Modern Electronic Industry Research Articles

Ultra-high precision nano additive manufacturing of metal oxide semiconductors via multi-photon lithography

As a basic component of the versatile semiconductor devices, metal oxides play a critical role in modern electronic information industry. However, ultra-high precision nanopatterning of metal oxides often involves multi-step lithography and transfer process, which is time-consuming and costly. Here, we report a strategy, using metal-organic compounds as solid precursor photoresist for multi-photon lithography and post-sintering, to realize ultra-high precision additive manufacturing of metal oxides. As a result, we gain metal oxides including ZnO, CuO and ZrO2 with a critical dimension of 35 nm, which sets a benchmark for additive manufacturing of metal oxides. Besides, atomic doping can be easily accomplished by including the target element in precursor photoresist, and heterogeneous structures can also be created by multiple multi-photon lithography, allowing this strategy to accommodate the requirements of various semiconductor devices. For instance, we fabricate an ZnO photodetector by the proposed strategy.

Field-Free Superconducting Diode Effect and Magnetochiral Anisotropy in FeTe0.7Se0.3 Junctions with the Inherent Asymmetric Barrier.

Nonreciprocal electrical transport, characterized by an asymmetric relationship between the current and voltage, plays a crucial role in modern electronic industries. Recent studies have extended this phenomenon to superconductors, introducing the concept of the superconducting diode effect (SDE). The SDE is characterized by unequal critical supercurrents along opposite directions. Due to the requirement on broken inversion symmetry, the SDE is commonly accompanied by electrical magnetochiral anisotropy (eMCA) in the resistive state. Achieving a magnetic-field-free SDE with field tunability is pivotal for advancements in superconductor devices. Conventionally, field-free SDE has been achieved in Josephson junctions by intentionally intercalating an asymmetric barrier layer. Alternatively, internal magnetism was employed. Both approaches pose challenges in the selection of superconductors and fabrication processes, thereby impeding the development of SDE. Here, we present a field-free SDE in FeTe0.7Se0.3 (FTS) junction with eMCA, a phenomenon absent in FTS single nanosheets. The field-free property is associated with the presence of a gradient oxide layer on the upper surface of each FTS nanosheet, while eMCA is linked to spin splitting arising from the absence of inversion symmetry. Both SDE and eMCA respond to magnetic fields with distinct temperature dependencies. This work presents a versatile and straightforward strategy for advancing superconducting electronics.

An Improved YOLOv9 and Its Applications for Detecting Flexible Circuit Boards Connectors

Flexible circuit boards are a cornerstone of the modern electronics industry. In automatic defect detection, FPC connectors present challenges such as minimal differences between oxidation defects and the background, easy degradation of Intersection over Union (IoU) scores, and significant variations in the shapes of black defect boundaries. Consequently, existing algorithms perform poorly in this task. We improve model YOLOv9 by introducing Multi-scale Dilated Attention (MSDA) on the output side to enhance the ability to capture features, and Deformable Large Kernel Attention (DLKA) on the other side of the output header to improve the ability to adapt to complex defect boundaries. Our use of IoU loss completely eliminates the risk of IoU degradation or gradient vanishing. Furthermore, we reduce computational overhead with the implementation of Faster Block. Following these improvements, the mean Average Precision (mAP) at 75% IoU (mAP75) for oxidized defects increased by 7.5% relative to the base model. Similarly, the mAP at 50% IoU (mAP50) for black defects increased by 5.7%, validating the relevance and efficacy of our proposed improvements. Overall, the average mAP50, mAP75, and mAP50:95 for all defects improved by 3.8%, 2.0%, and 2.3%, respectively. The performance gain achieved by our enhanced model significantly exceeds the improvement of YOLOv9 relative to YOLOv8.

