Ni Layer Research Articles

Electrochemical properties of electroless Ni plated super duplex stainless in 3.5% NaCl solution

Si wafers used in semiconductors require precise machining; therefore, they are processed using an STS304 saw wire, which is made of an austenitic stainless steel with excellent strength and corrosion resistance. However, the recently developed super duplex stainless steel (SDSS) exhibits superior performance compared to STS304 and is suitable for use as a saw wire. SDSS is a stainless steel composed of austenite and ferrite, with the ratio varying depending on the temperature during heat-treatment. Ferrite has better wear resistance than austenite; therefore, Ni plating was applied to ferritized SDSSs to improve the saw wire performance, and the electrochemical properties were analyzed. The nickel layer increased with time, forming a non-uniform coating until 180 s, followed by uniform plating. This was confirmed by the changes in the surface roughness and surface images. With the formation of a uniform nickel-plating layer, the distinction between austenite and ferrite became visible, resulting in decreased surface roughness. When the time exceeded 240 s, the difference in roughness increased owing to the difference between in the reactivities of austenite and ferrite. This difference in the surface roughness influenced the electrochemical behavior. The uneven nickel-plating layer exhibited a potential change of over 200 mV during the initial open-circuit potential (OCP) stage (prior to 800 s). In a potentiodynamic polarization test, plating for more than 300 s resulted in a reduced corrosion resistance owing to overplating. Increasing the thickness of the Ni layer altered the electrochemical behavior from SDSS to nickel. By analyzing the surface conditions and electrochemical properties, a uniform nickel-plating layer, exhibiting the characteristics of SDSS, was observed at 240 s. Therefore, the optimal duration for electrolytic nickel plating of ferritized SDSS was 240 s

On the microstructural and mechanical responses of dual-matrix Al-Ni/SiC composites manufactured using accumulative roll bonding

This article discusses the correlation between the microstructural and mechanical changes in the dual-matrix Al-Ni/SiC composites processed by Accumulative Roll Bonding (ARB) technique. Three different SiC concentrations, 1, 3, and 5% were considered to reinforce Al and Al-Ni dual-matrix composites. ARB process was applied up to 7 cycles to manufacture a composite with homogenous dispersion of the three phases. The results showed that the presence of Ni layer between Al and SiC particles enhanced the dispersion of SiC in the matrix, which positively affect the mechanical strength. The maximum tensile achieved was 257 MPa for composite containing 3 % SiC after 7 ARB cycles compared to 37.2 MPa for the AA1050. Increasing SiC content reduces the adhesion between Al and Ni layers, which reduces the elasticity of the composites. However, for the composites with 5% SiC, after 3 ARB cycles, the strength was reduced due to the cracking of the Ni layer caused by the stress concentration around the SiC particles. The hardness values of the ARBed AA1050, AA1050-Ni, and AA1050-Ni/5 wt% SiC are 85.5, 93.5, and 109.7, respectively, after 7 ARB cycles. In terms of strength, the samples with 3% SiC content showed the optimum stress enhancement with minimum reduction in the elongation, which achieve a compromised response for many applications.

Interface study on the effect of oxygen/nitrogen ratio in Ni/Ti multilayer deposited by reactive sputtering

Since the growth morphology along and perpendicular to the interface is important for supermirror applications, the dependence of this on the reactive gas has been investigated in Ni/Ti multilayers prepared by reactive magnetron sputtering with variable O2/N2 ratios. The interface properties are characterized by GIXRR, XDS, and TEM measurements. Compared to the case without O2, the presence of 20% O2 in the deposition of Ni layers contributes to smooth and abrupt interfaces. It also suppresses the accumulation of interfacial roughness with the increasing number of layers. However, the abundant oxygen content results in a striking degradation of interface quality associated with the crystallization evolution. Moreover, the lateral correlation length of interfacial roughness exhibits a consistent tendency with the grain size as the oxygen content increases. Following the XPS depth profiles, although N2 and O2 gases were applied in the Ni layer deposition, the N and O were only detected in the Ti layers as the compound for the high chemical activity of Ti. The elemental form in the Ni layers corresponds to the crystalline structure inferred by XRD measurements.

