Metal Polishing Research Articles

Gold and Gold Alloys Electropolishing in Choline Chloride-Glycerol Deep Eutectic Solvents

Electropolishing is a finishing technique used to reduce the roughness of metallic surfaces while enhancing their brightness. Based on anodic dissolution, this process enables the treatment of parts with complex geometries and reduces processing time compared to conventional mechanical finishing methods.Concerning precious metals, the use of electrolytes containing cyanides and other toxic compounds reduces EP’s attractiveness from an industrial standpoint. A further challenge lies in the difficulty of dissolving alloy elements in a homogeneous way1. It often requires the adjustment of operating parameters or even of the electrolyte composition for each alloy. In addition, the underlying mechanisms that govern the process are not fully understood, making it more difficult to scale up. As a result, it has become essential to explore high-performance electrolyte solutions while complying with environmental and health safety standards.Deep Eutectic Solvents (DES) are emerging as a good alternative for the chemical2 and electrochemical3 dissolution of metals. Their advantages include an extended electrochemical window compared with aqueous electrolytes, non-toxicity, and moderate cost3,4. They have already demonstrated their effectiveness on a wide selection of metals, including silver5 and copper3, elements often present in gold alloys.This work aims to evaluate the effectiveness of choline chloride-based DESs in the electropolishing process of 18K gold alloys. Their performance will be assessed in terms of roughness reduction, brightness enhancement and color preservation, all characteristics associated with the presence of uniform dissolution. The electrochemical mechanisms involved will also be examined.(1) Rodriguez J. ; Doche M-L ; Hihn J-Y ; Electropolishing of gold and gold alloys in HCl-glycerol-ethanol electrolytes App. Surf. Sci. Adv. 21(2024) 100604 https://doi.org/10.1016/j.apsadv.2024.100604(2) Jenkin, G. R. T.; Al-Bassam, A. Z. M.; Harris, R. C.; Abbott, A. P.; Smith, D. J.; Holwell, D. A.; Chapman, R. J.; Stanley, C. J. The Application of Deep Eutectic Solvent Ionic Liquids for Environmentally-Friendly Dissolution and Recovery of Precious Metals. Miner. Eng. 2016, 87, 18–24. https://doi.org/10.1016/j.mineng.2015.09.026.(3) Lebedeva, O. Metals | Free Full-Text | Advantages of Electrochemical Polishing of Metals and Alloys in Ionic Liquids. Metals 2021. https://doi.org/10.3390/met11060959.(4) Sánchez-Ortiz, W.; Aldana-González, J.; Manh, T. L.; Romero-Romo, M.; Mejía-Caballero, I.; Ramírez-Silva, M. T.; Arce-Estrada, E. M.; Mugica-Álvarez, V.; Palomar-Pardavé, M. A Deep Eutectic Solvent as Leaching Agent and Electrolytic Bath for Silver Recovery from Spent Silver Oxide Batteries. J. Electrochem. Soc. 2021, 168 (1), 016508. https://doi.org/10.1149/1945-7111/abdb01.(5) Loftis, J. D.; Abdel-Fattah, T. M. Nanoscale Electropolishing of High-Purity Silver with a Deep Eutectic Solvent. Colloids Surf. Physicochem. Eng. Asp. 2016, 511, 113–119. https://doi.org/10.1016/j.colsurfa.2016.09.013. Figure 1

Sociodemographic Data and Work-Related Musculoskeletal Symptoms in the Metal Polishing Industry: A Case Study in Central Portugal

The prevalence of work-related musculoskeletal disorders is a red flag in industries and is considered an occupational health issue that affects the operator’s well-being, safety, and health. This study contributes to understanding the impact of Industry 5.0 on the workforce and emphasizes the importance of promoting a safe and healthy working environment. Thus, it focuses on the assessment of anthropometric characteristics and work-related musculoskeletal symptoms in a real industrial environment, specifically in the metal polishing sector of a metallurgical industry in Portugal. The research collected data on physical attributes, health status, and musculoskeletal symptoms using the Portuguese version of the Nordic Musculoskeletal Questionnaire, and incorporated sociodemographic data, including age, gender, and professional status, to provide a comprehensive understanding of the active workforce. The results were analyzed by gender and age clusters and revealed a prevalence of musculoskeletal symptoms, particularly in the spinal column and upper limbs, with a significant impact on the ability to perform work tasks. The need for preventive measures and ergonomic interventions to minimize the high predominance of musculoskeletal symptoms in Portuguese industries is also highlighted to improve the working conditions and enhance the well-being and health of operators.