Electroplating of silver on graphene-modified carbon foam for high thermal conductivity and outstanding electromagnetic interference shielding performance

The modern electronics industry needs lightweight, porous materials with high-performance electromagnetic interference (EMI) shielding effectiveness (SE) and effective thermal management. This study proposes a straightforward electrochemical technique to produce lightweight silver-plated (Ag-plated) graphene-modified carbon foams (Gr@CFs) with good thermal conductivity and outstanding EMI shielding performance. Initially, Gr@CFs were synthesized via a sacrificial template method utilizing phenolic resin as a carbon precursor and graphene nanoplatelets (GNPs) as fillers, followed by carbonization at 1000ºC. Subsequently, the synthesized Gr@CFs experienced electroplating with silver (Ag) for varying durations ranging from 1 to 10 minutes. The Ag electroplating contributed to high EMI SE and endowed the Gr@CF with commendable electrical, thermal, and mechanical properties. The resultant Gr@CF with Ag plated for 10 minutes (Gr@CF-Ag10) possesses a remarkable combination of attributes: a high electrical conductivity of 180 S/cm, thermal conductivity of 6.0 W/m·K, and excellent EMI SE of 73.5 dB at X-band, along with enhanced compressive strength of 6.5 MPa. Moreover, the fabricated Ag-plated Gr@CFs exhibit outstanding properties that render them well-suited for application in electronic devices requiring EMI shielding and effective thermal management.

Enhancement of growth perfection and optical transmission in rhodamine B-doped KDP single crystal for photonic applications

In recent years, because of the rapid development persisting in the modern electronic industries, materials with the ability to produce highly efficient harmonic generation have acquired great demand as they are suitable for high-speed devices and the progressing field of optical communication systems. The present work reports the growth, diffraction and spectroscopic features of the pure and Rhodamine B (RB)-doped potassium dihydrogen phosphate (KDP) crystals. The crystals were grown by employing the conventional slow evaporation technique. The XRD and UV–visible spectral studies have been carried out to examine the structural and optical behavior of the grown crystals. An optical microscopic technique has been utilized to explore the surface features of the crystals. Based on the growth features and the observed analytical results, it is authenticated that the RB-doped KDP crystal possesses a better crystalline nature and optical transmittance than the pure KDP crystal thereby it is strongly suggested for the applications of photonic devices.

Numerical Study of the Thermal and Hydraulic Characteristics of Plate-Fin Heat Sinks

One of the main trends in the development of the modern electronics industry is the miniaturization of electronic devices and components. Miniature electronic devices require compact cooling systems that can dissipate large amounts of heat in a small space. Researchers are exploring ways to improve the design of the heat sink of the cooling system in such a way that it increases the heat flow while at the same time reducing the size of the heat sink. Researchers have previously proposed different designs for heat sinks with altered fin shapes, perforations, and configurations. However, this approach to optimizing the design of the heat sink results in an increase in the labor intensity of its production. Our goal is to optimize the heat sink design to reduce its size, reduce metal consumption, and increase heat flow. This goal is achieved by changing the number of fins and the distance between them. In this case, there is no significant difference in the geometry of a conventional plate-fin heat sink, and a low labor intensity of production is ensured. A numerical investigation of heat flow and pressure drop in models of plate-fin heat sinks of various sizes and metal volumes was conducted using the ANSYS Fluent software package (v. 19.2) and computational fluid dynamics employing the control volume method. We used the SST k-ω turbulence model for the calculations. The research results showed that by changing the number of fins and the distance between them, it is possible to increase the heat flow from the heat sink to 24.44%, reduce its metal consumption to 6.95%, and reduce its size to 30%. The results of this study may be useful to manufacturers of cooling systems who seek to achieve a balance between the compactness of the heat sink and its ability to remove large amounts of heat.

MOSFET Characteristics and Related Biological Devices Analysis

With the development of modern electronic information technology, portable, fast, and high-performance electronic information products have brought great changes to people's life and health. People pay more and more attention to electronic information products. Not only in the civil aspect, high-end precision electronics industry, such as artificial intelligence, the new generation of electronic communication technology, medical devices, aerospace, and defense fields are based on various chips, to establish a complete national industrial system. This article describes MOSFET basic introduction, working principle and structure, etc., which plays an important role in the modern electronic information industry, including its application in implantable medical devices-current stimulator. The conclusion of this article is that with more and more capital and talent investment, the future of the chip industry with MOSEF as the basic component is very optimistic. The significance of this paper is to introduce the existing MOSFET technology and put forward views for future development.

