In the era of additive manufacturing (AM), great interest in electrodeposition has evolved, either as a post-printing finishing stage (e.g., on cellular AM’ed structures) or as a standalone three-dimensional (3D) printing technique. Over the years, a variety of electrochemical 2D patterning and 3D printing techniques have been developed, e.g., meniscus-confined electrodeposition (MCED), localized electrochemical deposition (LECD), electrochemical fountain pen nanofabrication (ec-FPN), electrochemical dip-pen nanolithography (E-DPN), electrochemical printing (EcP), electrochemical fabrication (EFAB), and nanotransfer printing (nTP).The MCED process relies on an electrolyte-containing micropipette with a micron/submicron-size orifice. As the micropipette approaches the surface of a conductive substrate, a meniscus (liquid bridge) is established between the dispensing orifice and the substrate’s surface (Fig. 1b). Electrical current (or potential), applied between a small conductive wire inside the pipette and the conductive substrate via the meniscus, causes reduction of the reducible species on the surface confined by the meniscus. The dispensing micronozzle is then withdrawn from the substrate at a speed that should match the deposition rate, allowing continuous fabrication. The size and shape of the meniscus established between the nozzle and the growing feature are determined mainly by the shape and size of the nozzle, its moving speed, the thermodynamic properties of the electrolyte, surface wettability, and the relative humidity.We recently suggested a novel setup and procedure for 3D electrochemical deposition, combining MCED with atomic force microscope (AFM) closed-loop control (see Fig. 1a).1,2 This aforementioned combination allowed us to print freestanding vertical pillars (Fig. 1c) and overhang structures with an overhang angle as high as 80° without the need to use supports (Fig. 1d). A copper-based electrolyte was used for feasibility tests. Fully dense, uniform and exceptionally smooth features were printed (Fig. 1c), with diameters ranging from 1.5 μm down to 250 nm and a high aspect ratio (> 100). The dense deposited copper features had a polycrystalline microstructure, with submicron grain size (see Fig. 1e), and were mechanically rigid and of good electrical conductivity.Other functional metals and alloys that will be printed in the near future in our lab include pure aluminum and cobalt-phosphorous amorphous alloy. To this aim, a recipe for successful electrodeposition of these materials under potentially relevant conditions should first be developed. Here, I will summarize our ongoing work on: (1) electrodeposition of pure and dense nanocrystalline aluminum from room-temperature ionic liquids (RTILs) on copper and nickel substrates; and (2) electrodeposition of exceptionally well adhered CoP coatings on copper.I will also present our novel electrochemical processing of functional core/multi-shell ZnAl/Ni/NiP powders.3,4 This process can be used for processing of functional powders for laser-based additive manufacturing (LAM) with either reduced or increased laser absorbance, but also processing of phase change materials (PCMs) or zinc-based anodes in zinc-air batteries. Figure 1