The silicon nanotube field effect transistor (FET) is a tubular structure and has an inner gate and outer gate to control the channel. In this paper, the performance of a junctionless silicon nanotube FET is optimized using inner and outer gate engineering through 3D numerical TCAD simulations. The performance of the optimized devices is enhanced in terms of ON current (ION), OFF current (IOFF), and $$\frac{{I_{{{\text{ON}}}} }}{{I_{{{\text{OFF}}}} }}$$ ratio. Appropriate work function and gate dielectric choices are suggested for the inner and outer gates to obtain optimized devices. The lowest IOFF and highest $$\frac{{I_{{{\text{ON}}}} }}{{I_{{{\text{OFF}}}} }}$$ ratio are obtained for devices with high inner and outer gate permittivity along with low inner and outer gate work function. Also, the highest ION is obtained for the device with the highest inner and outer gate dielectric permittivity with low outer and inner gate work function. The device optimized for ION (98.6% increase compared to reference device) with the corresponding IOFF better than the reference device can be used for high-power applications.
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