Mutual diffusions between Mo substrate and α-Ti film have great impacts on the performance of metal hydride films. In this study, the diffusion behavior between Mo substrate and α-Ti film during thermal evaporation deposition was investigated in the temperature range of 500–1000 K by both experiment and molecular dynamic simulation. The experimental results show that the coefficient changes abnormally with temperature. The results of SEM, TEM and molecular dynamics simulation indicated that in addition to temperature, grain boundary also has great effects on their mutual diffusion behavior. After taking account of the influence from grain boundary, the mutual diffusion coefficients of simulation and experiment can be well consistent in the whole Mo concentration range, especially in the middle region where Mo concentration is 0.1–0.85. Base on the results obtained, the mutual diffusion coefficients between Mo substrate and α-Ti film are appreciable, which is conducive to the selection of appropriate substrate temperature.
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