Promotion by KOL and Acquaintances in Differentiated Products: By the Case of Nintendo Switch

Nintendo, founded in 1889, is a Japanese company mainly engaged in the development of electronic game hardware and software and is the pioneer of the modern electronic game industry. Nintendo Corporation is headquartered in Kyoto City, Japan. Nintendo has sold more than 2 billion copies of its software worldwide, created some of the most famous characters in the history of gaming, such as Mario, and created some of the most classic games in the history of gaming, such as The Legend of Zelda.According to Pu Yamauchi, the head of the game department, it is known that Nintendo strives to be a paradise for game artists. Nintendo believes that people who develop great games should be artists, not technicians, and therefore should be given enough freedom. That's why the Switch is so innovative today. This paper mainly focuses on the analysis of Nintendo's customer characteristics and product characteristics and puts forward corresponding marketing strategies and cures.

(Invited) The Laser-Integrated FIB-SEM for Faster 3D Packages Characterization and Failure Analysis

The semiconductor industry is constantly looking for new technologies and materials to provide more functionality and performance in a smaller volume.Modern innovations in the development of 3D advance packaging require new methods of materials research and failure analysis. Three-dimensional multi-level electronic components, whose packages contain a stack of chips and interconnections, require visualization and analysis of undersurface structures withhigh resolution and performance [2].Modern methods of electron microscopy based on ion beam (FIB-SEM) sample preparation provide a high quality of the cross-sectional surface and accurateinformation about the subsurface structure, however, FIB-SEM does not provide access to deep buried structures and high speed of sample preparation, what is required by the modern electronics industry. A unique solution for cross-sectional access to deeply buried structures is the integration of a laser beam into the FIB-SEM (laser FIB), which provides fast removal of large volumes of material with high speed. Laser FIB provides all advantages of integrates a fs-laser for speed, a Ga+ beam for accuracy, and a SEM for high resolution imaging to enable the fastest workflows. The isolated laser chamber prevents contamination of the electron column and detectors, while ensuring sample integrity with automated transfer between the SEM and laser chamberunder vacuum. Integration of the laser and FIB into a single system, automation of process parameters and laser shuttling and correlative workflows provide the fastest results and highest success rates. Fs-laser ablation is a thermal so the laser affected zone is minimal, and it is often possible to image cross sectional structure immediately after laser ablation, without FIB polishing [1].The latest developments, implemented in the laser-integrated FIB-SEM, such as an automated shuttle, NavCam integration, preset recipes, and the Cross-jet option for cover glass protection, improve the cross-sectioning process and ensure the automation, repeatability, and efficiency of the sample preparation. The combination of batch mode and other parameters of the laser milling process improves the high ablation rate and surface quality, which is especially effective for wide-gap semiconductor cross-sections. A combination of 3D X-ray microscopy (XRM) techniques and integrated laser scanning electron microscopes with a focused ion beam for sample preparation provides a workflow to improve precise targeting for specific analysis of buriedfeatures and correlation with additional equipment to provide subsurface analysis [3]. We describe a workflow using 3D XRM and Laser FIB for precise targeting and high throughput results and demonstrate the application examples. Correlated workflows accelerate results by connecting tools to quickly navigate between multiple length scales and imaging modes.[1] B.Tordoff, C. Hartfield, A. Holwell, S.Hiller, M. Kaestner, S. Kelly, J. Lee, S. Müller, F. Perez-Willard, T.Volkenandt, R. White, T. Rodgers; The LaserFIB: new application opportunities combining a highperformance FIB-SEM with femtosecond laser processing in an integrated second chamber; AppliedMicroscopy 50 (2020), 24.[2] C.Hartfield, W.Harris, A. Gu, M.Terada, V.Viswanathan, L. Jiao and T. Rodgers; Emerging Technologiesfor Advanced 3D Package Characterization to Enable the More-Than-Moore Era; ECS Transactions 109(2022), 15.[3] A. Gu, M. Terada, H. Stegmann, T. Rodgers, C. Fu, Y. Yang; From System to Package to Interconnect:An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package StructuralAnalysis and Correlative Microscopic Failure Analysis; 2022 IEEE International Symposium on thePhysical and Failure Analysis of Integrated Circuits (IPFA) (2022)

Alveoli-Mimetic Synergistic Liquid and Solid Thermal Conductive Interface as a Novel Strategy for Designing High-Performance Thermal Interface Materials.