CMP: Four Decades of Innovation and a Promising Future

The invention of CMP by IBM in 1983 represents an inflection point in the evolution of semiconductors. It was a bold and risky idea to mechanically apply abrasives to the surface of a wafer, but this new process for restoring a wafer to a planar state was the key to continued areal scaling and increased device complexity. Initially applied to a simple application for filling trenches with insulator, the potential of this technique was evident. Through understanding of material properties and subsequent manipulation of slurry chemistry, CMP was applied to enable the more challenging and technically critical processes for Shallow Trench Isolation and Tungsten contacts. The late 1990’s saw the introduction of copper interconnects. IBM was first to market this technology which continues to support conductors down to lines widths on the order of 10 nanometers! The CMP process required for copper interconnects demanded a thorough understanding of the materials present and potential surface phenomena for exploitation. For this need, a new and complex mechanism for copper planarization was invented. Equally challenging was the need for a subsequent non-selective barrier removal step. For this a unique, self-balancing approach was also invented, borrowing some elements from previous STI technology. Device architecture has progressed from planar geometry to FINFETs to Gate All Around, or Nanosheet technology. This evolution has required increasingly more CMP process steps with a concurrent demand for increased process control. Gate height control for Nanosheeets is currently paramount for performance, affected by many CMP steps in the process flow. A typical requirement is less than 1nm added variability per CMP step! Looking forward, CMP continues to be tapped to enable technology evolution. Polish steps are becoming part of the patterning process to enable pitch splitting for upcoming nodes. A VTFET integration approach can enable further area scaling but presents integration challenges; CMP is being asked to enable “third color” schemes for the protection of NFET vs PFET devices which is necessary at various points in the in the VTFET process flow. Heterogeneous Integration is demanding nanometer control of topography across large contact pads and large lateral distances. Finally, extreme scaling is creating fundamental challenges for metal polish at the contact and interconnect levels. CMP tool architecture currently does not provide for control of ambient conditions at the wafer surface during wet transport and post CMP cleaning. Subsequently, unwanted metal dissolution is observed. New tool designs will be needed to control wafer surface conditions, and particularly oxygen exposure through all steps within the CMP tool. This talk is dedicated to the special session in honor of Professor S.V. Babu

Fabrication of low-cost metal polishing machine for preparation of microstructure samples of lightweight alloy and composite material

A metallographic specimen should be performed to determine the microstructure of a material. One of the processes of preparation of metallographic specimen is polishing process. The designing and manufacturing a polishing machine will be very helpful in the process of polishing the metallographic specimen. This apparatus includes a motor, aluminum circular disc, switch and speed controller, and base plate. The polishing machine is constructed from these individual parts. This paper is proposed to design and fabrication a metal polishing machine for laboratory scale. In this paper, several stages of the process are performed, such as designing the model, preparing tools and materials used, making components, assembling and testing the polishing machine. The results obtained are polishing machine that works well and can be used for the metallographic test for students and researchers. It can be concluded that this polishing machine can produce the level of specimen preparation for a metallographic test.

Role of alumina particles in chemical-mechanical synergies in ruthenium polishing

Role of alumina particles in chemical-mechanical synergies in ruthenium polishing

Methemoglobinemia caused by nitrobenzene ingestion treated with methylene blue and ascorbic acid: A case report

Nitrobenzene (NBZ) is a pale-yellow coloured compound, moderately water-soluble oily liquid, and odour similar to bitter almonds. It is commonly used in the manufacture of aniline, benzidine, quinolone, drugs, dyes, solvent in shoe, metal polishes, and in screen printing]. It is a potent oxidizer of the iron moiety of haemoglobin causing methemoglobinemia leading to its inability to transport oxygen. Clinical features of nitrobenzene poisoning include gastric irritation, nausea, vomiting, cyanosis, drowsiness, seizures, coma and finally respiratory failure culminating in death. Intravenous methylene blue and ascorbic acid are commonly used for treatment of significant poisoning.

