating buck, a<SUP>***</SUP>-camera motion capture system (Vicon), and a<SUP>**</SUP>-chmmel EMG system were used for the experiment. Each iso-perception map was developed while H-PT, steering wheel center, or TGS knob center was moved to each of pre-defined positions relative to driver-selected positions. Adjustable ranges or positions of the seat, steering wheel, and TGS lever described in iso-perception maps can be used to detennine better package layout altematives.

Fabrication and thermal optimization of LED solar cell simulator

This paper describes fabrication and characterization of a solar simulator which utilizes light emitting diode (LED) as a lighting source. A solar cell powered by the LED simulator with 0.9 sun exhibited about 80% of the output power generated by the conventional Xenon lamp simulator with 1 sun. Measured temperatures for the surface of lens and fin of heat sink were in good agreement with the calculated values. Detailed thermal performance of the LED lighting was projected using a computational fluid dynamics (CFD) method for the various design parameters such as layout of the LED package and number of fins of the heat sink. It was demonstrated that the junction temperature of the LED module can be significantly decreased by optimization of the parameters.

Integrated optical and electronic interconnect printed circuit board manufacturing

PurposeTo introduce the Innovative Electronics Manufacturing Research Centre Flagship Project: Integrated Optical and Electronic Interconnect PCB Manufacturing, its objectives, its consortium of three universities and ten companies and to describe the university research being carried out. This paper briefly reviews the motivation for developing novel polymer formulations, fabrication techniques, layout design rules and characterisation techniques for hybrid electronic and optical printed circuit boards (PCBs) using multimode polymer optical waveguide interconnects.Design/methodology/approachThe authors are investigating a number of different fabrication techniques which they compare with each other and with modelled calculations of waveguide components. The fabrication techniques include photolithography, laser ablation, direct laser writing, embossing, extrusion and ink jet printing.FindingsA number of design rules for polymer multimode waveguides have been found and published. Techniques for ink jetting polymer to print waveguides and laser ablation techniques have been developed. New formulations of polymer which cure faster for direct writing have also been developed.Research limitations/implicationsFurther work is needed to thicken the ink jet printed polymer and to investigate side wall roughness of the ablated waveguides and development of new polymer formulations for dry film. Further research is also needed on construction of prototype system demonstrators.Practical implicationsThe fabrication techniques being developed are designed to be transferred to industrial PCB manufacturers to enable them to make higher value optical PCBs. The design rules being discovered are being entered into commercial PCB layout software to aid designers of optical PCBs.Originality/valueThe paper is of interest to PCB manufacturers who wish to upgrade their processes to be able to manufacture optical PCBs. The university research is original and some has been published as shown in the publications in the reference list.

자동차 설계를 위한 한국인 3차원 표준 형상의 선정

The purpose of this study is to extract typical body shapes of Korean adults based on the three-dimensional Korean anthropometric data measured through 5<SUP>th</SUP> national anthropometric survey and to examine the suitability of the 3-D human shape data for the interior packaging. 36 three-dimensional anthropometric variables related to the design of vehicle interior were considered for the appraisal of typical body shapes. Four major factors were extracted by the factor analysis and factor scores were calculated for all subjects. Typical or standard drivers of Korean adults were selected by the minimum deviation criteria for the four factor scores with respect to 5<SUP>th</SUP>, 50<SUP>th</SUP>, and 95<SUP>th</SUP> percentiles, respectively. Typical drivers of Korean adults were visualized by the CATIA-HUMAN program due to the absence of proper application software for three-dimensionally scanned human body data. There are considerable differences between the anthropometric data of Korean adults and those provided by CATIA-HUMAN program, which shows that the modeling data provided by CATIA-HUMAN should not be directly applied to the ergonomic evaluation for the vehicle design. This suggests the necessity for the development of suitable software for scanned human shape data. It is also expected that the anthropometric data of typical drivers extracted from this study help design package layouts and improve the suitability of ergonomic evaluation for Korean customers.