Harmonious Heterointerfaces Formed on 2D‐Pt Nanodendrites by Facet‐Respective Stepwise Metal Deposition for Enhanced Hydrogen Evolution Reaction

AbstractThe performance of nanocrystal (NC) catalysts could be maximized by introducing rationally designed heterointerfaces formed by the facet‐ and spatio‐specific modification with other materials of desired size and thickness. However, such heterointerfaces are limited in scope and synthetically challenging. Herein, we applied a wet chemistry method to tunably deposit Pd and Ni on the available surfaces of porous 2D−Pt nanodendrites (NDs). Using 2D silica nanoreactors to house the 2D‐PtND, an 0.5‐nm‐thick epitaxial Pd or Ni layer (e‐Pd or e‐Ni) was exclusively formed on the flat {110} surface of 2D−Pt, while a non‐epitaxial Pd or Ni layer (n‐Pd or n‐Ni) was typically deposited at the {111/100} edge in absence of nanoreactor. Notably, these differently located Pd/Pt and Ni/Pt heterointerfaces experienced distinct electronic effect to influence unequally in electrocatalytic synergy for hydrogen evolution reaction (HER). For instance, an enhanced H2 generation on the Pt{110} facet with 2D‐2D interfaced e‐Pd deposition and faster water dissociation on the edge‐located n‐Ni overpowered their facet‐located counterparts in respective HER catalysis. Therefore, a feasible assembling of the valuable heterointerfaces in the optimal 2D n‐Ni/e‐Pd/Pt catalyst overcame the sluggish alkaline HER kinetics, with a catalytic activity 7.9 times higher than that of commercial Pt/C.

Harmonious Heterointerfaces Formed on 2D-Pt Nanodendrites by Facet-Respective Stepwise Metal Deposition for Enhanced Hydrogen Evolution Reaction.

The performance of nanocrystal (NC) catalysts could be maximized by introducing rationally designed heterointerfaces formed by the facet- and spatio-specific modification with other materials of desired size and thickness. However, such heterointerfaces are limited in scope and synthetically challenging. Herein, we applied a wet chemistry method to tunably deposit Pd and Ni on the available surfaces of porous 2D-Pt nanodendrites (NDs). Using 2D silica nanoreactors to house the 2D-PtND, an 0.5-nm-thick epitaxial Pd or Ni layer (e-Pd ore-Ni) was exclusively formed on the flat {110} surface of 2D-Pt, while a non-epitaxial Pd or Ni layer (n-Pd or n-Ni) was typically deposited at the {111/100} edge in absence of nanoreactor. Notably, these differently located Pd/Pt and Ni/Pt heterointerfaces experienced distinct electronic effect to influence unevenly in electrocatalytic synergy for hydrogen evolution reaction (HER). For instance, an enhanced H2 generation on the Pt{110} facet with 2D-2D interfacede-Pddeposition and faster water dissociation on the edge-locatedn-Ni overpowered their facet-located counterparts in respective HER catalysis. Therefore, a feasible assembling of the valuable heterointerfaces in the optimal 2D n-Ni/e-Pd/Pt catalyst overcame the sluggish alkaline HER kinetics, with a catalytic activity 7.9 times higher than that of commercial Pt/C.

The influence of mercury vapor on the electrical resistance of chalcogenide amorphous films

Using the planar structures "Ni layer - chalcogenide amorphous film - Ni layer" and "graphite probe - chalcogenide amorphous film graphite probe" samples, the influence of mercury vapor on the electrical resistance of amorphous films of the Se-Te, Se-Sb and Se-As systems was investigated. It was established that exposure of samples in mercury vapor leads to a decrease in their electrical resistance by 4-7 orders of magnitude. As the temperature and mercury concentration increase, the transition time from a high-resistance state to a low-resistance state decreases. When introducing Te, Sb, and As into amorphous selenium and increasing their concentration in the composition of the films, the transition time increases, and the value of the change in resistance decreases. It was established that the change in resistance is mainly determined by the change in surface conductivity of chalcogenide films. A decrease in the electrical resistance of selenium-containing amorphous films modified with mercury is caused by the formation of HgSe crystalline inclusions in their matrix.

Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis.

