A Novel Antenna-in-Package With LTCC Technology for W-Band Application

Abstract

In this letter, a novel antenna-in-package (AiP) technology at W-band has been proposed. This technology is presented for solving the special case that the metallic package should be used to accommodate high mechanical strength. By taking advantages of the multilayer low temperature co-fired ceramic (LTCC) technology, the radiation efficiency of the antenna can be maintained. Meanwhile, high mechanical strength and shielding performance are achieved. A prototype of AiP has been designed. The prototype constitutes integrated LTCC antenna, low-loss feeder, and metallic package with a tapered horn aperture. This LTCC feeder is realized by laminated waveguide (LWG). An LWG cavity that is buried in LTCC is employed to broaden the antenna impedance bandwidth. Electromagnetic (EM) simulations and measurements of antenna performances agree well over the whole frequency range of interest. The proposed prototype achieves a -10-dB impedance bandwidth of 10 GHz from 88 to 98 GHz and a peak gain of 12.3 dBi at 89 GHz.