AbstractSecondary ion mass spectrometry (SIMS) has achieved great success as a materials characterization tool because of its parts‐per‐million to parts‐per‐billion sensitivity and excellent depth resolution. SIMS is best known for applications in the semiconductor industry, but is increasingly used in many other fields. Despite this growth, three myths persist regarding SIMS: the technique is not quantitative, insulators are difficult or impossible to analyze and good depth resolution cannot be obtained for metals. Recent work by several groups should dispell these misconceptions. Quantification with a reproducibility and accuracy of 10–20% is commonplace with ion implantation calibration methods. Patterns for secondary ion yields of the elements when plotted against ionization potential and electron affinity have been identified in a number of semiconductor and metal matrices. The pattern similarities allow sensitivity factors to be estimated for elements for which an implanted calibration is not available. The Lawrence Livermore project of selected elements into 200 matrices is expected to extend this concept to oxides, minerals, alloys, ceramics and fluorides. The analysis of insulators has been made routine by the use of an electron beam for charge neutralization and an understanding of the placement of the electron beam and the electron to ion current density ratio required. The glass industry provides many applications for this capability. Metals and other polycrystalline materials can be sputtered evenly if the sample is rotated during ion bombardment. This rotation method has been used for matrix‐level species in Auger analysis, and has now been shown to be viable in SIMS at the parts per million level.
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