The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated. Real-time synchrotron imaging was used to investigate the microstructure, focusing on the in situ growth behavior of primary intermetallics during the solid-liquid-solid interactions. The high-speed shear test was conducted to observe the correlation of microstructure formation to the solder joint strength. Subsequently, the experimental results were correlated with the numerical Finite Element (FE) modeling using ANSYS software to investigate the effects of primary intermetallics on the reliability of solder joints. In the Sn-3.5Ag/Cu-OSP solder joint, the well-known Cu6Sn5 interfacial intermetallic compounds (IMCs) layer was observed in each reflow, where the thickness of the IMC layer increases with an increasing number of reflows due to the Cu diffusion from the substrate. Meanwhile, for the Sn-3.5Ag/ENIG solder joints, the Ni3Sn4 interfacial IMC layer was formed first, followed by the (Cu, Ni)6Sn5 IMC layer, where the formation was detected after five cycles of reflow. The results obtained from real-time imaging prove that the Ni layer from the ENIG surface finish possessed an effective barrier to suppress and control the Cu dissolution from the substrates, as there is no sizeable primary phase observed up to four cycles of reflow. Thus, this resulted in a thinner IMC layer and smaller primary intermetallics, producing a stronger solder joint for Sn-3.5Ag/ENIG even after the repeated reflow process relative to the Sn-3.5Ag/Cu-OSP joints.

Remarkably Corrosion Resistant Graphene Coating on Steel Enabled Through Metallurgical Tailoring.

Graphene coatings developed by chemical vapor deposition (CVD) that possess extraordinary/unique characteristics as barrier against aggressive environment can improve the corrosion resistance of Ni and Cu by up to two orders of magnitude. However, because of some compelling technical reasons, it has thus far been a nontrivial challenge to develop graphene coatings on the most commonly used engineering alloy, mild steel (MS). To circumvent the challenge simply by first electroplating MS with a Ni layer is attempted, and then developing CVD graphene over the Ni layer. However, this approach proved too simplistic and does not work. This necessitated an innovative surface modification of MS (based on basic metallurgical principles) that enabled successful CVD of graphene coating on MS. The graphene coating thus developed is demonstrated to improve the corrosion resistance of mild steel by two orders of magnitude in an aggressive chloride solution, through electrochemical testing. This improvementwas not only sustained for the entire test duration of >1000h; but there is a clear trend for the resistance to be possibly everlasting. The optimized surface modification that enabled development of CVD graphene coating on mild steel is generic in nature, and it should enable graphene coating on other alloy systems, which would otherwise not be possible.

Ultrathin metal Ni layer on ZnO/TiO2 photoelectrodes with excellent photoeletrochemical performance in multiple electrolyte solutions

It is well known that the oxygen vacancy (Ovac) as the electron-donor dopant in semiconductor can increase the electron-holes separation in photoeletrochemical (PEC) water splitting. Furthermore, the metal Ni can promote the hydrogen evolution reaction (HER) on the surface of semiconductor. In this paper, the ZnO/TiO2 photoelectrodes with rich Ovac was synthesized by electrostatic adsorption through using ZIF-8 as the precursor. Then the ultrathin Ni layer with about 7 nm was deposited on the surface of ZnO/TiO2 (Ni/ZnO/TiO2) by vacuum thermal evaporation method. The Ni/ZnO/TiO2 photoelectrodes showed the highest photocurrent than ZnO/TiO2, Ni/ TiO2 and pure TiO2 photoelectrodes. The durability of Ni/ZnO/TiO2 photoelectrodes was keeping for 10 h in multiple electrolyte solutions under AM 1.5 G illumination and the photocurrent decline can be ignored. The UV–vis absorption spectra demonstrated that the ultrathin Ni layer showed plasma with ZnO/TiO2 for enhancing the water splitting performance. Furthermore, the ultrathin Ni layer enhanced the photogenerated charges transfer for improving the PEC performance. This work provides a new method for ultrathin metal Ni layer with Ovac semiconductor photoelectrode to improve the PEC performance in multiple electrolyte solutions.

Study of temperature sensing performance of bimetallic layer MFBG

To improve the strength and performance of FBG (fiber Bragg grating), they are often encapsulated and protected or surface metallized. In this paper, based on the thermoelastic theory of J.M.C. Duhamel and F.E. Neumann, a thermal sensitivity model for bimetallic layer MFBG (metalized FBG) is established, and the thermal sensitivity performance parameters are analyzed for MFBG with single metal layers and those with Ni and Ti bimetallic layers deposited on the surface. The thermal sensitivity coefficient of the MFBG gradually stabilizes as the thickness of the metal coating increases. To verify the rationality of the theoretical model, Ni-Ti MFBG (double-layer MFBG with Ni as the outer metal and Ti as the inner metal) were prepared by magnetron sputtering with electroplating for thickening, and the plating process and formulation were optimized. The thermal sensing performance experiments of Ni-Ti MFBG and ordinary bare FBG were conducted together. The metallization of FBG can improve the temperature sensitivity of FBG, and the relative error between the experimental data and the theoretical value is less than 5 %. When h1 (the thickness of the inner metal layer) = 1 µm, h2 (the thickness of the outer metal layer) keeps increasing, the change trend of the temperature sensitivity of Ni-Ti-MFBG is consistent with the conclusion reached in the theory, which strongly proves the validity and reasonableness of the established bimetallic layer MFBG thermal sensing model, and the results of this paper have good theoretical guidance significance for the research on the connection between FBG and electromechanical components.

