Antenna-in-package Research Articles

A Compact Ka-Band Active Integrated Antenna With a GaAs Amplifier in a Ceramic Package

This letter presents the design of a Ka-band active integrated antenna in package (AIAiP). A monolithic microwave integrated circuit amplifier based on the GaAs process and a compact patch antenna based on the printed circuit board process are implemented, respectively. Then, the amplifier and antenna are assembled together in a specified package using the wire-bond process. Thus, compared to the traditional solutions, the transmission loss and the size of the proposed AIAiP are significantly reduced. Furthermore, the influence of the bonding wire and the package is taken into account in the design of the amplifier and the antenna, respectively. A good agreement between the simulation and measurement results can be observed. The proposed AIAiP occupies a compact size of 7 × 7 mm2. Meanwhile, it achieves −10-dB impedance bandwidth from 33.4 to 37.2 GHz and a peak gain of 18.9 dBi at 35 GHz. Additionally, the impact of the package size on the antenna performance has been demonstrated for future AIA designers.

Low‐cost, compact millimeter‐wave antenna‐in‐package for short‐range wireless communications

ABSTRACTThis article presents a low‐cost, compact millimeter‐wave antenna‐in‐package (AiP) for short‐range wireless communications. The antenna is based on a Yagi‐Uda antenna for high gain and end‐fire radiation and is implemented on a single dielectric layer using a truncated printed circuit board. Integrated with a CMOS transceiver chip, the AiP provides a low‐cost, compact, and robust design. The antenna comprises a microstrip‐to‐coplanar strip line transition, driver, reflector, and director. The fabricated antenna and AiP have dimensions of 6 mm × 5.5 mm × 0.13 mm and 6 mm × 7.2 mm × 0.13 mm, respectively. The antenna has measured beamwidths of 68° (E‐plane) and 105° (H‐plane) and a gain of 6.6 dBi at 60 GHz, while the fabricated AiP achieved a 10.7‐Gb/s wireless data transmission rate over 5 cm at a bit‐error rate of less than 10−12. © 2016 Wiley Periodicals, Inc. Microwave Opt Technol Lett 59:329–333, 2017

A Highly Integrated 60 GHz 6-Channel Transceiver With Antenna in Package for Smart Sensing and Short-Range Communications

This work presents a highly integrated 57–64 GHz 4-channel receiver 2-channel transmitter chip targeting short range sensing and large bandwidth communications. The chip is housed in an embedded wafer level ball grid array package. The package includes 6 integrated patch antennas realized with a metal redistribution layer. The receiver patch antennas have a combined antenna gain of $\approx 10$ dBi while each transmitter antenna has a gain of $\approx ~6$ dBi. The chip features a wide tuning range integrated VCO with a measured phase noise lower than −80 dBc/Hz at 100 kHz offset. Each of the differential transmitter channels shows a measured output power of 2–5 dBm over the complete frequency range. In addition, one transmitter channel features a modulator that can be digitally programmed to operate in either radar or communication mode. Each of the receiver channels has a measured conversion gain of 19 dB, a single-sideband noise figure of less than 10 dB and an input referred 1 dB compression point of less than 10 dBm. With all channels turned on the chip consumes a current of 300 mA from a 3.3 V supply. The functionality of the chip is demonstrated for both sensing and short range wireless communications.

Metamaterial Antennae: Functionalized Metamaterials Enable Frequency and Polarization Agility in a Miniaturized Lightweight Antenna Package (Adv. Electron. Mater. 2/2016)

Metamaterial Antennae: Functionalized Metamaterials Enable Frequency and Polarization Agility in a Miniaturized Lightweight Antenna Package (Adv. Electron. Mater. 2/2016)

Functionalized Metamaterials Enable Frequency and Polarization Agility in a Miniaturized Lightweight Antenna Package

Electromagnetic metamaterials share a perceived disadvantage with miniature radio communication antennas: limited operating bandwidths. In conventional radio systems, tuning has been confined to the radio, requiring broadband antennas and materials. With the advent of software defined and digital radios, adding the antenna into the plethora of tunable radio subsystems can become a reasonable proposition, allowing miniaturized antennas with narrow instantaneous (channel) bandwidths to be tuned across entire communications bands, depending on the channel in use. Moreover, the antenna will provide an effective filtering stage before the signal reaches the radio. The tunable metamaterial presented herein enables an antenna showcasing this functionality and more. Dramatic size reductions are made possible by a tunable, lightweight, miniaturized metamaterial. Tuning the metamaterial and antenna in tandem provides a dynamic operating channel, with a tunable, nearly arbitrary polarization response as an added benefit. Finally, this antenna provides one of the first examples in the literature of a practical device improved by functionalized metamaterials, which has been tested on a real‐world platform.