LASER POLISHING OF ADDITIVELY MANUFACTURED TITANIUM ALLOY IN OPEN AIR ATMOSPHERE

Additive manufacturing has witnessed remarkable growth, transforming the production of intricate geometries. However, post-processing is often required to enhance surface quality and alleviate residual stresses in additively manufactured components. Laser polishing, an advanced technique, efficiently reduces surface roughness in metals. This study stands out by conducting laser polishing without protective gas in an open atmosphere. Results demonstrate that surface roughness can be improved by up to 50% under these conditions. Nevertheless, the process introduces a recast layer with significant oxidation due to atmospheric oxygen, leading to the formation of a Titanium Oxide layer and the development of surface microcracks. As oxidation increases, surface hardness also rises. Achieving high-quality surfaces for additively manufactured Ti alloys in an open atmosphere is attainable, provided vigilant monitoring of oxidation-related challenges. This study reveals the intricate relationship between laser polishing, surface characteristics, and the effects of open-air conditions on Ti-6Al-4V components.

Parameters optimization of electrolytic plasma polishing of austenitic stainless steel and surface performance analysis

Electrolytic plasma polishing is a new type of surface finishing technology, widely used for high-quality polishing of metals and alloys due to its excellent processability. In this paper, the austenitic stainless steel (302) is the processing material, and the electrolyte temperature, electrolyte concentration, voltage, and polishing time are used as influencing factors. The surface roughness of the material is used as the evaluation index for electrolytic plasma polishing experiments. The orthogonal experimental group is designed to obtain the best process parameters of electrolytic plasma polishing through range analysis, and the influence laws of various factors on surface roughness is studied. The property of the polished sample from the aspects of surface morphology, elemental composition, X-ray diffraction analysis, hardness changes, and corrosion resistance are characterized. The experimental results show that the surface profile of the polished sample has better consistency, and overall it is flat and smooth, with the original scratches are completely removed. The surface roughness is significantly reduced from the initial 0.3–0.076 μm. The content of Cr element has increased to a certain extent, while the content of Fe element has decreased, and surface impurities have been removed. There is no phase transition on the surface of the sample, the diffraction peak intensity significantly increases, the half width prominently decreases, the crystalline grain size increases, and the surface hardness decreases. During electrochemical test, the self-corrosion potential increases, the self-corrosion current density decreases, and the corrosion resistance of the sample surface increases.

Deployable optics for the Buccaneer Main Mission (BMM)

AbstractDefence Science and Technology Group (DSTG) is currently preparing for the launch of the Buccaneer Main Mission (BMM) satellite, the successor to the Buccaneer Risk Mitigation Mission (BRMM). BMM hosts a high-frequency (HF) antenna and receiver to contribute to the calibration of the Jindalee Operational Radar Network (JORN). Verification of the successful deployment and stability of the large HF antenna is critical to the success of the mission. A bespoke deployable optics payload has been developed by DSTG to fulfil the dual purpose of direct verification of the deployed state of the HF antenna and capturing images of the Earth through a rotatable, dual-surfaced mirror and a variable-focus liquid lens. The payload advances research at DSTG in several fields of space engineering, including deployable mechanisms, precision actuation devices, radiation-tolerant electronics, advanced metal polishing and optical metrology. This paper discusses the payload design, material selection, trade-offs considered for the deployable optics payload and preliminary test results.

Kinerja Ratio Silika-Cat Dengan Metode Dipcoating Pada Permukaan Logam Untuk Penghambat Laju Korosi

Silica oxide (SiO2) is a chemical compound that can be obtained from the extraction of volcanic ash from Mount Sinabung. Silicon dioxide has the properties of high porosity, high mechanical strength, high thermal stability, large pore surface area, stable surface in acidic media so that it can be applied in the chemical coating field.This research aims to measurement of performance natural silica from volcanic ash of mount Sinabung Indonesia as additives to the paint to inhibit corrosion rate in metal surface. The addition of silica additives to the paint was carried out by dispersing (0; 0.5; 0.75; and 1) g with 10 mL of paint with each composition carried out for 60 minutes. Iron plate in sandpaper with 1500 grid and polished with bludru cloth using autosol metal polish, then coated with paint and a combination of silica-paint through the dipcoating method. The corrosion test was carried out on a corrosive solution of HCl 15% (v/v) and NaCl 3.5% (w/v). The corrosion rate using HCl 15% (v/v) showed C (0,286) mpy, SC1 (0,123) mpy, SC2 (0,149) mpy, SC3 (0,120) mpy. While at 3.5% (w/v) NaCl, namely C (0,282) mpy, SC1 (0,120) mpy, SC2 (0,142) mpy, SC3 (0,098) mpy. Inhibitor efficiency for various variations of silica composition in corrosive HCl 15%(v/v) solution, e.g., SC1 (56,9%), SC2 (47,9%), and SC3 (58,04%). The inhibitor efficiency at various compositions of silica in NaCl 3.5% (w/v) are SC1 (57,44%), SC2 (49%) dan SC3 (65,24%).