Numerical analysis of residual stresses induced by cold spray fabricating cBN-reinforced Ni matrix composites

Metal particles used as cold spraying feedstock undergo severe plastic deformation during application. During this process, residual stresses are generated. The presence of porous metal particles and ceramic particles further complicates the deformation process. Numerical models have been proposed to describe the formation process for residual stresses induced by cold spray fabricating cBN-reinforced Ni matrix composites on a 42CrMo substrate. The feedstocks to be sprayed are mixtures of porous Ni particles and Ni-coated cBN particles. The analysis of residual stresses for the cBN-reinforced Ni matrix composites was accomplished by depositing cBN particles on the cold-spayed porous Ni particles and multi-layered Ni coatings. Firstly, local residual stresses are generated near the large number of closed pores inside the cold-sprayed porous Ni particles. Simultaneously, the residual stresses at the bottom of the multi-layered Ni coatings are changed from a compressive stress state to a tensile one as the number of cold-sprayed Ni layer increases. Finally, the deposited cBN particles aggravate the transformation of residual stresses during the cold spraying fabrication of multi-layered cBN-reinforced Ni matrix composites. The concentrated compressive stresses are generated when the cBN particles are deposited on the Ni particles. Understanding these phenomena may provide a guideline for tailoring the residual stresses for cold-sprayed cBN-reinforced Ni matrix composites and thereby improve service performance.

Influence of extrinsic induced tensile stress on the self-propagating high-temperature synthesis of nanosized Al/Ni multilayers

Reactive multilayer systems consisting of alternating nanoscale Al and Ni layers are applicable in joining, various pyrotechnic applications and thermal batteries. Since diffusion based high-temperature synthesis occurs without the presence of air, efforts have focused on investigating the understanding of the fundamental reaction processes and characteristics. The aim of this study is to expose the reactive multilayers to extrinsic induced tensile stress so that the self-propagating synthesis can proceed under these conditions. Further, the properties during and after the reaction will be investigated. Multilayers deposited by sputtering on Kapton® substrates with different bilayer– and total thicknesses as well as commercial Nanofoils® with thicknesses of 40 µm and 60 µm were used as samples. The investigations focused on the propagation velocity measured with a high-speed camera, the temperature regime determined with a high-speed pyrometer, and the formed phases after the synthesis examined via X-ray diffraction. The gained results of this study reveal important insights for the application of the reactive Al/Ni multilayer system in terms of stability or reliability related to propagation front velocity, maximum temperature and formed phases under induced external tensile stresses.Graphical abstract

Structural and Magnetic Properties of Ni Nanoparticles Embedded in Vinyl Polymer Nanocomposite Films

Ni nanoparticles layer of nominal thickness in the range of 5–40[Formula: see text]nm were deposited on polyvinyl alcohol (PVA) film by using the ion beam sputtering (IBS) technique. PVA films were made on a quartz substrate by the solution casting technique. Grazing incidence X-ray diffraction (GIXRD) results reveal Ni is present in a metallic form in the FCC phase. AFM shows that roughness increases with increase in thickness of Ni layer and corresponding MFM images of magnetic domains were recorded. Soft X-ray absorption spectroscopy (SXAS) studies on the PVA/Ni nanocomposites films were recorded using synchrotron radiation. This study is used to study the electronic structure of the as-prepared nanocomposite films and reveals that Ni nanoparticles are present in their metallic form. Magnetic properties were measured using the magneto-optical Kerr effect (MOKE) magnetometer and the films were found to be magnetically soft with higher value of coercivity at lower thickness of Ni nanoparticles layer. The results of magnetic studies are discussed in light of the microstructure and morphological features of PVA/Ni nanocomposite films. The PVA/Ni nanocomposites showed interesting anisotropic magnetic behavior; thus the investigative results may be useful for the development of futuristic flexible functional magnetic material system.

