AbstractAn alternative method to introduce dopants in Silicon rich oxide (SRO) layers was investigated. A silicon dioxide (SiO2) layer containing phosphorous pentoxide (P2O5) or boron (B) was deposited on the quartz substrate. A bilayer structure was subsequently deposited using Si and SiO2. SRO layers were doped via diffusion during the high temperature annealing required to form the Silicon quantum dot (Si‐QD) materials. Two kinds of dopants (phosphorus and boron) were introduced as they are typical dopants for n‐type and p‐type Si respectively. The annealing time was also varied to achieve an optimum conductivity of the quantum dot material. Different Si concentrations in the SRO layers were investigated. A 5% change of Si concentration could change the conductivity of the Si‐QD material by more than one order of magnitude. Using circular transmission line measurement (TLM), the sheet resistivity of the Si‐QD material was extracted. It was demonstrated that this new method of introducing dopants by diffusion is successful. Moreover, it was found that the conductivity of Si‐QD materials decreased with increasing Si concentration in the SRO layers and was also influenced by the type of dopants. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)