Micro-opto-electro-mechanical Research Articles

An Optical Measuring Transducer for a Micro-Opto-Electro-Mechanical Micro-g Accelerometer Based on the Optical Tunneling Effect

Micro-opto-electro-mechanical (MOEM) accelerometers that can measure small accelerations are attracting growing attention thanks to their considerable advantages—such as high sensitivity and immunity to electromagnetic noise—over their rivals. In this treatise, we analyze 12 schemes of MOEM-accelerometers, which include a spring mass and a tunneling-effect-based optical sensing system containing an optical directional coupler consisting of a fixed and a movable waveguide separated by an air gap. The movable waveguide can perform linear and angular movement. In addition, the waveguides can lie in single or different planes. Under acceleration, the schemes feature the following changes to the optical system: gap, coupling length, overlapping area between the movable and fixed waveguides. The schemes with altering coupling lengths feature the lowest sensitivity, yet possess a virtually unlimited dynamic range, which makes them comparable to capacitive transducers. The sensitivity of the scheme depends on the coupling length and amounts to 11.25 × 103 m−1 for a coupling length of 44 μm and 30 × 103 m−1 for a coupling length of 15 μm. The schemes with changing overlapping areas possess moderate sensitivity (1.25 × 106 m−1). The highest sensitivity (above 6.25 × 106 m−1) belongs to the schemes with an altering gap between the waveguides.

Three-Axis Micro-Opto-Electro-Mechanical Angular Velocity Transducer Based on the Optical Tunneling Effect

A three-axis micro-opto-electro-mechanical (MOEM) angular velocity transducer model based on the optical tunneling effect was developed. The transfer function was determined, and the effect of destabilizing factors on the characteristics of the three-axis MOEM angular velocity transducer was evaluated. The dynamic range of the MOEM transducer based on the optical tunneling effect was calculated.

Methods of Expanding the Measurement Range of Micro-Opto-Electro-Mechanical Angular Velocity Transducer

Methods for expanding the measurement range of micro-opto-electro-mechanical (MOEM) angular velocity transducer based on the optical tunneling effect and an algorithm for forming output optical signals are developed. An approximating function of the dependence of the output pulse duration of the MOEM transducer on angular velocity is determined.

Micro-opto-electro-mechanical angular velocity transducer based on the optical tunneling effect

The possibility of designing a micro-opto-electro-mechanical (MOEM) angular velocity transducer based on the optical tunneling effect is discussed. A MOEM transducer model has been developed. Dependences of the output optical power and output voltage on angular velocity have been obtained. The effective measurement range of angular velocities that provides quasilinearity of the transfer function has been determined. The effects of the design parameters of the sensitive element and temperature on the performance of the transducer are analyzed.

Investigation of Microopto-eletromechanical Angular Velocity and Acceleration Transducers based on Optical Tunneling Effect

In this paper the possibility of microopto-electromechanical (MOEM) angular velocity and acceleration transducers based on optical tunneling effect (OTE) is considered. The generalized model of MOEM transducers with various types of sensing elements (SE) is developed, transfer functions are investigated, and the errors with various design parameters of transducers are estimated.

Principle and applications of MEMS: a review

Design for miniaturisation represents a broad research topic with applications in fundamental physics, chemistry, martial science, computing methods, ultra-precision engineering, fabrication technology and micromachining based on the principles, characterisation, modelling, simulation and state-of-the-art technology. This paper presents a review on the research and developmental aspects of Microelectromechanical Systems (MEMS). MEMS is relatively a recent development which can be used in a variety of industrial as well as consumer product applications where IC-based technology fails. The review will enable the readers to understand the underlying technology, philosophy, concepts, ideas and principles including micromanufacturing, lithography, bulk and surface micromachining, microsensors, microactuators, Microopto Electromechanical Systems (MOEMS), RF MEMS, Nanoelectro Mechanical Systems (NEMS), microfluidics and BioMEMS. Aspects of microsystems in terms of design process, practice and techniques are presented.

Design and analysis of an intensity modulated micro-opto-electro-mechanical accelerometer based on nonuniform cantilever beam proof mass

Micro-opto-electro-mechanical (MOEM) accelerometers using principle of optical coupling between two waveguide structures is proposed. It consists of an antiresonant reflecting optical waveguide structure combined with a cantilever beam. Under acceleration, the output waveguide optical power changes, which is a function of acceleration. The mathematical model of the mechanical sensing element in terms of proof mass, damping, and spring constant is formulated. Here, different aspects such as beam deflection, bending stress, and breakdown acceleration are incorporated into the formulation. Based on the analysis, the optimum mechanical structure for intensity modulated MOEM accelerometers are designed. We report for a typical uniform cantiliver beam of type I (3 mm×3 mm×0.38 µm) accelerometer, mechanical sensitivity of 0.15 µm/g, minimum detectable acceleration of 4.7 µg/ at an optimum power of 500 µW, range of ±25 g, a bandwidth of 1.59 kHz, breakdown acceleration of 5.1×104 g and cross-axis sensitivity of 0.001%. The results in the case of nonuinform beam cantiliver accelerations are sensitivity of 2.15 µm/g, minimum detectable acceleration of 0.27 µg/ range of ±1.8 g, bandwidth of 0.411 kHz, breakdown acceleration of 2987 g and cross-axis sensitivity of 0.001%.