Thermal interface materials (TIMs) are in desperate desire with the development of the modern electronic industry. An excellent TIM needs desired comprehensive properties including but not limited to high thermal conductivity, low Yong's modulus, lightweight, as well as low price. However, as is typically the case, those properties are naturally contradictory. To tackle such dilemmas, a strategy of construction high-performance TIM inspired by alveoli is proposed. The material design includes the self-alignment of graphite into 3D interconnected thermally conductive networks by polydimethylsiloxane beads (PBs) -the alveoli; and a small amount of liquid metal (LM) - capillary networks bridging the PBs and graphite network. Through the delicate structural regulation and the synergistic effect of the LM and solid graphite filler, superb thermal conductivity (9.98 ± 0.34W m-1 K-1) can be achieved. The light emitting diode (LED) application and their performance in the central processing unit (CPU) heat dispersion manifest the TIM developed in the work has stable thermal conductivity for long-term applications. The thermally conductive, soft, and lightweight composites are believed to be high-performance silicone bases TIMs for advanced electronics.

Electronic Games Feedback Loops: Balanced Design Feedback Loops by Applications of SDT Enhance Players Motivation

In the modern electronic game industry, several key design factors are commonly mentioned and used by general designers. Feedback loops are one of the most popular and necessary techniques that have been used implicitly in game designs and other fields. This research will discuss the connection between the logic behind this technique and some psychological theories, mainly the self-determine theory, which will relate to the effectiveness of generating motivation for users with this technique. With the hypothesis above being proposed, common players reactions toward different examples related to the topic will be collected as direct data from real-life scenarios, which would prove the correctness of this research. Although players have been constantly experiencing positive and negative feedback loops while gaming, this reward system has already become a norm inside video games. The main target for this article is for readers to have a deeper understanding of this system and be able to recognize the importance of their existence in products and their connection to self-determine theory. This paper will also present a framework for creating feedback loops from psychological aspects as a useful tool for readers to utilize.

An effective adaptive iterated greedy algorithm for a cascaded flowshop joint scheduling problem

This paper addresses a novel scheduling problem, namely the cascaded flowshop joint scheduling problem (CFJSP), which has critical applications in the modern electronic information equipment manufacturing industry. The CFJSP is composed of a distributed permutation flowshop scheduling problem and hybrid flowshop scheduling problem. This paper considers how to arrange a variety of jobs for the two flowshops together to minimize total flowtime. We present a mixed integer linear programming mathematical model and an effective adaptive iterated greedy (AIG) algorithm with a decomposition and collaboration mechanism, which optimizes each production phase sequentially and ultimately optimizes the whole process. Combining the problem-specific characteristic, an adaptive inverse bounded heuristic, an adaptive bounded range local search, and an odd/even random insertion reconstruction mechanism are proposed to explore more valuable space. Comprehensive computational experiments and statistical analyses are conducted to verify the effectiveness of the proposed AIG. The experimental results show that the proposed AIG significantly outperforms the state-of-the-art competing algorithms from the literature in relative deviation index values at the same CPU running time.

Non-destructive estimation of conductive network constructed by 1D fillers in polymer composites via small angel X-ray scattering

Efficient and non-destructive estimation of conductive network in conductive polymer composites is now becoming an urgent issue than ever owing to the rapid rise of modern electronic industry. Nevertheless, traditional observation and estimation method inevitably cause damage and distortion to sample, demanding urgent development of a non-destructive fidelity detection methodology. In this study, the degree of network formation of carbon nano-fibers in polymer matrix was calculated based on small-angle X-ray diffraction (SAXS). The degree of fiber network construction based on the power law coefficient (A) has been proved to be valid and effective in comparison with other testing methods. Moreover, a mathematical model was established to predict the electrical conductivity of the conductive polymer composite. This study not only solves the problem of non-destructive testing of fiber network construction, but also provides theoretical guidance for the design of conductive polymer composites.