다변량 통계기법을 활용한 표준 운전자세의 도출

The package layout of a vehicle is very important to the driver's postural comfort. It considers human body characteristics of drivers and passengers, and uses the anthropometric data on driver's posture. Especially, since the human bodies were scanned in Size Korea project, three-dimensional human shape data have been considered the useful data in vehicle design stage. The proper driver's postural data are necessary in order to apply three-dimensional human data or ergonomic human models to package layout. Traditional postural data were provided to each joint angle individually, such as elbow angle, shoulder angle, hip angle, and knee angle. However, it is not appropriate to account for the human posture because the limbs move in coupled with each other. In the study, some whole-body posture were derived by multivariate statistical analysis to develop driver's standard posture, which may be used for reference data in application of human model software or human shape data in CAD environment. From the clustering analysis five whole-body postures were classified for the driver's representative posture. This study demonstrates that the combination of the most frequent angles of each joint can not explain the driver's actual posture in car, and that the joint angles must be considered together as a whole-body posture. It is expected that this study is helpful for the package layout designer to understand the driver's posture and to apply the human shape data to vehicle design.

A Mixed Integer Programming Model to Modify a Block Layout for Obtaining Smooth Material Flow Paths

The conceptual block layouts generated by layout software packages very often yield detailed layouts with non-smooth material flow paths that have an excessive number of turns. Such non-smooth flow paths are not acceptable or feasible for actual construction. The automatically generated block layouts almost always have to be adjusted by layout design engineer in a labor intensive process. This paper presents a mixed integer programming model to modify a given block layout into a layout that allows the construction of smooth flow paths, while preserving the relative positions of the departments in the original block layout. Results of the computational experiments show that much smoother flow paths can be generated in the modified block layouts than those in the original block layouts. The suggested model can be solved within short computational time even for large industrial-sized block layout problems and can be executed without human intervention.

3-D Korean Body Typing for Vehicle Interior Design

The purpose of the study is to extract typical body shapes of Koreans based on their three-dimensional anthropometric data measured through 5th national anthropometric survey known as SizeKorea and to examine the suitability of the 3D human shape data for vehicle interior packaging. 36 three-dimensional anthropometric variables that are related to the interior design of vehicles were considered for the generation of typical body shapes. Major factors were extracted by the factor analysis and factor scores were calculated for all subjects with respect to age groups and gender. Typical or standard drivers of Korean, who must be tested for the suitability of design during the design process, were selected by the minimum deviation criteria for the major factor scores with respect to 5th, 50th, and 95th percentiles, respectively. Since human models such as HUMAN are frequently used in vehicle design, it is of great importance to make sure that its dimensions conform to those of real Korean drivers. There exist critical differences between selected anthropometric data of Korean and modeling data provided by HUMAN. This suggests that comparative research about these differences need to be undertaken and any modeling data provided by computer human models should not be applied to the ergonomic evaluation for the vehicle design without a careful review. It is also expected that anthropometric data of a set of typical drivers extracted from the study help designers conduct package layouts and improve the suitability of ergonomic evaluation for Korean customers.

Reviews: Real-PCB

Real-PCB is a schools level PCB layout software, from the makers of Easy-PC and distributed by Crocodile Clips. It is generally very user-friendly and good value for money. It works well, is reasonably easy to navigate and largely does what it says on the tin.

A review of different approaches to the facility layout problems

Here, an attempt is made to present a state-of-the-art review of papers on facility layout problems. This paper aims to deal with the current and future trends of research on facility layout problems based on previous research including formulations, solution methodologies and development of various software packages. New developments of various techniques provide a perspective of the future research in facility layout problems. A trend toward multi-objective approaches, developing facility layout software using meta-heuristics such as simulated annealing (SA), genetic algorithm (GA) and concurrent engineering to facility layout is observed.

Nevermoreprint

Nevermoreprint

Development of a hierarchical estimation method for anthropometric variables

Most regression models of anthropometric variables use stature and/or weight as regressors; however, these ‘flat’ regression models can produce large errors in estimation for anthropometric variables having low correlations with the regressors. A novel method was proposed which estimates anthropometric variables in a hierarchical manner based on the geometric and statistical relationships between the variables. This hierarchical estimation method first constructs estimation structures by analyzing the dimensional characteristics and geometric relationships of the anthropometric variables and then develops regression models based on the estimation structures. The hierarchical estimation method was applied to 60 anthropometric variables (selected for the design of an occupant package layout in a passenger car) by using the 1988 US Army anthropometric survey data. The hierarchical regression models showed a 55% increase in adjusted R 2 and a 31% decrease in SE on average when compared with corresponding flat regression models. Relevance to industry Regression models of anthropometric variables are of use in ergonomic design of products and workplaces when necessary body measurements are unavailable. The proposed hierarchical estimation method can be applied effectively to establish regression models of anthropometric variables, which have better statistical performance and geometrical meaning.