Development of a Method for Chemical Polishing of 08Kh18N10 (AISI 304) Stainless Steel with a Nanostructured Medium

Chemical polishing of metals with nanostructured media, such as water-in-oil (w/o) microemulsions, is of interest for improving the procedure of polishing metals with concentrated acids because the etchant (acid) concentration in the microemulsions can be much lower. It was shown that w/o microemulsions in the sodium dodecyl sulfate–1-butanol–kerosene–aqueous HCl system can be used for chemical polishing of 08Kh18N10 (AISI 304) stainless steel. Regions of existence of microemulsion in this system were determined, and conditions of chemical polishing of stainless steel with a sodium dodecyl sulfate microemulsion were chosen. Conditions of cleaning of the surface of a stainless-steel sample after chemical polishing were selected so that to ensure the most complete removal of microemulsion components from the steel surface without changing the surface microrelief.

Polishing of Metal, Foam, and Si-Doped GDP Capsules for Use as ICF Targets

Spherical targets with a smooth uniform surface are required for inertial confinement fusion experiments. This paper examines polishing as a method of decreasing the surface roughness of tungsten (W) capsules, chromium (Cr) capsules, SiCH [Si-doped glow discharge polymer (GDP)] capsules, and GDP-coated General Atomics–Carbon Hydrogen (GA-CH) foam beads. As expected, increasing the time spent polishing metal (W, Cr) capsules corresponded to decreasing roughness. Despite the decrease in overall surface roughness of Cr capsules, defects present in the batch initially were amplified through polishing. For SiCH capsules, increasing polishing time decreased the surface roughness, though the yield of usable capsules was affected by cracks induced through polishing. While polishing results for GDP-coated foam beads did not show consistent decrease in roughness, the polishing process did not result in the collapse of any of the foams, demonstrating the potential for polishing as a method of decreasing roughness.

The Shear Force Law: A Guide to Modeling CMP Removal Rates

A new theory is presented that generalizes the classical version of Preston’s Law in chemical-mechanical planarization (CMP). The approach is motivated by removal rate data that cannot be explained by the classical version. The theory begins by observing that when removal rates are plotted against the measured wafer frictional shear force, the data often lie on or near half-lines that emanate from a common intercept on the removal rate axis. The half-lines have slopes that are indexed by polishing speed. While the common intercept might be interpreted as a static etch rate, evidence suggests that it may be due mainly to compliant pad fragments generated by conditioning. An extension of the new model outside of the experimental design using a Stribeck curve is found to explain the puzzling non-Prestonian removal rate trends. It also suggests an explanation for some frequently observed removal rate pressure thresholds. Finally, the new theory predicts that it is possible to scale the pressure and speed in CMP to obtain a desired scaling of the removal rate without changing the friction coefficient. The approach has been successfully applied to several recent metal and dielectric polishing processes that use a variety of consumables.

The Morbid Symptoms of Capitalist Culture: Stuart Brisley’s Placement with Hille & Co. Furniture Factory (1970–1972)