A highly strong PEDOT modified wood towards efficient electromagnetic interference shielding

In the development of the modern electronics industry, the high mechanical performance, the green, and high-performance electromagnetic interference (EMI) shielding materials need to urgently be developed. Herein, polythiophene/Wood (PEDOT/wood) was fabricated through in situ polymerizing thiophene in the delignified paulownia wood. The results indicated that PEDOT were evenly distributed on the carbohydrates framework of the wood, endowing the composite with a highly electrical conductivity of 112.8 S m−1 and a superior electromagnetic shielding effectiveness of 46.2 dB at 2 mm thickness. The normalized SE (EMI SE/thickness) of the composite calculated as 213 dB/cm. Meanwhile, a high compressive strength and tensile strength of the prepared PEDOT/wood composite were tested as 50.9 MPa and 67.8 MPa, respectively. Such a high conductivity, strong mechanical properties and renewable PEDOT/wood suggests it as a potential candidate for the application in electromagnetic interference shielding and paves a new way for the biomass-based electromagnetic shielding materials.

Optimizing the size distribution of zinc borosilicate glass powder by organic solvent and tetradecylphosphonic based wet milling

Zinc borosilicate glass are crucial adhesive medium in modern electronic industry. However, it is still hard to prepare the zinc borosilicate glass with uniform particle size distribution. Herein, narrow particle size distribution and reduced hemispherical point temperature of zinc borosilicate glass was obtained by choosing low polarity, viscosity and surface tension organic solvent as well as surface modifier in the wet ball milling method. It is found that xylene, ethanol and isopropyl alcohol are good liquid medium for wet ball milling. Moreover, tetradecylphosphonic acid (TDPA) as a surface modifier could effectively reduce the formation of surface hydroxyl group in glass powder by the nucleophilic substitution reaction of the phosphonic acid group, showing superb anti-aggregation properties. Therefore, this work provides a general method for controlling particle size distribution of glass powder.

Probing atomic-scale structure of dielectric ceramics with scanning transmission electron microscopy

High performance dielectric capacitors are ubiquitous components in the modern electronics industry, owing to the highest power density, fastest charge–discharge rates, and long lifetime. However, the wide application of dielectric capacitors is limited owing to the low energy density. Over the past decades, multiscale structures of dielectric ceramics have been extensively explored and many exciting developments have been achieved. Despite the rapid development of energy storage properties, the atomic structure of dielectric materials is rarely investigated. In this paper, we present a brief overview of how scanning transmission electron microscopy (STEM) is used as a tool to elucidate the morphology, local structure heterogeneity, atomic resolution structure phase evolution and the correlation with energy storage properties, which provides a powerful tool for rational design and synergistic optimization.

Cold Sintering Process for a BaTiO3/Poly(vinylidene difluoride) Ceramic-Polymer Composite: Evaluation of the Structural and Microwave Dielectric Properties.

The sintering process is essential to transforming particular material into dense ceramics. Although several sintering techniques have emerged over the past few years, the process is still performed at high temperatures. The alternative cold sintering process (CSP) is a potential strategy for producing an advance high dielectric permittivity and enables densification at low temperature. In this process, the CSP technique has been applied to successfully prepare the BaTiO3/poly(vinylidene difluoride) (PVDF) nanocomposite. The inorganic material of the BaTiO3/PVDF nanocomposite was confirmed by various physical characterizations, and the densification studies were performed using a semiautomated press, indicating a dissolution-precipitation mechanism. When a uniaxial pressure of 350 MPa was applied, with transient liquid could be sintered at 190 °C, and a relative density of 94.8%. The nanocomposite exhibits an excellent dielectric properties like εr = 71.1 and tan δ = 0.04 with frequency range at 1 GHz for various dwelling times and maximize the electrical resistivity. The BaTiO3/PVDF composite indicating a breakthrough opportunity toward an increase of the high dielectric constant will be significantly impacted by cold sintering. It enables innovative materials design and integrated devices to advance modern electronic industry applications.