Development of a Hierarchical Estimation Method for Anthropometric Variables

Most regression models of anthropometric variables use stature and/or weight as regressors; however, these ‘flat’ regression models result in large errors for anthropometric variables having low correlations with the regressors. For better accuracy in estimating anthropometric variables, this study proposed a method to estimate anthropometric variables in a hierarchical manner based on the geometric and statistical relationships among the variables. By applying the proposed approach to 60 anthropometric variables selected for the design of an occupant package layout in a passenger car, hierarchical estimation structures were constructed and then based on the estimation structures hierarchical regression models were developed with the 1988 US Army anthropometric survey data. The hierarchical regression models were compared with the corresponding flat regression models in terms of adjusted R2 and SE, resulting in on average a 55% increase in adjusted R2 and a 31% decrease in SE when compared to the corresponding flat models.

STS-768 multiplexer with full-rate output data retimer in InP HBT

A 16:1 STS-768 multiplexer IC has been designed and fabricated using the Vitesse Semiconductor VIP-1 process. This IC is part of a complete chip-set solution for a 40-Gb/s STS-768 optical communication transceiver module. The multiplexer IC features a full-rate clock multiplication unit and a data retimer in the output stage to reduce duty-cycle distortion and jitter in the output data eye. Because of its strict timing requirements, this approach needs fast logic gates with a very low gate delay. The Vitesse VIP-1 process, with 150-GHz f/sub t/ and 150-GHz f/sub max/ heterojunction bipolar transistor, is an obvious choice to implement this IC. The multiplexer IC typically dissipates 3.6 W from -3.6-V and -5.2-V power supplies. This paper discusses the design and development of a 40-Gb/s 16:1 multiplexer IC including current-mode logic gate circuit design, divide-by-two, 40-GHz clock tree, voltage-controlled oscillator, clock multiplication unit, and output driver. Layout design and package design are also discussed due to their significant roles in the IC performance.

Forward Kinematics 모델을 이용한 자동차 운전공간의 설계

This research suggested the mathematical model (forward kinematics method) to provide the reference points of driver space more easily and accurately in designing the package layout of vehicle interiors. For this purpose. the lengths of body segments of drivers and various joint angles occurred while driving were used. The length data between joints for the mathematical model were extracted from SAFEWORK?? as well as 95th percentile male and 5th percentile female body dimensions were utilized. In addition, the angles of body segments were applied on its diverse values within proper ranges in order to compare them each other. The mathematical model in this study was based on the concept of converting polar coordinate system to Cartesian coordinate system so that reference points of driver space were acquired in Cartesian coordinate system after using the segment lengths of drivers and the joint angles of driving postures as an input of polar coordinate system. It is expected that reference points of driver space obtained from this research are helpful to the study on package layout that is appropriate for physical characteristics of drivers.

New Tools for Vehicle Interior Design

Research over the past decade has led to the development of a new, integrated suite of tools for vehicle interior design. These tools are based on posture and position data collected from hundreds of drivers and passengers in dozens of vehicles driven on-road, as well as data from laboratory studies with reconfigurable vehicle mockups. The tools include (1) a new H-point machine and associated CAD tool for use in seat design and vehicle package layout; (2) a model of driver-selected seat position; (3) a new eyellipse describing the distribution of driver and passenger eye locations; (4) three-dimensional contours describing occupant head locations; and (5) whole-body posture-prediction methods for use with human figure models. This paper describes these new tools in the context of the design and development of a passenger car interior.

Toward re-engineering models and algorithms of facility layout

Models and algorithms are continuously being developed for the facility layout problem in various manufacturing settings. However, there could be practices and obstacles that weaken them and adversely impact the effectiveness of the layout. Thus, they should be obliterated in order to advance the layout problem. This paper suggests a set of guidelines that are directed at the process inherent in developing layout models, algorithms, expert systems, and software applications to assist in improving them and developing better layouts. Such guidelines are lacking in the literature of facility layout. Examples on the suitability and applicability of the suggested guidelines are given.