Hybrid Ag/Ni mesh/PH 1000 transparent electrodes for high performance flexible electrochromic devices with exceptional stability

Flexible electrochromic technology has gained numerous attentions in flexible smart wearable devices and flexible displays. For large-area flexible electrochromic devices (FECDs), highly conductive transparent electrodes with advanced stability at a prolonged redox cycling process are indispensable. In this work, a silver (Ag)/nickel (Ni) mesh/PH 1000 hybrid transparent film were successfully fabricated by selectively electrodepositing an 800 nm-thick dense metallic Ni layer and coating PH 1000 on an embedded Ag mesh to improve its electrochemical stability. The prepared hybrid transparent film presented high conductivity with a sheet resistance of below 1.5 Ω sq−1 at over 80% optical transmittance. The Ag/Ni mesh/PH 1000 was successfully utilized as current collectors for all-solid-state FECDs, showing fast coloration switching with a bleaching/coloring time of 0.7 s/0.9 s. In addition, the device demonstrated an exceptional electrochemical cycling stability, which could sustain 89% of its initial optical modulation after 25 000 cycles. More importantly, a remarkable mechanical durability was also achieved with a small optical modulation decay of 15% and an invariable response time after 1000 rolling cycles. In addition, uniform coloration were realized on a 6 × 6 cm2 FECD, demonstrating its great potential for applications of next-generation up-scaling FECDs.

Effect of Versenium Hydrogensulfate on Properties of Nickel Coatings.

The salt of formula [H2EDTA2+][HSO4-]2 (dihydrogen ethylenediaminetetraacetate di(hydrogen sulfate(VI)) was used to examine the physicochemical properties of the resulting Ni layer and evaluate the applicability of the salt as a new additive for Watts-type baths. The Ni coatings deposited from baths containing [H2EDTA2+][HSO4-]2 were compared with those obtained from other baths. The nucleation of nickel on the electrode was proven to occur the slowest in the bath that contained the mixture of [H2EDTA2+][HSO4-]2 and saccharin compared with other baths. The addition of [H2EDTA2+][HSO4-]2 alone (bath III) generated a coating with a morphology similar to that obtained from bath I (without additives). Despite the similar morphology and wettability of the Ni-coated surfaces plated from various baths (all Ni coatings were hydrophilic with contact angles in the range of 68 to 77°), some differences in electrochemical properties were noted. The corrosion resistance for the coatings plated from baths II and IV containing saccharin (Icorr = 1.1 and 1.5 µA/cm2, respectively) and the mixture of saccharin and [H2EDTA2+][HSO4-]2 (Icorr = 0.88 µA/cm2), respectively, was similar or even better than the coating obtained from baths without [H2EDTA2+][HSO4-]2 (Icorr = 9.02 µA/cm2).

Solid-state dewetting of Ag/Ni bi-layers: Accelerated void formation by the stress gradient in the bottom Ni layer

Solid-state dewetting (SSD) of the immiscible Ag/Ni bi-layers was studied. After annealing at 400 °C for 1 min, the Ag film was dewetted on the Ni film, and this is the first observation about the SSD of one metal film on another metal film. The easier dewetting of Ag than Ni was attributed to its lower melting point, faster grain boundary self-diffusion and poor wettability between them. At 500 °C, the void formation in the bottom Ni layer was highlighted and compared to Ni single layer: many voids in the former while no visible voids in the latter, indicating that the presence of Ag accelerated the SSD of Ni. It was attributed to the vertical stress gradient in the bottom Ni film of Ag/Ni bi-layers, which accelerated the Ni diffusion and formation of the voids in the underlying Ni film around and below the Ag particles. Besides, voids were more easily formed below the Ag particles than between them due to the large lattice mismatch at the Ag/Ni interface and the possible formation of Ag-Ni alloys. The destabilization of the Ag on the Ni film contributes to the understanding of dewetting kinetics, which is beneficial to realize the controllable nanofabrication.