Mechanically strong, reprocessable and thermally stable PDMS/Hexagonal boron nitride composites with desirable thermal conductivities based on dynamic silyl ether linkages

Reprocessable thermally conductive polymer composites with excellent thermal management performance have become the research hotspot in order to solve the heat dissipation problem of electronic devices and reduce waste of resources. Herein, efficiently reprocessable PDMS/hexagonal boron nitride (h-BN) composites with excellent mechanical properties, thermal stability and desirable thermal conductivity were designed and prepared based on dynamic silyl ether linkages. The tensile strength and toughness of the composites with h-BN content of 28.6 wt% can reach 4.79 MPa and 23.3 MJ/m3, respectively. Moreover, the thermal conductivity of this composites increased by 4.63 times to 0.659 W m−1 K−1 with respect to that without h-BN. More importantly, the reprocessing efficiency of PDMS elastomer can be as high as 100% and is capable of achieving over 94% at containing 28.6 wt% h-BN, mainly due to the intramolecular catalysis of tertiary amine group at the γ-position of silyl ether. Further, the intrinsic excellent heat resistance of matrix is successfully retained and the composites show good adhesion properties on different substrate materials and insulating properties. In a word, the composites with excellent comprehensive performance pave the way for the development of thermal management materials in the modern electronics industry.

Constructing “sesame‐biscuit” structured hybrids with SiC and Ag particles for enhancing thermal conductivity and dielectric constant of elastomer composites

AbstractWith the development of multifunctional and miniaturized integrated circuits, polymeric materials with large dielectric constant and high thermal conductivity have major significance in modern electronic industry. In this work, “sesame‐biscuit” structured thermally conductive hybrids were prepared by polydopamine (PDA) modification and in‐situ electroless silver (Ag) plating on the surface of silicon carbide (SiC), referred as SiC‐P‐Ag. Then, the SiC‐P‐Ag was incorporated into epoxidized natural rubber (ENR) matrix to yield polymeric composites (ENR/SiC‐P‐Ag) with excellent thermal and dielectric properties. It was found that PDA improved the interfacial compatibility and reduced the interface thermal resistance between SiC and ENR matrix. In addition, the formation of heat conduction channels and conductive Ag nanoparticles caused an increase in thermal conductivity of the 50 vol% ENR/SiC‐P‐Ag composite to 0.5655 W/(mK), which was 540% that of the pure ENR (0.1048 W/(mK)). Meanwhile, the 50 vol% ENR/SiC‐P‐Ag composite showed a low AC conductivity of 2.98 × 10−11 S/cm and a high dielectric constant of 35 at 10 Hz. It is noteworthy that this simple and efficient route for preparing ENR/SiC‐P‐Ag composites can also be applied in other fillers for simultaneously enhancing dielectric constant and thermal conductivity of polymeric composites.

Significant enhancement of thermal conductivity and EMI shielding performance in PEI composites via constructing 3D microscopic continuous filler network

Polymer-based composites with effective heat dissipation and ideal electromagnetic interference shielding performance have gradually become an essential research focus in modern electronic industry. Herein, a method is reported by constructing 3D microscope continuous filler network into polyetherimide (PEI) matrix via incorporating function graphite nanoplatelets (GNP) with PEI microspheres, and then fillers are distributed beyond the domain area of polymer and leaded to continuous filler framework. The fabricated composites exhibit effective thermal conductivity (4.77 W m−1K−1), great EMI effectiveness (42.7 dB), ideal electrical conductivity and profound thermal property. Different scale of polymer microspheres will also change the micro-architecture from “filler-wrapped polymer” structure to “polymer-wrapped filler” structure, resulting in various thermal performance and electrical property. Finite element simulation is further employed to explore the relationship between microsphere scale and heat transfer behavior. In a word, great comprehensive performance endows PEI composites broaden prospect on the potential applications in the fields of electronic equipment.