A Switchable 3-D-Coverage-Phased Array Antenna Package for 5G Mobile Terminals

This letter proposes a new design of millimeter-wave (mm-Wave) array antenna package with beam steering characteristic for the fifth-generation (5G) mobile applications. In order to achieve a broad three-dimensional scanning coverage of the space with high-gain beams, three identical subarrays of patch antennas have been compactly arranged along the edge region of the mobile phone printed circuit board (PCB) to form the antenna package. By switching the feeding to one of the subarrays, the desired direction of coverage can be achieved. The proposed design has >10-dB gain in the upper spherical space, good directivity, and efficiency, which is suitable for 5G mobile communications. In addition, the impact of the user's hand on the antenna performance has been investigated.

A D-Band Micromachined End-Fire Antenna in 130-nm SiGe BiCMOS Technology

The design of a radiation-efficient D-band end-fire on-chip antenna utilizing a localized back-side etching (LBE) technique, as well as an antenna-in-package (AiP) on a low-cost organic substrate, is presented. Quasi-Yagi-Uda antennas are chosen for end-fire radiation because of their compact size. The on-chip antenna is realized in the back-end of the line (BEOL) process of a 130-nm SiGe BiCMOS technology, whereas the in-package antenna is realized in liquid crystal polymer (LCP) technology for comparison. The on-chip antenna design is optimized to meet both process reliability specifications and radiation performance, and corresponding design guidelines are provided. The fabricated on-chip antennas show the state-of-the-art performance with a peak gain of 4.7 dBi, simulated radiation efficiency of 82%, and measured radiation efficiency of 72%-76% using the gain/directivity (G/D) and wheeler-cap methods at 143 GHz. The antenna demonstrates a 3-dB gain bandwidth of more than 30 GHz and 10-dB impedance bandwidth greater than 20 GHz (14% impedance bandwidth). The measurements of the on-package end-fire antenna showed very comparable results with a peak measured gain of 6 dBi and a simulated and measured radiation efficiency of 92% and 86% at 143 GHz. These results demonstrate that highly efficient on-chip end-fire antenna implementation is possible in standard commercially available BiCMOS process.

MIMO Antenna Design in Thin-Film Integrated Passive Device

This paper presents a novel approach to construct a multiple-input multiple-output (MIMO) antenna in a small package based on integrated passive device (IPD) manufacturing technology. Such an IPD utilizes a thin-film glass substrate that yields a low loss performance for RF components. A thin film process with limited layers available and size considerations in IPD manufacturing pose major challenges in antenna design, especially for multiple antennas. This thin-film process results in a high cavity quality factor (Q) causing a narrowband in the conventional patch antenna. To overcome this problem, this paper develops antenna elements that incorporate a T-shaped coupling fed driven strip and a loop structure. The gap between the driven strip and the loop structure functions as an internal tuning circuit, thus contributing to a lower overall Q and antenna miniaturization. The size of the proposed antenna element is only 1.8 × 0.65 mm2 (0.031 λ0×0.011 λ0) in the IPD size of 4 × 4 mm2 (0.068 λ0×0.068 λ0). The experimental results indicate that the antenna achieves a gain of 1.4 dBi and a radiation efficiency of 60% over the IEEE 802.11a band (5.15-5.825 GHz). In addition, the multiple antenna elements are arranged to construct a MIMO system. Furthermore, a good isolation is achieved using a space of only 0.3 mm (0.005 λ) spacing between two antennas, resulting in a compact design and small package (4 × 4 × 0.25 mm3). The parameters are also investigated in detail, with the experimental results correlating well with the simulation results.

A Delta–Sigma modulator-based heterodyne FMCW radar for short-range applications

We present a heterodyne frequency-modulated continuous-wave (FMCW) radar, applicable in short-range applications. Owing to a modulation of the transmit (TX) signal, the intermediate frequency (IF) signal can be shifted away from zero frequency to reduce the influence of dc-offsets and low-frequency disturbances like, e.g. flicker noise existing in components like mixers, amplifiers and analog-to-digital converters. The presented system is based on E-band transceivers realized in SiGe technology, which are fully integrated with antennas in a plastic package. A sinusoidal modulation of the TX signal is realized by a binary phase-shift keying modulator, which is controlled by a Delta–Sigma sequence. The choice of a sinusoidal modulation allows to reuse signal processing blocks which are typically available in FMCW radars. Measurements show that the achievable signal-to-noise ratio is comparable to a homodyne realization since the Delta–Sigma noise can be filtered in the IF stage. Experiments with a bandwidth of 8 GHz demonstrate measurements down to 12 cm with standard deviations of the measured ranges lower than 60 µm. Compared to a homodyne realization the blocking distance could be reduced by approximately 40 mm.