To compose is to make use of what is known … to unite the parts of a whole.1 (Reyner Banham, Theory and Design in the First Machine Age, 1960) In 1963, Robin Day designed the Q Stak chair for mass production.2 The Q Stak chair was made for optimum functionality equipped with an injected moulded plastic shell supported by a tubular steel frame. Q Stak refers to one of the chair’s most popular assets: it is stackable. Each chair slides perfectly into the next (Fig. 1). The Robin Day Q Stak chair was manufactured at the S. Hille & Co. Furniture Factory (Hille) in London throughout the 1960s/1970s. A single tool at the factory produced 4,000 chairs per week at a rate of 1.5 minutes per shell. Inspired by the prominent modernist architect Le Corbusier, the chair was described as a ‘machine for sitting in’.3 ... In 1970, the Artist Placement Group’s (APG) Barbara Steveni negotiated a placement between Hille and the artist Stuart Brisley. The APG was founded in 1965 by the artists Barbara Steveni, John Latham, Barry Flanagan, David Hall, Anna Ridley, and Jeffrey Shaw. Brisley’s placement was one of more than nineteen placements in industry and government bodies negotiated by the APG throughout the 1970s.4 Through these placements, the APG sought to place a coalition of artists directly into new contexts. During his placement, Brisley chose to observe and work on Hille’s Haverhill metal polishing shop floor, where he collaborated with workers to make a circular sculpture Poly Wheel (1970) (Fig. 4). Poly Wheel was made from 212 tubular steel Robin Day Q Stak chair frames.

Microbiology of an abandoned Pb–Zn mine: Impact on environmental metal contamination

• Hydrozincite exhibits significant control on heavy metal mobility in other abandoned mining sites. • No morphological similarity between biomineralized hydrozincite and hydrozincite in Victoria Mine. • Microbiological effects on metal attenuation and aqueous geochemistry are negligible. • Microbial growth patterns and community structure represent oligotrophic conditions. Large-scale Zn, Pb, Cu, Fe and Ag mining ceased over 70 years ago in the Aran Valley (Catalonia, Spain). Some of the abandoned mining relics (e.g. tunnels, processing facilities and tailings dumps) exhibit elevated concentrations of metals in the associated water systems, thus posing a health risk in the neighboring ecosystem. In this study, the largest underground zinc mine in the area was chosen as a field site to showcase the processes affecting metal mobility in the environment. The precipitation of hydrozincite (Zn 5 (CO 3 ) 2 (OH) 6 ) that occurs along the walls and ground of galleries where water flows serves as a metal (e.g. Zn, Ni, Cd) polishing mechanism. We focus on the microbiology at the site and its potential impact on metal mobility. Microbial DNA was sampled from several locations inside and outside of the mine and subsequently sequenced. This is used to further determine the relative diversity of each community to make comparisons between indoor and outdoor locations. By way of DNA sequencing of local communities, microbial batch experiments, and morphological comparisons to samples known to be a product of biomineralization, it is confirmed that the mineral forms abiotically at the mine. Graphical Abstract. .

A quantitative study of removal mechanism of copper polishing based on a single pad-asperity polishing test

• A new copper removal mechanism regarding external loads and reaction time. • A model for decoupling the chemical and mechanical interactions in copper CMP. • All model parameters can be experimentally calibrated. • The first time to connect chrono-current to passivation layer growth. • A novel method to monitor copper removal rate in CMP in real-time. Continuous requirement for the improvement of chip performance caused an increasing attention on the copper polishing precision. To predict the copper removal rate, it is critical to understand the copper removal mechanism and quantitatively decouple the chemical and mechanical interactions. In this paper, the copper removal mechanism was investigated by a single pad-asperity polishing test with an in situ measurement device, which minimized the effects of random pad-asperity contact states and slurry distribution differences encountered in conventional experiments. Several electrochemical methods were used to monitor the chemical reaction rate and passivation processes, including the chrono-current method, electrochemical impedance spectroscopy (EIS) and X-ray photoelectron spectroscopy (XPS). The results reveal that mechanical action can hardly remove the unreacted copper. The complexing agent can only dissolve the mechanically removed passivation layer rather than dissolve the passivation layer directly. The copper is removed in an alternating process of generation and removal of passivation layers. A model is developed to predict the copper removal depth within 10% error. This research provides a quantitative analysis method for material removal rate of metal polishing. It can answer whether chemical reaction or mechanical action limits the improvement of removal rate or causes the change of removal rate.