Theoretical analysis of integrated collimating waveguide lens

An integrated collimating waveguide lens is analyzed for applications which require the focusing of an optical beam onto the waveguide of a planar lightwave circuit. The lens has a refractive index profile which is parabolically graded as a function of height to focus light in the vertical plane, and has a convex front face to focus light in the horizontal plane. Analysis based on the propagation of a Gaussian field is used to design a lens pair which minimizes the optical loss for a given propagation length. The beam propagation method is used to identify fabrication tolerances which may have impact on the performance of the lens pair. The lens pair has application in micro-optoelectromechanical (MOEM) switches based on planar optical waveguide circuits.

Applications of Silicon-Based Optoelectronics

Silicon-based optoelectronics is a diversified technology that has grown steadily but not exponentially over the past decade. Some applications—such as smart-pixel signal processing and chip-to-chip optical interconnects—have enjoyed impressive growth, whereas other applications have remained quiescent. A few important applications such as optical diagnosis of leaky metal-oxide-semiconductor-field-effect-transistor circuits, have appeared suddenly. Over the years, research and development has unveiled some unique and significant aspects of Si-based optoelectronics. The main limitation of this technology is the lack of practical silicon light sources—Si lasers and efficient Si light-emitting devices (LEDs)—though investigators are “getting close” to the LED.Silicon-based optoelectronics refers to the integration of photonic and electronic components on a Si chip or wafer. The photonics adds value to the electronics, and the electronics offers low-cost mass-production benefits. The electronics includes complementary-metal-oxide semiconductors (CMOS), very large-scale integration (VLSI), bipolar CMOS, SiGe/Si heterojunction bipolar transistors, and heterostructure field-effect transistors. In this discussion, we will use a loose definition of optoelectronics that includes photonic and optoelectronic integrated circuits (PICs and OEICs), Si optical benches, and micro-optoelectromechanical (MOEM) platforms. Optoelectronic chips and platforms are subsystems of computer systems, communication networks, etc. Silicon substrates feature a superior native oxide, in addition to excellent thermal, mechanical, and economic properties. Silicon wafers “shine” as substrates for PICs and OEICs.

Guest Editorial: Special Section on Micro-Opto-Electro-Mechanical Systems

Recent industrial demands in the fields of microsystems and device miniaturization led to development of two major technologies, micro-electro-mechanical (MEM) and micro-optics. A promising team-up of these two technologies combined with microelectronics creates a rich enabling technology of micro-opto-electro-mechanical (MOEM) systems. All constituent technologies in MOEM allow for batch processing and embossing and include a micromachining process that makes them highly fascinating for commercial applications.

Micro-opto-electro-mechanical systems

Micro-optical devices such as diffractive and refractive microlenses fabricated using integrated circuit technology have been highlighted during the past five years. This scientific breakthrough has created a revolution in optical technology. Miniaturizing devices using microoptics promise to revolutionize many electrooptical systems-from video cameras, video phones, and compact disk data storage to robotic vision, optical scanners, and high-definition projection displays. The supporting technologies for these micro-optical systems, such as binary optics and plastic micro-replication, are built on existing or adapted integrated circuit technologies that have been developed over the past five years. In parallel with this optical technology revolution, researchers have also developed another frontier technology called micro-electro-mechanical (MEM). MEM technology has found applications in automotive, machine tools, airbag actuators, and many generic microsensors. Merging microoptics, microelectronics, and micromechanics creates a new and broader class of micro-opto-electro-mechanical (MOEM) devices, which may attract additional industrial demonstrations of commercial devices such as torsional mirrors, laser scanners, optical shutters, and dynamic micromirror displays. Both constituent technologies of MOEM devices have the potential of batch processing and embossed replication, which, again, makes them highly attractive for low-cost commercial applications. Other more complex microsystems that use MOEM devices such as microspectrometers, microinterferometers, and miniature on-machine-inspection subsystems are being investigated. This new technology enables high-performance devices for microsensor systems that are lighter, easier to produce, more efficient, and less expensive than conventional components.