Antenna-in-package (AiP) in mm-wave band – ERRATUM

Antenna-in-package (AiP) in mm-wave band – ERRATUM

Self-Shielded Circularly Polarized Antenna-in-Package Based on Quarter Mode Substrate Integrated Waveguide Subarray

A self-shielded antenna-in-package (AiP) covering IEEE 802.11a band is proposed in this paper, and the antenna is designed using quarter mode substrate integrated waveguide (QMSIW) subarray technology. Electromagnetic interference (EMI) in a system-in-package integrated with AiP is discussed firstly. Electric field distribution of the proposed AiP is simulated, and it shows that the metallic via-holes array in the QMSIW subarray approximates to the electric wall to isolate the electromagnetic field coupling and then to increase the EMI shielding. The operating principle of the proposed antenna is investigated through an isosceles right triangular waveguide. An antenna prototype is fabricated and measured. The measured results match with the simulated and analyzed results very well. It is demonstrated that the proposed QMSIW subarray with metallic via-holes array gives an attractive and promising way to design the AiP with self-shielded property.

77-GHz Multi-Channel Radar Transceiver With Antenna in Package

This paper presents the design of a directional folded dipole antenna integrated in an embedded wafer level ball grid array (eWLB) package, the comparison of different antenna designs and the influence of the silicon die and neighboring antennas within the package to the radiation behavior. The co-integration of the antenna and the silicon-based monolithic microwave integrated circuit (MMIC) in a system in package (SiP) approach is a convenient solution to suppress lossy radio frequency (RF) transitions and to simplify the design and the manufacturing of radio frontends significantly. The proposed SiP is focused on 77-GHz automotive radar applications. The MMIC contains the 77-GHz signal source and a transceiver with amplifier and mixer. The gain of different antennas in different constellations within the package is shown.

Modeling and Design of Microstrip Patch Antenna-in-Package for Integrating the RFIC in the Inner Cavity

This letter presents the circuit model of the antenna-in-package (AiP) for integrating the RFIC in the inner cavity. The closed-form expression for the inductance of the ground via is provided in the case that two ground vias are arranged under the nonradiating edge of the AiP. The new expression takes account of the radius and length of the vias, the relative positions of vias, and the distances between via holes and the feeding point of the antenna. Based on the circuit model, the influences of vias on the performance of the AiP are analyzed. It is found that the bandwidth of the AiP can be effectively improved by properly arranging two via holes under the nonradiating edge of the antenna. Finally, an AiP with the center frequency of 5.12 GHz is realized, and a bandwidth of 400 MHz is obtained. The calculated results are in agreement with the simulated and measured.

A Novel Antenna-in-Package With LTCC Technology for W-Band Application

In this letter, a novel antenna-in-package (AiP) technology at W-band has been proposed. This technology is presented for solving the special case that the metallic package should be used to accommodate high mechanical strength. By taking advantages of the multilayer low temperature co-fired ceramic (LTCC) technology, the radiation efficiency of the antenna can be maintained. Meanwhile, high mechanical strength and shielding performance are achieved. A prototype of AiP has been designed. The prototype constitutes integrated LTCC antenna, low-loss feeder, and metallic package with a tapered horn aperture. This LTCC feeder is realized by laminated waveguide (LWG). An LWG cavity that is buried in LTCC is employed to broaden the antenna impedance bandwidth. Electromagnetic (EM) simulations and measurements of antenna performances agree well over the whole frequency range of interest. The proposed prototype achieves a -10-dB impedance bandwidth of 10 GHz from 88 to 98 GHz and a peak gain of 12.3 dBi at 89 GHz.

Radiation Performance Enhancement of E-Band Antenna in Package

This paper presents an antenna-in-package (AiP) solution with embedded wafer Level ball grid array (eWLB) packaging technology. The primary antenna is realized in the redistribution layer of the eWLB package. It is composed of two patches driven by differential signals and supports seamless connection with differential output monolithic microwave integrated circuits in a compact package. A dielectric rod lens was designed to optimize the radiation performance of the whole package. The final lens has the dimensions 10 mm × 10 mm × 10.5 mm. Our measurements show that the whole package (chip+AiP) including the lens reaches 16-dBm effective isotropic radiated power for the frequency range from 71.4 to 81.7 GHz. The radiation beam is relatively symmetric for both the E- and H-plane. The proposed AiP solution has great potential for millimeter-wave applications.