Chemical mechanical polishing exploiting metal electrochemical corrosion of single-crystal SiC

A chemical mechanical polishing (CMP) method of single-crystal SiC is proposed based on metal electrochemical corrosion. The oxidation mechanism of SiC by electrochemical corrosion of metals and the mechanism of surface material removal are revealed by corrosion and polishing experiments. The metallic aluminum sheet that is in contact with single-crystal SiC was immersed in sodium sulfate (Na 2 SO 4 ) electrolyte solution, and the morphological and elemental changes of single-crystal SiC surface were examined by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), and X-ray photoelectron spectroscopy (XPS). Then, polishing experiments were conducted on single-crystal SiC using different metal polishing discs and different polishing solutions. The XPS and EDS results show that single-crystal SiC can electrochemically corrode to generate a silica reaction layer. The use of metal polishing discs in CMP significantly improved the material removal rate (MRR) of SiC, with the highest MRR of 1011.43 nm/h for aluminum polishing discs, followed by that for iron polishing discs, and the lowest MRR for copper and alumina ceramic polishing discs. When metal polishing discs were used, the addition of electrolyte solution significantly improved the MRR and reduced the surface roughness of the SiC surface. Polishing with Na 2 SO 4 solution when the polishing disc was aluminum disc, the MRR was higher than that for using deionized water by 105%, and the surface roughness Ra decreased by 37.8% to 2.8 nm. The metal electrochemical corrosion reaction can promote the oxidation of single-crystal SiC and generate a soft SiO 2 reaction layer on the SiC surface, thereby improving the polishing efficiency of single-crystal SiC. • A CMP method of single-crystal SiC is proposed based on metal electrochemical corrosion. • The oxidation mechanism of single-crystal SiC based on metal electrochemical corrosion. was investigated. • The material removal mechanism of CMP exploiting metal electrochemical corrosion of single-crystal SiC was studied.

Electrochemical Polishing: An Effective Strategy for Eliminating Li Dendrites

AbstractDendritic growth of lithium (Li) is well‐known to originate from deposition on rough and inhomogeneous Li‐metal surfaces, and has long been a central problem in charging lithium metal batteries. Herein, a universal strategy is proposed for dendrite suppression by both in situ and ex situ electrochemical polishing of Li metal from the corrosion science perspective. This polishing technique greatly smoothens the surface of the Li and dynamically regenerates a homogeneous solid electrolyte interphase film simultaneously during cell cycling, which suppresses the nucleation sites for dendritic Li and establishes an ideal matrix for even deposition of Li. As a result, the polished Li presents a stable voltage profile and high Li utilization in both the symmetric cells and the full cells coupled with LiNi0.8Co0.1Mn0.1O2 (NCM811) or LiFePO4. The long cycle life of polished Li electrodes clearly demonstrates a uniform dendrite‐free deposition of Li. This strategy shows a new direction to realize a uniform deposition of Li by providing a regenerative homogeneous Li‐surface during repeated cycling.

Electrochemical Polishing of Tungsten: An Investigation of Critical Spatial Frequency and Ultimate Roughness

Electrochemical polishing (ECP) offers incomparable advantages and great potential in metal polishing by surface errors correction. This paper systematically investigates the ultimate roughness and surface errors correction ability of ECP over different spatial frequency ranges. This paper further explores the law of ECP influencing errors at different frequency ranges, proposes and clarifies the concept of critical spatial frequency, and studies the law of polishing parameters affecting critical spatial frequency by using spatial frequency spectrum analysis. The surface roughness evolution and ultimate roughness of ECP were investigated using the surface error filtering method based on the critical spatial frequency. The ultimate roughness of ECP was determined by two different strategies, (i) stepwise polishing and (ii) one-step polishing. In addition, the stepwise polishing was also investigated for any possible inconsistency with one-step polishing on the final surface roughness. As ECP progressed, the optimization speed of surface roughness gradually decreased, and the surface roughness eventually reached a stable limiting value. Further analysis revealed that crystal corrosion is mainly responsible for inhibiting surface roughness optimization.

Metal finishing using manual grinding with lamellar sanding wheels as grinding tools

Flap drums (lamellar sanding wheels) are commercial grinding tools used in machining industrial processes such as metal polishing, deburring, and cleaning. This work presents the behaviour of flap drums in metal finishing using a manual hand-held power tool. Different factors such as material interaction, the volume of material removed, life cycle, wear, and aggressiveness of these abrasive tools were studied to formalise the knowledge related to the influence of grit size in this process. For this purpose, performance tests were carried out with two commercial flap drums, both of the same grit and binder, but different particle sizes, using a manual hand-held power tool. The experiments were carried out on samples of stainless and carbon steel and the performance were measured through the relationship between the mass loss of the sample and tool, as well as its surface roughness. The results allowed understanding of the effectiveness of the tools acting on different materials.