Diffusion barrier property of Co-W layer compared with Ni layer in fine pitch micro-bumps during high temperature storage

Co-W alloy has the potential to replace Ni barrier layer in Cu/Sn solder joints of advanced electronic packaging due to its excellent electromigration resistance and diffusion barrier property. Nevertheless, little attention has been paid to the fine pitch micro-bumps on the diffusion barrier consumption. In this work, Sn/Co-9at. %W/Cu and Sn/Ni/Cu micro-bumps with a diameter of 12 μm were fabricated by electrodeposition and the consumption of the barrier was investigated during solid stage aging at 150 °C and 200 °C. The consumption of the Co-W barrier was accompanied by the growth of the layered amorphous Co-W-Sn. The depletion of Ni barrier was at least 4 and 2 times faster than the Co-W barrier at 150 °C and 200 °C, respectively. Compared with Sn/Co-W/Cu planar diffusion couple, the consumption rate of Co-W barrier layer in micro-bumps did not increase. A theory of amorphous Co-W-Sn layer without grain boundary and high melting point W reducing the diffusion coefficient was proposed to explain the eliminated scaling effect.

Investigation of copper corrosion behavior in chloride bath for nickel electrodeposition

The present study is devoted to the electrodeposition of nickel layers on copper substrates by cyclic voltammetry from chloride bath at a scan rate of 20 mV/s and at different bath temperatures between 25 and 55 °C and then after to their corrosion behavior in chloride bath. The electrochemical behavior and corrosion properties were evaluated by cyclic voltammetry, potentiodynamic and electrochemical impedance spectroscopy. While the surface analysis of nickel coating at different temperatures was conducted by optical microscopy and white light interferometer (WLI). The obtained results show that the Ni layers have been deposited successfully on the Cu substrates. It was found that raising the bath temperature to 55 °C leads to smoother, dense, compact and recovering Ni coatings with a grain size of 0.024 nm and 0.294 µm as average roughness, which is mainly due to Ni grain refinement. While the effect of increasing bath temperature leads to a decrease in the corrosion resistance of copper.

Theory of superdiffusive spin transport in noncollinear magnetic multilayers

Ultrafast demagnetization induced by femtosecond laser pulses in thin metallic layers is caused by the outflow of spin-polarized hot-electron currents describable by the superdiffusive transport model. These laser-generated spin currents can cross the interface into another magnetic layer and give rise to magnetization dynamics in magnetic spin valves with noncollinear magnetizations. To describe ultrafast transport and spin dynamics in such nanostructures, we develop here the superdiffusive theory for general noncollinear magnetic multilayers. Specifically, we introduce an Al/Ni/Ru/Fe/Ru multilayer system with noncollinear Ni and Fe magnetic moments and analyze how the ultrafast demagnetization and spin-transfer torque depend on the noncollinearity. We employ ab initio calculations to compute the spin- and energy-dependent transmissions of hot electrons at the interfaces of the multilayer. Taking into account multiple electron scattering at interfaces and spin mixing in the spacer layer, we find that the laser-induced demagnetization of the Ni layer and the magnetization change of the Fe layer strongly depend on the angle between their magnetizations. Similarly, the spin-transfer torques on the Ni and Fe layers and the total spin momentum absorbed in the Ni and Fe layer are found to vary markedly with the amount of noncollinearity. These results suggest that by changing the amount of noncollinearity in magnetic multilayers, one can efficiently control the hot-electron spin transport, which may open a way toward achieving fast, laser-driven spintronic devices.

Terahertz spin-to-charge conversion in ferromagnetic Ni nanofilms

Abstract Spintronic terahertz (THz) emission via spin-to-charge conversion (SCC) has been widely studied in ferromagnets (FM)/nonmagnets (NM) structures, in which various mechanisms of SCC have been confirmed in different NM materials. However, it is rare to find a material having multiple SCC mechanisms at the same time. Here, we report a ferromagnetic metal Ni film with diverse functions in the SCC process, by performing THz emission experiments in single Ni layer, FM/Ni, Ni/NM bilayers and FM/Ni/NM trilayers. It is demonstrated that in Ni monolayer, THz emission is radiated by the anomalous Hall effect and ultrafast demagnetization of Ni film. In FM/Ni, the Ni film acts as an SCC implementer and THz emission is mainly generated by the inverse spin Hall effect (ISHE) of Ni. In Ni/NM, the Ni film acts as a spin injector and provides spin currents to be converted to charge current via ISHE of heavy metal NM, inducing THz emission. In FM/Ni/NM, THz emission mainly comes from ISHE of FM/Ni, Ni/NM, and FM/NM, and their domination is relative to Ni thickness. Our findings show a ferromagnetic film not only acts as a spin injector but also as an SCC implementer, providing a new concept to design spintronic THz emitters.