Development of 60-GHz Wireless Interconnects for Interchip Data Transmission

This paper presents radio frequency data transmissions via 60-GHz antennas or wireless interconnects in multichip multicore computing architectures. An antenna in package is used as the design configuration to be placed on top of the silicon circuitry. The packaging design includes an artificial magnetic conductor to enhance the operating bandwidth, a two-element antenna array to increase the transmission gain, and an integrated power divider. This paper compares the wireless link budget of antenna-based interconnects in terms of the Friis transmission equation. This defines the power needed to be recovered by wireless transceivers (PRE). The design demonstrates an 11 GHz measured operating bandwidth and shows that with a two-element array; the PRE is reduced by 10 dB over that with a link that uses a single antenna.

Antenna-in-Package Design Based on Wafer-Level Packaging With Through Silicon Via Technology

In this paper, a CPW-fed antenna-in-package (AiP) operating at millimeter wave (mmWave) based on a wafer-level packaging technology with through silicon via (TSV) interconnections is proposed, designed, and measured. The designed antenna consists of two-stacked high-resistivity silicon (HRSi) substrates. One is the bottom HRSi substrate with thickness of 750 μm, which carries the slot radiator and the CPW feeding. The other one is the top HRSi substrate with thickness of 200 μm carrying a patch, which is placed on the radiating element for antenna gain and efficiency improvement. The vertical interconnects in this structure are designed using the TSVs built on a HRSi wafer, which are designed to carry the radio frequency (RF) signals up to mmWave. RF path transitions are carefully designed to minimize the return loss within 10 dB in the frequency band of concern. The designed AiP is fabricated and measured, and the measured results basically match the simulation results. It is demonstrated that a wider bandwidth and less-sensitive input impedance versus the fabrication process accuracy are obtained with the designed structure in this paper. The measured results show the radiation in the broadside of the structure with gain around 2.4 dBi from 76 to 93 GHz.

Integration of Quadruple Linearly-Polarized Microstrip Grid Array Antennas for 60-GHz Antenna-in-Package Applications

This paper demonstrates the integration of quadruple linearly-polarized microstrip grid array antennas in Ferro A6M low-temperature cofired ceramic technology for 60-GHz antenna-in-package (AiP) applications. An emphasis is given to the optimization of via transitions in the design of the low-loss array feeding network based on stripline quarter-wave matched T-junctions for the multilayer AiP structure. This paper also demonstrates the capabilities of a fully automatic probe-based antenna measurement setup for 3-D radiation pattern at 60 GHz. A special focus is placed on the calibration procedure to achieve an overall uncertainty of ±1 dB for the measurement of the realized gain of any antenna. The AiP module of dimensions 15 × 15 × 1 mm is fabricated and measured. The measured results are in good agreement with the simulated ones, showing that the AiP achieves excellent antenna performance: 10-dB impedance bandwidth (BW) from 50 to 65.6 GHz (or 25.4% at 61.5 GHz), broadside radiation from 55 to 67 GHz (or 19.5%), and 3-dB gain BW from 58.5 to 67 GHz (or 13.8%) with the maximum gain of 15 dBi at 62 GHz.

Investigation of the electric field inside differential antenna‐in‐package

For antenna-in-package (AiP), there will be an interaction between the antenna and packaged components and this interaction always takes place in the zone of the near field. So, it is necessary to study an electric field inside the package cavity and how to reduce it. In this study, the finite difference time domain model for the differential AiP is presented. Based on it, the distributions of the electric field inside the package cavity with the whole ground and gridded ground are analysed separately. The near fields E X and E Y are far less than E Z and approach to zero. Also, the maximum E Z appears at the edge of cavity and it is 57 dB V/m. According to this feature, a new package configuration reducing near field is presented. The measured and simulated results show that the new packaging structure can decrease the electric field inside the package cavity to about 20 dB V/m.

The Design of Broadband 60 GHz AMC Antenna in Multi-Chip RF Data Transmission

This paper presents the design of a 60 GHz antenna to be used in multi-core multi-chip (MCMC) computing systems. The antenna in package (AiP) solution has a ground-shielded metal and a periodically-patched artificial magnetic conductor (AMC) structure to widen the reflection coefficient bandwidth. The designed antenna with AMC layer broadcasts signals in the horizontal direction. Both simulated and measured results demonstrate that a $-10~{\hbox {dB}}$ reflection coefficient is achieved for a 10 GHz bandwidth and that radiation in the horizontal (chip-to-chip) direction is maintained.