Thermal management of power electronics modules packaged by a stacked-plate technique

The research presented in this paper is part of a multidisciplinary research program of the Center for Power Electronics Systems at Virginia Tech. The program supported by the Office of Naval Research focuses on the development of innovative technologies for packaging power electronics building blocks. The primary objective of this research is to improve package performance and reliability through thermal management, i.e., reducing device temperatures for a given power level. The task of thermal management involves considering trade-offs in the electrical design, package layout and geometry, materials selection and processing, manufacturing feasibility, and production cost. Based on the electrical design of a simple building block, samples of packaged modules, rated at 600 V and 3.3 kW, were fabricated using a stacked-plate technique, termed metal posts interconnected parallel plate structure (MPIPPS). The MPIPPS technique allows the power devices to be interconnected between two direct-bond copper substrates via the use of metal posts. Thermal modeling results on the MPIPPS packaged modules indicate that the new packaging technique offers a superior thermal management means for packaging power electronics modules.

A neuro-based expert system for facility layout construction

Motivated by the success of implementing expert systems (ESs) based on artificial neural networks (ANNs) to improved classical rule-based expert systems (RBESs), this paper reports on the development of a neuro-based expert system (NBES) for facility layout construction in a manufacturing system. In an artificial intelligence (AI) technique such as the NBES, the semantic structure of If-Then rules is preserved, while incorporating the learning capability of ANNs into the inference mechanism. Unlike implementing a popular back propagation network (BPN) as an ES, the proposed BAMFLO (Bidirectional Associative Memories for Facility LayOut) system is an intelligent layout consultant system consisting of pipeline BAM neural networks with simple, fast incremental learning and multiple bidirectional generalization characteristics. This incrementability makes BAMFLO effective at acquiring, adding or adapting learned layout knowledge; thus it is possible to memorize newly extended If-Then layout rules without retraining old ones. The multi-bidirectionality gives BAMFLO the ability to quickly and reliably generalize a layout solution, and to further infer unknown facts from known facts through a complex knowledge base (memorization) without losing information. The solution process of BAMFLO contains three essential steps: training example generation, incremental learning and solution generalization. The examples (layout knowledge) can be generated from practical experience and/or classical layout software solutions for incrementally training BAMFLO; the process then derives multiply bidirectionally generalized construction layout solutions. The experimental results show that the BAMFLO scheme outperforms five classical layout methods used to generate training examples.

FINITE ELEMENT MODELING OF HEAT TRANSFER IN CHIP ON TAPE PACKAGES

In the electronic industry, numerical modeling using the finite element method (FEM), is an effective way to predict thermal performance of ICs in the initial stage of package development. Moreover, thermal simulation can provide a greater understanding of the physics of the problem, allowing designs to be optimized quickly and cheaply, thereby keeping expensive experimental measurements to a minimum. In this study, 3-D thermal models capturing the details of the leadframe and internal structure of the chip on tape (COT) packages was developed using a commercial FEM simulation code MARC. Finite element model results of thermal performance of COT packages under various specified external flow conditions and power dissipation are presented. Steady state numerical calculations were performed to determine the junction temperature and thermal resistance of complex COT packages. The complex heat flow patterns within the 3-D packages were established and compared with the experimental results.7,8 Moreover, the effect of package layout, die attach materials, and COT leadframe materials on the thermal performance of COT packages were studied. The results show that the addition of die attach material in COT packages enhance the heat transfer from the die, especially with the help of the spreader on the substrate. The use of with die attach materials higher thermal conductivity and leadframe also significantly contributed to enhanced thermal performance. Finally, the heat dissipation of COT packages was also found to be affected by the circuit contents on the FR-4 board (substrate).

Transformation to lean manufacturing by an automotive component supplier

Delphi Chassis Systems established a Manufacturing Systems Core Team to develop a production system for automotive component applications. The production system will provide the foundation required for manufacturing to exceed any customer requirement. In order to accomplish the development of a production system, global best practices had to be benchmarked and implemented in a pilot manufacturing area. The Livonia Modular Strut Department was named the Manufacturing Systems Pilot Area in order to insource the production in one month. The production system concepts of Project Management, Process Flow, Layout, Material Flow, Ergonomics, Workplace Organization, People-focused Practices, and Supporting Software Development were all integrated as a whole system in the Livonia Modular Strut insourcing project. These techniques enabled the Core Team to implement a competitive manufacturing system, using the specified monorail delivery system, in an extremely short period of time. The new production system was 25% more productive than the original build cell production method. The proposed modifications will allow a 50 % production improvement to the current monorail system.